-
公开(公告)号：US11737209B2
公开(公告)日：2023-08-22
申请号：US17574551
申请日：2022-01-13
Applicant: Unimicron Technology Corp.
Inventor： Chih-Chiang Lu , Chi-Min Chang , Shao-Chien Lee , Jun-Rui Huang , Ming-Ting Chang
CPC classification number: H05K1/024 , H05K1/115 , H05K3/0011 , H05K3/10 , H05K3/42 , H05K3/4602 , H05K2201/0183 , H05K2201/09209 , H05K2203/0502
Abstract: A circuit board includes a first dielectric material, a second dielectric material, a third dielectric material, a first external circuit layer, a second external circuit layer, multiple conductive structures, and a conductive via structure. Dielectric constants of the first, the second and the third dielectric materials are different. The first and the second external circuit layers are respectively disposed on the first and the third dielectric materials. The conductive via structure at least penetrates the first and the second dielectric materials and is electrically connected to the first and the second external circuit layers to define a signal path. The conductive structures are electrically connected to each other and surround the first, the second and the third dielectric materials. The conductive structures are electrically connected to the first and the second external circuit layers to define a ground path surrounding the signal path.
-
Patent Agency Ranking
公开(公告)号：US20220232694A1
公开(公告)日：2022-07-21
申请号：US17496791
申请日：2021-10-08
Applicant: Unimicron Technology Corp.
Inventor： Chih-Chiang Lu , Heng-Ming Nien , Ching-Sheng Chen , Ching Chang , Ming-Ting Chang , Chi-Min Chang , Shao-Chien Lee , Jun-Rui Huang , Shih-Lian Cheng
Abstract: Provided is a circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The second substrate is disposed between the first substrate and the third substrate. The third substrate is disposed between the second substrate and the fourth substrate. The third substrate has an opening penetrating the third substrate and includes a first dielectric layer filling the opening. The conductive via structure penetrates the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate, and is electrically connected to the first substrate and the fourth substrate to define a signal path. The first substrate, the second substrate, the third substrate and the fourth substrate are electrically connected through the conductive structures to define a ground path, and the ground path surrounds the signal path.
-
公开(公告)号：US20220240369A1
公开(公告)日：2022-07-28
申请号：US17574551
申请日：2022-01-13
Applicant: Unimicron Technology Corp.
Inventor： Chih-Chiang Lu , Chi-Min Chang , Shao-Chien Lee , Jun-Rui Huang , Ming-Ting Chang
Abstract: A circuit board includes a first dielectric material, a second dielectric material, a third dielectric material, a first external circuit layer, a second external circuit layer, multiple conductive structures, and a conductive via structure. Dielectric constants of the first, the second and the third dielectric materials are different. The first and the second external circuit layers are respectively disposed on the first and the third dielectric materials. The conductive via structure at least penetrates the first and the second dielectric materials and is electrically connected to the first and the second external circuit layers to define a signal path. The conductive structures are electrically connected to each other and surround the first, the second and the third dielectric materials. The conductive structures are electrically connected to the first and the second external circuit layers to define a ground path surrounding the signal path.
-
公开(公告)号：US12052815B2
公开(公告)日：2024-07-30
申请号：US18447265
申请日：2023-08-09
Applicant: Unimicron Technology Corp.
Inventor： Chih-Chiang Lu , Heng-Ming Nien , Ching-Sheng Chen , Ching Chang , Ming-Ting Chang , Chi-Min Chang , Shao-Chien Lee , Jun-Rui Huang , Shih-Lian Cheng
CPC classification number: H05K1/0222 , H05K1/113 , H05K1/119 , H05K3/429 , H05K3/462 , H05K1/181 , H05K3/0094 , H05K3/24 , H05K2201/10734
Abstract: Provided is a manufacturing method of circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The third substrate has an opening and includes a first dielectric layer. The opening penetrates the third substrate, and the first dielectric layer fills the opening. Multiple conductive structures are formed so that the first substrate, the second substrate, the third substrate, and the fourth substrate are electrically connected through the conductive structures to define a ground path. A conductive via structure is formed to penetrate the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate. The conductive via structure is electrically connected to the first substrate and the fourth substrate to define a signal path, and the ground path surrounds the signal path.
-
公开(公告)号：US20230389172A1
公开(公告)日：2023-11-30
申请号：US18447265
申请日：2023-08-09
Applicant: Unimicron Technology Corp.
Inventor： Chih-Chiang Lu , Heng-Ming Nien , Ching-Sheng Chen , Ching Chang , Ming-Ting Chang , Chi-Min Chang , Shao-Chien Lee , Jun-Rui Huang , Shih-Lian Cheng
Abstract: Provided is a manufacturing method of circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The third substrate has an opening and includes a first dielectric layer. The opening penetrates the third substrate, and the first dielectric layer fills the opening. Multiple conductive structures are formed so that the first substrate, the second substrate, the third substrate, and the fourth substrate are electrically connected through the conductive structures to define a ground path. A conductive via structure is formed to penetrate the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate. The conductive via structure is electrically connected to the first substrate and the fourth substrate to define a signal path, and the ground path surrounds the signal path.
-
公开(公告)号：US11785707B2
公开(公告)日：2023-10-10
申请号：US17496791
申请日：2021-10-08
Applicant: Unimicron Technology Corp.
Inventor： Chih-Chiang Lu , Heng-Ming Nien , Ching-Sheng Chen , Ching Chang , Ming-Ting Chang , Chi-Min Chang , Shao-Chien Lee , Jun-Rui Huang , Shih-Lian Cheng
CPC classification number: H05K1/0222 , H05K1/113 , H05K1/119 , H05K3/429 , H05K3/462 , H05K1/181 , H05K3/0094 , H05K3/24 , H05K2201/10734
Abstract: Provided is a circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The second substrate is disposed between the first substrate and the third substrate. The third substrate is disposed between the second substrate and the fourth substrate. The third substrate has an opening penetrating the third substrate and includes a first dielectric layer filling the opening. The conductive via structure penetrates the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate, and is electrically connected to the first substrate and the fourth substrate to define a signal path. The first substrate, the second substrate, the third substrate and the fourth substrate are electrically connected through the conductive structures to define a ground path, and the ground path surrounds the signal path.
-
-
-
-
-
Search Results
6
records
(took 0.04 seconds)
