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公开(公告)号：US20220232694A1
公开(公告)日：2022-07-21
申请号：US17496791
申请日：2021-10-08
Applicant: Unimicron Technology Corp.
Inventor： Chih-Chiang Lu , Heng-Ming Nien , Ching-Sheng Chen , Ching Chang , Ming-Ting Chang , Chi-Min Chang , Shao-Chien Lee , Jun-Rui Huang , Shih-Lian Cheng
Abstract: Provided is a circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The second substrate is disposed between the first substrate and the third substrate. The third substrate is disposed between the second substrate and the fourth substrate. The third substrate has an opening penetrating the third substrate and includes a first dielectric layer filling the opening. The conductive via structure penetrates the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate, and is electrically connected to the first substrate and the fourth substrate to define a signal path. The first substrate, the second substrate, the third substrate and the fourth substrate are electrically connected through the conductive structures to define a ground path, and the ground path surrounds the signal path.
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公开(公告)号：US11859302B2
公开(公告)日：2024-01-02
申请号：US17705405
申请日：2022-03-28
Applicant: Unimicron Technology Corp.
Inventor： Heng-Ming Nien , Chih-Chiang Lu , Chih-Kai Chan , Shih-Lian Cheng
Abstract: An electroplating apparatus includes an anode and a cathode, a power supply, a regulating plate, and a controller. The power supply is electrically connected to the anode and the cathode. The regulating plate is disposed between the anode and the cathode. The regulating plate includes an insulation grid plate and a plurality of wires. The controller is electrically connected to the plurality of wires to control a state of an electromagnetic field around the plurality of wires. An electroplating method is also provided.
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公开(公告)号：US20230120741A1
公开(公告)日：2023-04-20
申请号：US17700531
申请日：2022-03-22
Applicant: Unimicron Technology Corp.
Inventor： Heng-Ming Nien , Cho-Ying Wu , Shih-Lian Cheng
Abstract: Provided is an electroplating apparatus including an electroplating tank, an anode and a cathode, a power supply, and a regulating plate. The electroplating tank accommodates electrolyte. Both the anode and the cathode are disposed in the electroplating tank. The power supply is electrically connected to the anode and the cathode. The regulating plate is disposed between the anode and the cathode. The regulating plate includes a plurality of mesh openings and a plurality of metal sheets, and at least part of the metal sheets is electrically connected with the cathode. An electroplating method is also provided.
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公开(公告)号：US11792918B2
公开(公告)日：2023-10-17
申请号：US17455918
申请日：2021-11-21
Applicant: Unimicron Technology Corp.
Inventor： Pei-Wei Wang , Heng-Ming Nien , Ching-Sheng Chen , Yi-Pin Lin , Shih-Liang Cheng
CPC classification number: H05K1/024 , H05K1/0222 , H05K1/112
Abstract: A co-axial structure includes a substrate, a first conductive structure, a second conductive structure, and an insulating layer. The substrate includes a first surface. The first conductive structure includes a first circuit deposited on the first surface and a first via penetrating the substrate. The second conductive structure includes a second circuit deposited on the first surface and a second via penetrating the substrate. The first via and the second via extend along a first direction. The first circuit and the second circuit extend along a second direction, and the second direction is perpendicular to the first direction. The insulating layer is located between the first via and the second via. The insulating layer includes a filler. The first conductive structure and the second conductive structure are electrically insulated. The first circuit and the second circuit are coplanar.
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公开(公告)号：US20230124913A1
公开(公告)日：2023-04-20
申请号：US17705405
申请日：2022-03-28
Applicant: Unimicron Technology Corp.
Inventor： Heng-Ming Nien , Chih-Chiang Lu , Chih-Kai Chan , Shih-Lian Cheng
Abstract: An electroplating apparatus includes an anode and a cathode, a power supply, a regulating plate, and a controller. The power supply is electrically connected to the anode and the cathode. The regulating plate is disposed between the anode and the cathode. The regulating plate includes an insulation grid plate and a plurality of wires. The controller is electrically connected to the plurality of wires to control a state of an electromagnetic field around the plurality of wires. An electroplating method is also provided.
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Patent Agency Ranking
公开(公告)号：US20230124732A1
公开(公告)日：2023-04-20
申请号：US17745809
申请日：2022-05-16
Applicant: Unimicron Technology Corp.
