公开(公告)号：WO2022240798A1

公开(公告)日：2022-11-17

申请号：PCT/US2022/028455

申请日：2022-05-10

Applicant: KYOCERA AVX COMPONENTS CORPORATION

Inventor： NELSON, Cory ,  BORGMAN, Jeff

IPC: H01L29/94 ,  H01L29/66 ,  H01G4/00 ,  H01L29/66181 ,  H05K1/183 ,  H05K2201/10015 ,  H05K3/32

Abstract: A semiconductor-based capacitor can include a substrate including a semiconductor material, an oxide layer formed on a surface of the substrate, a conductive layer formed over at least a portion of the oxide layer, a plurality of distinct coplanar upper terminals, and at least one lower terminal formed. Each of the upper terminals and the at least one lower terminal can be exposed along the top and bottom surfaces of the substrate, respectively, for embedding the capacitor in a substrate such as a circuit board. The semiconductor-based capacitor can be sufficiently miniaturized to be embeddable within a circuit board while providing superior capacitance values. For example, a ratio of the length to the width of the substrate can be in a range from about 3:1 to about 1:3 and an area of the substrate can be less than about 3 mm2.

公开(公告)号：WO2021146270A2

公开(公告)日：2021-07-22

申请号：PCT/US2021/013217

申请日：2021-01-13

Applicant: KEMET ELECTRONICS CORPORATION

Inventor： BULTITUDE, John ,  BLAIS, Peter, Alexandre ,  BURK, James, A. ,  MILLER, Galen, W. ,  HAYES, Hunter ,  TEMPLETON, Allen ,  JONES, Lonnie, G. ,  LAPS, Mark, R.

IPC: H01L23/495 ,  H05K1/11 ,  H05K3/46 ,  H01G4/30 ,  H01G4/224 ,  H01G4/228 ,  H01G4/38 ,  H01L25/072 ,  H01L29/1608 ,  H01L29/2003 ,  H05K1/0272 ,  H05K1/145 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10545 ,  H05K3/328

Abstract: Provided is a high-density multi-component package comprising a first module interconnect pad and a second module interconnect pad. At least two electronic components are mounted to and between the first module interconnect pad and the second module interconnect pad wherein a first electronic component is vertically oriented relative to the first module interconnect pad. A second electronic component is vertically oriented relative to the second module interconnect pad.

公开(公告)号：WO2021194399A1

公开(公告)日：2021-09-30

申请号：PCT/SE2020/050313

申请日：2020-03-26

Applicant: TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)

Inventor： REHNSTRÖM, Mats ,  HÅKANSSON, Tomas ,  LEIJON, Anders

IPC: H02M1/12 ,  H02M7/00 ,  H05K1/02 ,  H01F27/02 ,  H01F2027/065 ,  H01F27/06 ,  H01F27/266 ,  H01F27/402 ,  H02M1/126 ,  H02M7/003 ,  H05K1/0233 ,  H05K1/141 ,  H05K2201/083 ,  H05K2201/09081 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10492 ,  H05K2201/105 ,  H05K2201/10522 ,  H05K2201/1053 ,  H05K2201/10606 ,  H05K3/4007

Abstract: The present invention relates to a filter component (40) for use in an electric circuitry, the filter component comprising a ferromagnetic body (14), an inductor and a printed circuit board, PCB, (20). The ferromagnetic body has a first side (14a) and a second side (14b), the second side opposing the first side, and first and second connection pins (18a, 18b) arranged on the first side of the ferromagnetic body thereby defining a surface area (17) comprising at least an area of the first side between the first and a second connection pins (18a, 18b). The inductor is integrated in the ferromagnetic body (14) and connected to the first and second connection pins (18a, 18b), and the PCB (20), has a first PCB side (20a) and a second PCB side (20b), the second PCB side opposing the first PCB side. At least one component of the electric circuitry is arranged on the PCB (20), and the second PCB side (20b) is arranged on the surface area (17) between the connection pins (18a, 18b).

公开(公告)号：WO2021146284A1

公开(公告)日：2021-07-22

申请号：PCT/US2021/013238

申请日：2021-01-13

Applicant: KEMET ELECTRONICS CORPORATION

Inventor： BULTITUDE, John ,  BLAIS, Peter Alexandre ,  BURK, James A. ,  MILLER, Galen W. ,  HAYES, Hunter ,  TEMPLETON, Allen ,  JONES, Lonnie G. ,  LAPS, Mark, R.

IPC: H01G4/38 ,  H01L23/488 ,  H01L23/498 ,  H05K1/18 ,  H05K7/14 ,  H01G4/30 ,  H01L25/072 ,  H01L29/1608 ,  H01L29/2003 ,  H05K1/0272 ,  H05K1/145 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10545 ,  H05K3/328

Abstract: Provided is an improved electronic component package. The electronic component package comprises a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination. The electronic component package also includes a structural lead frame comprising multiple leads wherein each lead is mounted to at least one first external termination and the structural lead frame comprises at least one break away feature between adjacent leads.

公开(公告)号：WO2021247586A1

公开(公告)日：2021-12-09

申请号：PCT/US2021/035261

申请日：2021-06-01

Applicant: APPLIED MATERIALS, INC.

Inventor： CRIMINALE, Phillip A. ,  GUO, Zhiqiang ,  KRAUS, Philip A. ,  MYLES, Andrew ,  PEREZ-GUZMAN, Martin

IPC: H01L21/66 ,  H01L21/67 ,  H01J37/32 ,  G05B19/418 ,  H02J7/00 ,  H02J50/80 ,  H02J50/10 ,  H01L21/67253 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10151 ,  H05K5/03 ,  H05K5/069 ,  H05K7/1427

Abstract: A diagnostic disc includes a disc-shaped body having raised walls that encircle the interior of the disc-shaped body and at least one protrusion extending outwardly from the disc-shaped body. The raised walls of the disc-shaped body define a cavity of the disc-shaped body. A non-contact sensor is attached to each of the at least one protrusion. A a printed circuit board (PCB) is positioned within the cavity formed on the disc-shaped body. A vacuum and high temperature tolerant power source is disposed on the PCB along with a wireless charger and circuitry that is coupled to each non-contact sensor and includes at least a wireless communication circuit and a memory. A cover is positioned over the cavity of the disc-shaped body and shields at least a portion of the PCB, circuitry, power source, and wireless charger within the cavity from an external environment.

公开(公告)号：WO2021146284A8

公开(公告)日：2021-07-22

申请号：PCT/US2021/013238

申请日：2021-01-13

Applicant: KEMET ELECTRONICS CORPORATION

Inventor： BULTITUDE, John ,  BLAIS, Peter Alexandre ,  BURK, James A. ,  MILLER, Galen W. ,  HAYES, Hunter ,  TEMPLETON, Allen ,  JONES, Lonnie G. ,  LAPS, Mark, R.

IPC: H01G4/38 ,  H01L23/488 ,  H01L23/498 ,  H05K1/18 ,  H05K7/14 ,  H01G4/224 ,  H01G4/228 ,  H01G4/30 ,  H01L25/072 ,  H01L29/1608 ,  H01L29/2003 ,  H05K1/0204 ,  H05K1/0259 ,  H05K1/0272 ,  H05K1/145 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10545 ,  H05K3/328

Abstract: Provided is an improved electronic component package. The electronic component package comprises a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination. The electronic component package also includes a structural lead frame comprising multiple leads wherein each lead is mounted to at least one first external termination and the structural lead frame comprises at least one break away feature between adjacent leads.