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Patent Agency Ranking
公开(公告)号：US20230262880A1
公开(公告)日：2023-08-17
申请号：US18162713
申请日：2023-02-01
Applicant: Unimicron Technology Corp.
Inventor： Chih-Chiang Lu , Jun-Rui Huang , Ming-Hao Wu , Tung-Chang Lin
CPC classification number: H05K1/025 , H05K1/112 , H05K1/0216 , H05K2201/095
Abstract: Provided is a circuit board structure including a substrate, a loop-wrapping ground layer, an insulating structure, a first build-up layer, a top wiring layer, a bottom wiring layer, a first conductive via, and a plurality of second conductive vias. The aforementioned structure defines a signal transmitting structure. An equivalent circuit of the signal transmitting structure at least includes a first equivalent circuit, a second equivalent circuit, a third equivalent circuit and a fourth equivalent circuit, which correspond to different uniform transmitting sections respectively. The first equivalent circuit, the second equivalent circuit, the third equivalent circuit and the fourth equivalent circuit are connected in series with each other according to an ABCD transmission matrix series connection principle.
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公开(公告)号：US12256488B2
公开(公告)日：2025-03-18
申请号：US18162713
申请日：2023-02-01
Applicant: Unimicron Technology Corp.
Inventor： Chih-Chiang Lu , Jun-Rui Huang , Ming-Hao Wu , Tung-Chang Lin
Abstract: Provided is a circuit board structure including a substrate, a loop-wrapping ground layer, an insulating structure, a first build-up layer, a top wiring layer, a bottom wiring layer, a first conductive via, and a plurality of second conductive vias. The aforementioned structure defines a signal transmitting structure. An equivalent circuit of the signal transmitting structure at least includes a first equivalent circuit, a second equivalent circuit, a third equivalent circuit and a fourth equivalent circuit, which correspond to different uniform transmitting sections respectively. The first equivalent circuit, the second equivalent circuit, the third equivalent circuit and the fourth equivalent circuit are connected in series with each other according to an ABCD transmission matrix series connection principle.
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公开(公告)号：US20230262893A1
公开(公告)日：2023-08-17
申请号：US17894128
申请日：2022-08-23
Applicant: Unimicron Technology Corp.
Inventor： Chih-Chiang Lu , Jun-Rui Huang , Ming-Hao Wu , Yi-Pin Lin , Tung-Chang Lin
CPC classification number: H05K1/116 , H05K3/4644 , H05K3/0094 , H05K1/024 , H05K3/4038 , H05K2201/0187
Abstract: A circuit board, including a first dielectric material, a second dielectric material, a third dielectric material, a fourth dielectric material, a first external circuit layer, a second external circuit layer, a conductive structure, a first conductive via, and multiple second conductive vias, is provided. The first conductive via at least passes through the first dielectric material and the fourth dielectric material, and is electrically connected to the first external circuit layer and the second external circuit layer to define a signal path. The second conductive vias pass through the first dielectric material, the second dielectric material, the third dielectric material, and a part of the conductive structure, and surround the first conductive via. The second conductive vias are electrically connected to the first external circuit layer, the conductive structure, and the second external circuit layer to define a ground path, and the ground path surrounds the signal path.
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公开(公告)号：US20230262890A1
公开(公告)日：2023-08-17
申请号：US17938977
申请日：2022-09-07
Applicant: Unimicron Technology Corp.
Inventor： Chih-Chiang Lu , Chi-Min Chang , Ming-Hao Wu , Yi-Pin Lin , Tung-Chang Lin , Jun-Rui Huang
CPC classification number: H05K1/115 , H05K1/0222 , H05K2201/0195 , H05K2201/09536 , H05K2201/09809
Abstract: A circuit board structure includes a substrate, a first build-up structure layer, first and second external circuit layers, at least one first conductive via, and second conductive vias. The first build-up structure layer is disposed on a first circuit layer of the substrate. The first external circuit layer is disposed on the first build-up structure layer. The second external circuit layer is disposed on a second circuit layer and a portion of a third dielectric layer of the substrate. The first conductive via is electrically connected to the first external circuit layer and the second external circuit layer to define a signal path. The second conductive vias surround the first conductive via, and the first external circuit layer, the second conductive vias, the first circuit layer, the outer conductive layer, and the second external circuit layer define a first ground path. The first ground path surrounds the signal path.
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公开(公告)号：US12144113B2
公开(公告)日：2024-11-12
申请号：US17938977
申请日：2022-09-07
Applicant: Unimicron Technology Corp.
Inventor： Chih-Chiang Lu , Chi-Min Chang , Ming-Hao Wu , Yi-Pin Lin , Tung-Chang Lin , Jun-Rui Huang
Abstract: A circuit board structure includes a substrate, a first build-up structure layer, first and second external circuit layers, at least one first conductive via, and second conductive vias. The first build-up structure layer is disposed on a first circuit layer of the substrate. The first external circuit layer is disposed on the first build-up structure layer. The second external circuit layer is disposed on a second circuit layer and a portion of a third dielectric layer of the substrate. The first conductive via is electrically connected to the first external circuit layer and the second external circuit layer to define a signal path. The second conductive vias surround the first conductive via, and the first external circuit layer, the second conductive vias, the first circuit layer, the outer conductive layer, and the second external circuit layer define a first ground path. The first ground path surrounds the signal path.
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