Inventor： Heng-Ming Nien , Chih-Chiang Lu , Cho-Ying Wu , Shih-Lian Cheng
IPC: C25D5/00
Abstract: An electroplating apparatus including an anode and a cathode, a power supply, and a regulating plate is provided. The power supply is electrically connected to the anode and the cathode. The regulating plate is arranged between the anode and the cathode. The regulating plate includes an insulating grid plate and a plurality of magnetic components. The plurality of magnetic components are uniformly and randomly arranged on the insulating grid plate. An electroplating method is also provided.
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公开(公告)号：US12052815B2
公开(公告)日：2024-07-30
申请号：US18447265
申请日：2023-08-09
Applicant: Unimicron Technology Corp.
Inventor： Chih-Chiang Lu , Heng-Ming Nien , Ching-Sheng Chen , Ching Chang , Ming-Ting Chang , Chi-Min Chang , Shao-Chien Lee , Jun-Rui Huang , Shih-Lian Cheng
CPC classification number: H05K1/0222 , H05K1/113 , H05K1/119 , H05K3/429 , H05K3/462 , H05K1/181 , H05K3/0094 , H05K3/24 , H05K2201/10734
Abstract: Provided is a manufacturing method of circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The third substrate has an opening and includes a first dielectric layer. The opening penetrates the third substrate, and the first dielectric layer fills the opening. Multiple conductive structures are formed so that the first substrate, the second substrate, the third substrate, and the fourth substrate are electrically connected through the conductive structures to define a ground path. A conductive via structure is formed to penetrate the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate. The conductive via structure is electrically connected to the first substrate and the fourth substrate to define a signal path, and the ground path surrounds the signal path.
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公开(公告)号：US20230389172A1
公开(公告)日：2023-11-30
申请号：US18447265
申请日：2023-08-09
Applicant: Unimicron Technology Corp.
Inventor： Chih-Chiang Lu , Heng-Ming Nien , Ching-Sheng Chen , Ching Chang , Ming-Ting Chang , Chi-Min Chang , Shao-Chien Lee , Jun-Rui Huang , Shih-Lian Cheng
Abstract: Provided is a manufacturing method of circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The third substrate has an opening and includes a first dielectric layer. The opening penetrates the third substrate, and the first dielectric layer fills the opening. Multiple conductive structures are formed so that the first substrate, the second substrate, the third substrate, and the fourth substrate are electrically connected through the conductive structures to define a ground path. A conductive via structure is formed to penetrate the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate. The conductive via structure is electrically connected to the first substrate and the fourth substrate to define a signal path, and the ground path surrounds the signal path.
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公开(公告)号：US11785707B2
公开(公告)日：2023-10-10
申请号：US17496791
申请日：2021-10-08
Applicant: Unimicron Technology Corp.
Inventor： Chih-Chiang Lu , Heng-Ming Nien , Ching-Sheng Chen , Ching Chang , Ming-Ting Chang , Chi-Min Chang , Shao-Chien Lee , Jun-Rui Huang , Shih-Lian Cheng
CPC classification number: H05K1/0222 , H05K1/113 , H05K1/119 , H05K3/429 , H05K3/462 , H05K1/181 , H05K3/0094 , H05K3/24 , H05K2201/10734
Abstract: Provided is a circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The second substrate is disposed between the first substrate and the third substrate. The third substrate is disposed between the second substrate and the fourth substrate. The third substrate has an opening penetrating the third substrate and includes a first dielectric layer filling the opening. The conductive via structure penetrates the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate, and is electrically connected to the first substrate and the fourth substrate to define a signal path. The first substrate, the second substrate, the third substrate and the fourth substrate are electrically connected through the conductive structures to define a ground path, and the ground path surrounds the signal path.
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公开(公告)号：US11686008B2
公开(公告)日：2023-06-27
申请号：US17745809
申请日：2022-05-16
Applicant: Unimicron Technology Corp.
Inventor： Heng-Ming Nien , Chih-Chiang Lu , Cho-Ying Wu , Shih-Lian Cheng
CPC classification number: C25D5/007 , C25D17/007
Abstract: An electroplating apparatus including an anode and a cathode, a power supply, and a regulating plate is provided. The power supply is electrically connected to the anode and the cathode. The regulating plate is arranged between the anode and the cathode. The regulating plate includes an insulating grid plate and a plurality of magnetic components. The plurality of magnetic components are uniformly and randomly arranged on the insulating grid plate. An electroplating method is also provided.
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