中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

10 records (took 0.022 seconds)

    一种防潮防震电路板
    2.
    发明公开
    一种防潮防震电路板 无效

    公开(公告)号：CN106028632A

    公开(公告)日：2016-10-12

    申请号：CN201610637233.1

    申请日：2016-08-07

    Applicant: 艾和美

    Inventor： 艾和美

    IPC: H05K1/02

    CPC classification number: H05K1/0256 ,  H05K2201/0753 ,  H05K2201/2045

    Abstract: 本发明涉及工业电子仪器领域，具体涉及一种防潮防震电路板，包括蚀刻金属电路和电路基板，所述蚀刻金属电路设置在所述电路基板上表面，所述的电路板还包括塑料基板、防潮绝缘胶以及阻尼橡胶板；所述塑料基板底面设置有所述防潮绝缘胶，所述防潮绝缘胶与所述蚀刻金属电路之间固定连接有支撑弹簧；所述电路基板下部设置有所述阻尼橡胶板，所述阻尼橡胶板底面设置有缓冲弹簧；所述塑料基板上均匀排布有多个通孔，所述防潮绝缘胶的上端部分嵌入所述塑料基板的通孔内。本发明集防潮和防震功能于一体，解决了现有电路板在受潮和震动情况下造成的缩短使用寿命的问题，有效地保证了电路板的安全使用。

    PRINTED CIRCUIT BOARD AND DISK DEVICE
    5.
    发明公开
    PRINTED CIRCUIT BOARD AND DISK DEVICE 审中-公开

    公开(公告)号：US20240040696A1

    公开(公告)日：2024-02-01

    申请号：US18178877

    申请日：2023-03-06

    Applicant: Kabushiki Kaisha Toshiba ,  Toshiba Electronic Devices & Storage Corporation

    Inventor： Yoshihiro AMEMIYA

    IPC: H05K1/11 ,  H05K3/10 ,  G11B5/012

    CPC classification number: H05K1/111 ,  H05K1/115 ,  H05K3/103 ,  G11B5/012 ,  H05K2201/0302 ,  H05K2201/0753

    Abstract: According to one embodiment, a printed circuit board includes a first conductive layer on an insulating layer, including connection pads, a first mounting pad, a second mounting pad, a second wiring connecting the first mounting pad and one of the connection pads, and a first reinforcing pattern extending from the second mounting pad, a second conductive layer on another surface of the insulating layer, including a third wiring connected to one of the connection pads, and a conductive via connecting the second mounting pad and the third wiring. The second conductive layer includes a pad portion on the third wiring, opposed to the second mounting pad, and a third reinforcing pattern extending from the pad portion and opposed to the first reinforcing pattern.

    Carrier for LTCC components
    7.
    发明授权
    Carrier for LTCC components 有权
    LTCC组件的载体

    公开(公告)号：US08749989B1

    公开(公告)日：2014-06-10

    申请号：US12655318

    申请日：2009-12-28

    Applicant: Harvey L. Kaylie ,  Aron Raklyar

    Inventor： Harvey L. Kaylie ,  Aron Raklyar

    IPC: H05K7/10 ,  H05K7/12

    CPC classification number: H05K1/111 ,  H01L23/13 ,  H01L23/15 ,  H01L23/49805 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/113 ,  H05K2201/032 ,  H05K2201/0753 ,  H05K2201/10378 ,  H01L2924/00

    Abstract: An LTCC carrier composed of thermosetting polymer, woven glass fiber and ceramic has gold over nickel contact pads on top and bottom surfaces and conductive vias therethrough between aligned pairs of top and bottom pads. The vias prevent undesirable inductive paths from limiting high frequency operation of the circuitry. Solder deposits on the top pads attach the LTCC component, which is further secured to the carrier by epoxy, thus improving resistance to thermal stress and mechanical shock. A slot through the carrier body between top and bottom surfaces further reduces thermal stress and mechanical shock. Metallized castellations on opposite carrier sides provide additional surface area for reflow solder joints with the PCB, and a means for visually inspecting the solder joint quality. A gap in the metallization on the top layer of the carrier prevents solder spreading during multiple soldering cycles, which may result in poor solder joints.

