公开(公告)号：US20200266181A1

公开(公告)日：2020-08-20

申请号：US16869595

申请日：2020-05-08

Applicant: Unimicron Technology Corp.

Inventor： Wei-Ti Lin ,  Chun-Hsien Chien ,  Fu-Yang Chen

IPC: H01L25/16 ,  H01L23/00 ,  H01L25/075 ,  H01L33/62

Abstract: A manufacturing method of the light-emitting diode package structure is provided. A carrier is formed. The carrier comprises a first build-up circuit. At least one self-assembled material layer is formed on the first build-up circuit. A first solder mask layer is formed on the first build-up circuit. The first solder mask layer has at least one opening to expose a portion of the at least one self-assembled material layer. At least one light-emitting diode is disposed on the first build-up circuit. The at least one light-emitting diode has a self-assembled pattern, and the at least one light-emitting diode is self-assembled into the at least one opening of the first solder mask layer through a force between the self-assembled pattern and the at least one self-assembled material layer.

公开(公告)号：US10886264B2

公开(公告)日：2021-01-05

申请号：US16869595

申请日：2020-05-08

Applicant: Unimicron Technology Corp.

Inventor： Wei-Ti Lin ,  Chun-Hsien Chien ,  Fu-Yang Chen

IPC: H01L25/16 ,  H01L23/00 ,  H01L25/075 ,  H01L33/62

Abstract: A manufacturing method of the light-emitting diode package structure is provided. A carrier is formed. The carrier comprises a first build-up circuit. At least one self-assembled material layer is formed on the first build-up circuit. A first solder mask layer is formed on the first build-up circuit. The first solder mask layer has at least one opening to expose a portion of the at least one self-assembled material layer. At least one light-emitting diode is disposed on the first build-up circuit. The at least one light-emitting diode has a self-assembled pattern, and the at least one light-emitting diode is self-assembled into the at least one opening of the first solder mask layer through a force between the self-assembled pattern and the at least one self-assembled material layer.

公开(公告)号：US10700049B2

公开(公告)日：2020-06-30

申请号：US16161080

申请日：2018-10-16

Applicant: Unimicron Technology Corp.

Inventor： Wei-Ti Lin ,  Chun-Hsien Chien ,  Fu-Yang Chen

IPC: H01L25/16 ,  H01L23/00 ,  H01L25/075 ,  H01L33/62

Abstract: A light-emitting diode package structure includes a carrier, at least one self-assembled material layer, a first solder mask layer, and at least one light-emitting diode. The carrier includes a first build-up circuit. The self-assembled material layer is disposed on the first build-up circuit. The first solder mask layer is disposed on the first build-up circuit. The first solder mask layer has at least one opening to expose a portion of the self-assembled material layer. The light-emitting diode is disposed on the first build-up circuit. The light-emitting diode has a self-assembled pattern. The light-emitting diode is self-assembled into the opening of the first solder mask layer through a force between the self-assembled pattern and the self-assembled material layer. A manufacturing method of the light-emitting diode package structure is also provided.

公开(公告)号：US20210282277A1

公开(公告)日：2021-09-09

申请号：US17315357

申请日：2021-05-10

Applicant: Unimicron Technology Corp.

Inventor： Wei-Ti Lin ,  Chun-Hsien Chien ,  Fu-Yang Chen

IPC: H05K3/46 ,  H05K3/00 ,  H05K3/40 ,  H05K1/11

Abstract: A circuit carrier board includes a first substrate and a second substrate bonding to the first substrate. The first substrate includes a first circuit layer connecting to a plurality of conductive structure. The conductive structures connect to electronic elements. The second substrate contacts the first circuit layer. The second substrate includes a plurality of stacked dielectric layers, and a plurality of second circuit layers are disposed in the dielectric layers. The bottommost layer of the second circuit layers is exposed outside of the dielectric layers, and the topmost layer of the second circuit layers is electrically connected to the first circuit layer. The conductive structure includes a pad and a conductive via. The pad electrically connects to the first circuit layer. A linewidth of the first circuit layer is smaller than a linewidth of the second circuit layer. A manufacturing method of the circuit carrier board is also provided.

公开(公告)号：US11032917B2

公开(公告)日：2021-06-08

申请号：US16503500

申请日：2019-07-04

Applicant: Unimicron Technology Corp.

Inventor： Wei-Ti Lin ,  Chun-Hsien Chien ,  Fu-Yang Chen

IPC: H05K7/10 ,  H05K3/46 ,  H05K3/00 ,  H05K3/40 ,  H05K1/11

Abstract: A circuit carrier board includes a first substrate and a second substrate bonding to the first substrate. The first substrate includes a first circuit layer connecting to a plurality of conductive structure. The conductive structures connect to electronic elements. The second substrate contacts the first circuit layer. The second substrate includes a plurality of stacked dielectric layers, and a plurality of second circuit layers are disposed in the dielectric layers. The bottommost layer of the second circuit layers is exposed outside of the dielectric layers, and the topmost layer of the second circuit layers is electrically connected to the first circuit layer. The conductive structure includes a pad and a conductive via. The pad electrically connects to the first circuit layer. A linewidth of the first circuit layer is smaller than a linewidth of the second circuit layer. A manufacturing method of the circuit carrier board is also provided.

公开(公告)号：US20210057320A1

公开(公告)日：2021-02-25

申请号：US16690143

申请日：2019-11-21

Applicant: Unimicron Technology Corp.

