公开(公告)号：US12052815B2

公开(公告)日：2024-07-30

申请号：US18447265

申请日：2023-08-09

Applicant: Unimicron Technology Corp.

Inventor： Chih-Chiang Lu ,  Heng-Ming Nien ,  Ching-Sheng Chen ,  Ching Chang ,  Ming-Ting Chang ,  Chi-Min Chang ,  Shao-Chien Lee ,  Jun-Rui Huang ,  Shih-Lian Cheng

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/16 ,  H05K3/24 ,  H05K3/42 ,  H05K3/46 ,  H05K1/18 ,  H05K3/00

CPC classification number: H05K1/0222 ,  H05K1/113 ,  H05K1/119 ,  H05K3/429 ,  H05K3/462 ,  H05K1/181 ,  H05K3/0094 ,  H05K3/24 ,  H05K2201/10734

Abstract: Provided is a manufacturing method of circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The third substrate has an opening and includes a first dielectric layer. The opening penetrates the third substrate, and the first dielectric layer fills the opening. Multiple conductive structures are formed so that the first substrate, the second substrate, the third substrate, and the fourth substrate are electrically connected through the conductive structures to define a ground path. A conductive via structure is formed to penetrate the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate. The conductive via structure is electrically connected to the first substrate and the fourth substrate to define a signal path, and the ground path surrounds the signal path.

公开(公告)号：US20230389172A1

公开(公告)日：2023-11-30

申请号：US18447265

申请日：2023-08-09

Applicant: Unimicron Technology Corp.

Inventor： Chih-Chiang Lu ,  Heng-Ming Nien ,  Ching-Sheng Chen ,  Ching Chang ,  Ming-Ting Chang ,  Chi-Min Chang ,  Shao-Chien Lee ,  Jun-Rui Huang ,  Shih-Lian Cheng

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/46 ,  H05K3/42

CPC classification number: H05K1/0222 ,  H05K1/113 ,  H05K1/119 ,  H05K3/462 ,  H05K3/429 ,  H05K3/24

Abstract: Provided is a manufacturing method of circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The third substrate has an opening and includes a first dielectric layer. The opening penetrates the third substrate, and the first dielectric layer fills the opening. Multiple conductive structures are formed so that the first substrate, the second substrate, the third substrate, and the fourth substrate are electrically connected through the conductive structures to define a ground path. A conductive via structure is formed to penetrate the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate. The conductive via structure is electrically connected to the first substrate and the fourth substrate to define a signal path, and the ground path surrounds the signal path.

公开(公告)号：US11785707B2

公开(公告)日：2023-10-10

申请号：US17496791

申请日：2021-10-08

Applicant: Unimicron Technology Corp.

Inventor： Chih-Chiang Lu ,  Heng-Ming Nien ,  Ching-Sheng Chen ,  Ching Chang ,  Ming-Ting Chang ,  Chi-Min Chang ,  Shao-Chien Lee ,  Jun-Rui Huang ,  Shih-Lian Cheng

IPC: H05K1/02 ,  H05K1/16 ,  H05K3/24 ,  H05K3/42 ,  H05K3/46 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00

CPC classification number: H05K1/0222 ,  H05K1/113 ,  H05K1/119 ,  H05K3/429 ,  H05K3/462 ,  H05K1/181 ,  H05K3/0094 ,  H05K3/24 ,  H05K2201/10734

Abstract: Provided is a circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The second substrate is disposed between the first substrate and the third substrate. The third substrate is disposed between the second substrate and the fourth substrate. The third substrate has an opening penetrating the third substrate and includes a first dielectric layer filling the opening. The conductive via structure penetrates the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate, and is electrically connected to the first substrate and the fourth substrate to define a signal path. The first substrate, the second substrate, the third substrate and the fourth substrate are electrically connected through the conductive structures to define a ground path, and the ground path surrounds the signal path.

公开(公告)号：US20220232694A1

公开(公告)日：2022-07-21

申请号：US17496791

申请日：2021-10-08

Applicant: Unimicron Technology Corp.

Inventor： Chih-Chiang Lu ,  Heng-Ming Nien ,  Ching-Sheng Chen ,  Ching Chang ,  Ming-Ting Chang ,  Chi-Min Chang ,  Shao-Chien Lee ,  Jun-Rui Huang ,  Shih-Lian Cheng

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/46 ,  H05K3/42

Abstract: Provided is a circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The second substrate is disposed between the first substrate and the third substrate. The third substrate is disposed between the second substrate and the fourth substrate. The third substrate has an opening penetrating the third substrate and includes a first dielectric layer filling the opening. The conductive via structure penetrates the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate, and is electrically connected to the first substrate and the fourth substrate to define a signal path. The first substrate, the second substrate, the third substrate and the fourth substrate are electrically connected through the conductive structures to define a ground path, and the ground path surrounds the signal path.