    Abstract translation: 由热固性聚合物，编织玻璃纤维和陶瓷组成的LTCC载体在顶部和底部表面上的镍接触焊盘上具有金，并且在对准的顶部和底部焊盘对之间穿过其中的导电通孔。 通孔防止不期望的电感路径限制电路的高频操作。 顶部焊盘上的焊料沉积物连接LTCC部件，其通过环氧树脂进一步固定到载体上，从而改善对热应力和机械冲击的抗性。 在顶面和底面之间穿过承载体的槽进一步降低了热应力和机械冲击。 在相对的载体侧上的金属化的蓖耳体为PCB的回流焊接提供额外的表面积，以及用于目视检查焊点质量的手段。 载体顶层上的金属化中的间隙防止在多个焊接周期期间的焊料扩散，这可能导致差的焊接点。

    Carrier for LTCC components
    9.
    发明授权
    Carrier for LTCC components 有权
    LTCC组件的载体

    公开(公告)号：US09167690B1

    公开(公告)日：2015-10-20

    申请号：US14299701

    申请日：2014-06-09

    Applicant: SCIENTIFIC COMPONENTS CORPORATION

    Inventor： Harvey L. Kaylie ,  Aron Raklyar

    IPC: H05K7/10 ,  H05K7/12 ,  H05K1/11 ,  H05K1/09

    CPC classification number: H05K1/111 ,  H01L23/13 ,  H01L23/15 ,  H01L23/49805 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/113 ,  H05K2201/032 ,  H05K2201/0753 ,  H05K2201/10378 ,  H01L2924/00

    Abstract: An LTCC carrier composed of thermosetting polymer, woven glass fiber and ceramic has gold over nickel contact pads on top and bottom surfaces and conductive vias therethrough between aligned pairs of top and bottom pads. The vias prevent undesirable inductive paths from limiting high frequency operation of the circuitry. Solder deposits on the top pads attach the LTCC component, which is further secured to the carrier by epoxy, thus improving resistance to thermal stress and mechanical shock. A slot through the carrier body between top and bottom surfaces further reduces thermal stress and mechanical shock. Metallized castellations on opposite carrier sides provide additional surface area for reflow solder joints with the PCB, and a means for visually inspecting the solder joint quality. A gap in the metallization on the top layer of the carrier prevents solder spreading during multiple soldering cycles, which may result in poor solder joints.

    Abstract translation: 由热固性聚合物，编织玻璃纤维和陶瓷组成的LTCC载体在顶部和底部表面上的镍接触焊盘上具有金，并且在对准的顶部和底部焊盘对之间穿过其中的导电通孔。 通孔防止不期望的电感路径限制电路的高频操作。 顶部焊盘上的焊料沉积物连接LTCC部件，其通过环氧树脂进一步固定到载体上，从而改善对热应力和机械冲击的抗性。 在顶面和底面之间穿过承载体的槽进一步降低了热应力和机械冲击。 在相对的载体侧上的金属化的蓖耳体为PCB的回流焊接提供额外的表面积，以及用于目视检查焊点质量的手段。 载体顶层上的金属化中的间隙防止在多个焊接周期期间的焊料扩散，这可能导致差的焊接点。

    모바일 기기용 카메라 모듈
    10.
    发明授权
    모바일 기기용 카메라 모듈 失效
    手机摄像机模块

    公开(公告)号：KR100797671B1

    公开(公告)日：2008-01-23

    申请号：KR1020060085118

    申请日：2006-09-05

    Applicant: 삼성전기주식회사

    Inventor： 이상언

    IPC: H04N5/225 ,  G03B17/00

    CPC classification number: H04N5/2251 ,  G02B5/208 ,  H04N5/2257 ,  H05K1/147 ,  H05K2201/05 ,  H05K2201/0753 ,  H05K2201/09372

    Abstract: A camera module for a mobile device is provided to guarantee stable performance of a product by preventing a PCB(Printed Circuit Board) from being bent due to thermal compression when bonded to an FPCB(Flexible PCB) while maintaining a connection structure with a socket as it is. An image sensor(3) is installed within a housing(2) and receives an image. A PCB(5) includes an attachment face at a lower surface of the housing(2) to which an upper edge portion is attached so that a lower surface thereof can be selectively connected to a terminal piece of a socket(7) or a connection pad of an FPCB. The PCB includes a board pad part which is attached to the FPCB by thermal compression to a lower edge portion corresponding to the attachment face, and a socket pad part disposed to be downscaled based on the board pad part. An insulating material is formed on the PCB by selectively applying insulating material to the board pad part and the socket pad part.

    Abstract translation: 提供了一种用于移动设备的相机模块，以通过防止PCB（印刷电路板）在与FPCB（柔性PCB）接合时由于热压缩而弯曲，同时保持与插座的连接结构来保证产品的稳定性能 它是。 图像传感器（3）安装在壳体（2）内并接收图像。 PCB（5）包括在壳体（2）的下表面处的附接面，上边缘部分附接到该附接面，使得其下表面可以选择性地连接到插座（7）的端子或连接 FPCB垫。 PCB包括通过热压缩到对应于附接面的下边缘部分的FPCB的板焊盘部分，以及基于板焊盘部分被设置为被缩小的插座焊盘部分。 通过选择性地将绝缘材料施加到板焊盘部分和插座焊盘部分，在PCB上形成绝缘材料。

Patent Agency Ranking