Inventor： Fu-Yang Chen ,  Chun-Hsien Chien ,  Cheng-Hui Wu ,  Wei-Ti Lin

IPC: H01L23/498 ,  H01L21/48

Abstract: A method of preparing a package structure is provided, which includes providing a carrier plate including a supporting layer, a first release layer, and a first metal layer; forming a first dielectric layer over the first metal layer, the first dielectric layer having a plurality of holes, each of the holes having an end portion substantially coplanar with each other at a same plane; forming a plurality of conductive protrusions filling the holes, each of the conductive protrusions having a first end and a second end opposite thereto; forming a circuit layer structure including at least one circuit layer and at least one second dielectric layer, the circuit layer being connected to the second end, the second dielectric layer being disposed over the circuit layer; removing the carrier plate; and removing a portion of the first dielectric layer to expose the conductive protrusions. A package structure is also provided.

公开(公告)号：US20200075564A1

公开(公告)日：2020-03-05

申请号：US16161080

申请日：2018-10-16

Applicant: Unimicron Technology Corp.

Inventor： Wei-Ti Lin ,  Chun-Hsien Chien ,  Fu-Yang Chen

IPC: H01L25/16 ,  H01L25/075 ,  H01L33/62 ,  H01L23/00

Abstract: A light-emitting diode package structure includes a carrier, at least one self-assembled material layer, a first solder mask layer, and at least one light-emitting diode. The carrier includes a first build-up circuit. The self-assembled material layer is disposed on the first build-up circuit. The first solder mask layer is disposed on the first build-up circuit. The first solder mask layer has at least one opening to expose a portion of the self-assembled material layer. The light-emitting diode is disposed on the first build-up circuit. The light-emitting diode has a self-assembled pattern. The light-emitting diode is self-assembled into the opening of the first solder mask layer through a force between the self-assembled pattern and the self-assembled material layer. A manufacturing method of the light-emitting diode package structure is also provided.

公开(公告)号：US11678441B2

公开(公告)日：2023-06-13

申请号：US16950910

申请日：2020-11-18

Applicant: Unimicron Technology Corp.

Inventor： Wei-Ti Lin ,  Chun-Hsien Chien ,  Chien-Chou Chen ,  Fu-Yang Chen ,  Ra-Min Tain

IPC: H05K3/46 ,  H05K3/40 ,  H05K3/42 ,  H05K3/28 ,  H05K3/30 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00

CPC classification number: H05K3/4644 ,  H05K1/111 ,  H05K1/115 ,  H05K1/181 ,  H05K3/007 ,  H05K3/0097 ,  H05K3/28 ,  H05K3/303 ,  H05K3/4007 ,  H05K3/421 ,  H05K3/429 ,  H05K2201/09136 ,  H05K2201/09509 ,  H05K2201/09827 ,  H05K2201/10234 ,  H05K2201/10522

Abstract: A circuit carrier board structure includes a first substrate, a second substrate, an adhesive layer, and a plurality of contact pads. The first substrate includes a first surface and a second surface, and also includes a plurality of first build-up layers sequentially stacked. The first build-up layers include a first dielectric layer and a first circuit layer. The second substrate includes a third surface and a fourth surface, and also includes a plurality of second build-up layers sequentially stacked. The second build-up layers include a second dielectric layer and a second circuit layer. The second surface is combined to the third surface. The connection pads are on the first surface and electrically connected to the first circuit layer. The first substrate is electrically connected to the second substrate. A manufacturing method of the circuit carrier board structure is also provided.

公开(公告)号：US11037869B2

公开(公告)日：2021-06-15

申请号：US16690143

申请日：2019-11-21

Applicant: Unimicron Technology Corp.

Inventor： Fu-Yang Chen ,  Chun-Hsien Chien ,  Cheng-Hui Wu ,  Wei-Ti Lin

IPC: H01L21/48 ,  H01L23/498

Abstract: A method of preparing a package structure is provided, which includes providing a carrier plate including a supporting layer, a first release layer, and a first metal layer; forming a first dielectric layer over the first metal layer, the first dielectric layer having a plurality of holes, each of the holes having an end portion substantially coplanar with each other at a same plane; forming a plurality of conductive protrusions filling the holes, each of the conductive protrusions having a first end and a second end opposite thereto; forming a circuit layer structure including at least one circuit layer and at least one second dielectric layer, the circuit layer being connected to the second end, the second dielectric layer being disposed over the circuit layer; removing the carrier plate; and removing a portion of the first dielectric layer to expose the conductive protrusions. A package structure is also provided.

公开(公告)号：US20200075711A1

公开(公告)日：2020-03-05

申请号：US16159726

申请日：2018-10-15

Applicant: Unimicron Technology Corp.

Inventor： Yu-Hua Chen ,  Fu-Yang Chen ,  Chun-Hsien Chien ,  Chien-Chou Chen ,  Wei-Ti Lin

IPC: H01L49/02 ,  H01L23/522 ,  H01L23/532 ,  H01L23/15 ,  H01L23/498

Abstract: A manufacturing method of a substrate structure includes the following steps. A first build-up circuit structure is formed. At least one copper pillar is formed on the first build-up circuit structure. A dielectric layer is formed on the first build-up circuit structure, and the dielectric layer wraps the copper pillar. A second build-up circuit structure and a capacitive element are formed on the dielectric layer. In particular, the second build-up circuit structure and the first build-up circuit structure are respectively located at two opposite sides of the dielectric layer. The capacitive element is disposed in a capacitive element setting region within the second build-up circuit structure. The copper pillar penetrates the dielectric layer and is electrically connected to the second build-up circuit structure and the first build-up circuit structure. A substrate structure obtained by the manufacturing method of the substrate structure is provided.