Patent search ap:("国际商业机器公司") AND inv:"丹尼尔·C·艾德尔斯坦" Page 1

1.

发明授权
制备用于电连接的导电座的方法及形成的导电座失效转让

公开(公告)号：CN100386857C

公开(公告)日：2008-05-07

申请号：CN01104679.1

申请日：2001-02-21

Applicant: 国际商业机器公司

Inventor： 卡洛斯·J·桑布塞蒂 , 丹尼尔·C·艾德尔斯坦 , 约翰·G·高德罗 , 朱迪思·M·鲁宾诺 , 乔治·沃克

IPC: H01L21/60 , H01L23/48

CPC classification number: H01L24/48 , C23C18/1608 , C23C18/1651 , C23C18/1831 , C23C18/1844 , C23C18/34 , C23C18/36 , C23C18/54 , H01L23/53238 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/45 , H01L2224/0401 , H01L2224/04042 , H01L2224/04073 , H01L2224/05082 , H01L2224/05147 , H01L2224/05556 , H01L2224/05639 , H01L2224/05644 , H01L2224/05664 , H01L2224/05669 , H01L2224/13099 , H01L2224/13111 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48463 , H01L2224/48639 , H01L2224/48644 , H01L2224/48664 , H01L2224/48669 , H01L2224/48739 , H01L2224/48764 , H01L2224/48769 , H01L2224/48799 , H01L2224/48839 , H01L2224/48844 , H01L2224/48864 , H01L2224/48869 , H01L2224/85205 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01032 , H01L2924/01044 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10253 , H01L2924/10271 , H01L2924/14 , H01L2924/181 , H01L2924/19043 , H05K3/244 , H05K13/06 , Y10S428/926 , Y10S428/936 , Y10T428/12493 , Y10T428/12646 , Y10T428/12674 , Y10T428/12771 , Y10T428/12778 , Y10T428/12875 , Y10T428/12889 , Y10T428/12896 , Y10T428/12903 , Y10T428/1291 , Y10T428/12944 , Y10T428/12986 , H01L2924/00014 , H01L2924/00 , H01L2224/48744 , H01L2924/00015

Abstract: 提供一种制备用于电连接的具有优良的扩散阻挡层与附着性能的铜座表面的方法。首先提供经过酸溶液清洁的铜座表面，然后在铜座表面上沉积含磷或含硼合金的保护层，接着在保护层上面沉积稀有金属的附着层。或者，可在化学沉积保护层之前在铜导电表面与保护层之间沉积一层Pd形核层。或者，可通过无电镀Au沉积处理在附着层的上面沉积一层稀有金属层。本发明还公开一种电结构，它包括形成在附着层上并含有同附着层形成整体的电连接即引线键合或钎焊凸块的导电座。

2.

发明公开
制备用于电连接的导电座的方法及形成的导电座失效转让

公开(公告)号：CN1311526A

公开(公告)日：2001-09-05

申请号：CN01104679.1

申请日：2001-02-21

Applicant: 国际商业机器公司

Inventor： 卡洛斯·J·桑布塞蒂 , 丹尼尔·C·艾德尔斯坦 , 约翰·G·高德罗 , 朱迪思·M·鲁宾诺 , 乔治·沃克

IPC: H01L21/60 , H01L21/48 , H01L23/48 , H05K3/00 , H05K1/00

CPC classification number: H01L24/48 , C23C18/1608 , C23C18/1651 , C23C18/1831 , C23C18/1844 , C23C18/34 , C23C18/36 , C23C18/54 , H01L23/53238 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/45 , H01L2224/0401 , H01L2224/04042 , H01L2224/04073 , H01L2224/05082 , H01L2224/05147 , H01L2224/05556 , H01L2224/05639 , H01L2224/05644 , H01L2224/05664 , H01L2224/05669 , H01L2224/13099 , H01L2224/13111 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48463 , H01L2224/48639 , H01L2224/48644 , H01L2224/48664 , H01L2224/48669 , H01L2224/48739 , H01L2224/48764 , H01L2224/48769 , H01L2224/48799 , H01L2224/48839 , H01L2224/48844 , H01L2224/48864 , H01L2224/48869 , H01L2224/85205 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01032 , H01L2924/01044 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10253 , H01L2924/10271 , H01L2924/14 , H01L2924/181 , H01L2924/19043 , H05K3/244 , H05K13/06 , Y10S428/926 , Y10S428/936 , Y10T428/12493 , Y10T428/12646 , Y10T428/12674 , Y10T428/12771 , Y10T428/12778 , Y10T428/12875 , Y10T428/12889 , Y10T428/12896 , Y10T428/12903 , Y10T428/1291 , Y10T428/12944 , Y10T428/12986 , H01L2924/00014 , H01L2924/00 , H01L2224/48744 , H01L2924/00015

Abstract: 提供一种制备用于电连接的具有优良的扩散阻挡层与附着性能的铜座表面的方法。首先提供经过酸溶液清洁的铜座表面,然后在铜座表面上沉积含磷或含硼合金的保护层,接着在保护层上面沉积稀有金属的附着层。或者,可在化学沉积保护层之前在铜导电表面与保护层之间沉积一层Pd形核层。或者,可通过无电镀Au沉积处理在附着层的上面沉积一层稀有金属层。本发明还公开一种电结构,它包括形成在附着层上并含有同附着层形成整体的电连接即引线键合或钎焊凸块的导电座。

Patent Agency Ranking