公开(公告)号：WO2021243225A8

公开(公告)日：2021-12-02

申请号：PCT/US2021/034882

申请日：2021-05-28

Applicant: FORMFACTOR, INC.

Inventor： HENSON, Roy J. ,  POWELL, Shawn O.

IPC: H01L21/04 ,  H01L21/48 ,  H01L23/488 ,  H01L23/495 ,  H01L23/498 ,  H01L29/66 ,  H01L23/13 ,  H01L23/49805 ,  H01L23/5384 ,  H01L23/5385 ,  H01L25/0652 ,  H01R12/523 ,  H05K1/141 ,  H05K1/181 ,  H05K2201/09063 ,  H05K2201/10303 ,  H05K2201/1034 ,  H05K2201/10378 ,  H05K2201/10454 ,  H05K2201/10522 ,  H05K2201/1053 ,  H05K2201/1059 ,  H05K2201/10606 ,  H05K2201/10734 ,  H05K2201/2036 ,  H05K2203/041 ,  H05K3/325 ,  H05K3/3405 ,  H05K3/366 ,  H05K3/368

Abstract: 3D electrical integration is provided by connecting several component carriers to a single substrate using contacts at the edges of the component carriers making contact to a 2D contact array (e.g., a ball grid array or the like) on the substrate. The resulting integration of components on the component carriers is 3D, thereby providing much higher integration density than in 2D approaches.

公开(公告)号：WO2021194399A1

公开(公告)日：2021-09-30

申请号：PCT/SE2020/050313

申请日：2020-03-26

Applicant: TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)

Inventor： REHNSTRÖM, Mats ,  HÅKANSSON, Tomas ,  LEIJON, Anders

IPC: H02M1/12 ,  H02M7/00 ,  H05K1/02 ,  H01F27/02 ,  H01F2027/065 ,  H01F27/06 ,  H01F27/266 ,  H01F27/402 ,  H02M1/126 ,  H02M7/003 ,  H05K1/0233 ,  H05K1/141 ,  H05K2201/083 ,  H05K2201/09081 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10492 ,  H05K2201/105 ,  H05K2201/10522 ,  H05K2201/1053 ,  H05K2201/10606 ,  H05K3/4007

Abstract: The present invention relates to a filter component (40) for use in an electric circuitry, the filter component comprising a ferromagnetic body (14), an inductor and a printed circuit board, PCB, (20). The ferromagnetic body has a first side (14a) and a second side (14b), the second side opposing the first side, and first and second connection pins (18a, 18b) arranged on the first side of the ferromagnetic body thereby defining a surface area (17) comprising at least an area of the first side between the first and a second connection pins (18a, 18b). The inductor is integrated in the ferromagnetic body (14) and connected to the first and second connection pins (18a, 18b), and the PCB (20), has a first PCB side (20a) and a second PCB side (20b), the second PCB side opposing the first PCB side. At least one component of the electric circuitry is arranged on the PCB (20), and the second PCB side (20b) is arranged on the surface area (17) between the connection pins (18a, 18b).

公开(公告)号：WO2021134003A1

公开(公告)日：2021-07-01

申请号：PCT/US2020/066998

申请日：2020-12-24

Applicant: LUMILEDS LLC

Inventor： HIN, Tze Yang ,  WONG, Hung Khin

IPC: H01L25/075 ,  H01L27/15 ,  H01L33/64 ,  H01L33/62 ,  H01L25/16 ,  H05K1/18 ,  F21S41/141 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/156 ,  H01L2933/0066 ,  H01L33/647 ,  H05K1/141 ,  H05K1/184 ,  H05K2201/09845 ,  H05K2201/10106 ,  H05K2201/1053

Abstract: A light-emitting diode (LED) package assembly (100) includes a substrate (102). The substrate includes a top surface, a bottom surface (122) and an opening formed through the substrate (102). The opening includes a first portion (104) adjacent the top surface and a second portion (106) adjacent the bottom surface (122) that is wider than the first portion (104) such that portions of the substrate (102) overhang the second portion (106) of the opening. Pads (124) are provided on a bottom surface of the portions of the substrate (102) that overhang the second portion (106) of the opening (102). The assembly also includes a hybridized device (210) in the opening. The hybridized device (210) includes a silicon backplane (214) that has a top surface, a bottom surface and interconnects on the top surface. The interconnects (148) are electrically coupled to the pads (124). The hybridized device also includes an LED array (212) on the top surface of the silicon backplane (214).