公开(公告)号：US20230223165A1

公开(公告)日：2023-07-13

申请号：US18182794

申请日：2023-03-13

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yasunori HIOKI ,  Kazuari SASAKI ,  Shun SAKAIDA

IPC: H01B1/22 ,  H01B1/02 ,  H05K1/09 ,  B22F5/00

CPC classification number: H01B1/22 ,  H01B1/02 ,  H01B1/026 ,  H05K1/095 ,  H05K1/09 ,  B22F5/00 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/0245

Abstract: An electrode or wiring, an electrode pair, and a method for manufacturing the electrode or wiring. The electrode or wiring includes: particles of a layered material including one or more layers; and metal particles or a sintered metal. The one or plural layers include a layer body represented by MmXn, wherein M is at least one metal belonging to group 3, 4, 5, 6, or 7, X is a carbon atom, a nitrogen atom, or a combination thereof, n is 1-4, and m is greater than n and at most 5, and a modification or terminal T (T being at least one of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom) is present on the surface of the layer body.

公开(公告)号：US20180302987A1

公开(公告)日：2018-10-18

申请号：US15731076

申请日：2017-04-14

Applicant: THE DILLER CORPORATION

Inventor： Robert Jacob Kramer ,  Kevin Francis O'Brien

IPC: H05K1/18 ,  H05K1/03 ,  H05K1/11 ,  H05K1/09 ,  H05K3/40 ,  H05K3/46 ,  H05K3/28 ,  B32B29/00

CPC classification number: H05K1/185 ,  B32B3/266 ,  B32B7/12 ,  B32B29/002 ,  B32B29/005 ,  B32B2250/26 ,  B32B2255/12 ,  B32B2255/205 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2307/4023 ,  B32B2451/00 ,  B32B2457/00 ,  B32B2457/08 ,  H05K1/0353 ,  H05K1/0386 ,  H05K1/092 ,  H05K1/115 ,  H05K3/28 ,  H05K3/4038 ,  H05K3/4644 ,  H05K2201/0215 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10166

Abstract: A laminate having an integrated electrical component disposed within the laminate is disclosed. The laminate includes a first paper layer having at least first and second vias through the first paper layer; a first electrically-conductive layer, comprising an electrically-conductive material, disposed over a portion of the first paper layer; a second electrically-conductive layer, comprising the electrically-conductive material, disposed over another portion of the first paper layer; an electrical component disposed over the first and second electrically-conductive layers; and an insulating layer disposed over the electrical component. The first paper layer and the insulating layer encapsulate the first electrically-conductive layer, the second electrically-conductive layer, and the electrical component. The first and second vias are in electrical contact with the first electrically-conductive layer and a first terminal of the electrical component, and with the second electrically-conductive layer and a second terminal of the electrical component, respectively.

公开(公告)号：US09950925B2

公开(公告)日：2018-04-24

申请号：US15643417

申请日：2017-07-06

Applicant: NAPRA CO., LTD.

Inventor： Shigenobu Sekine ,  Yurina Sekine

IPC: H01L21/00 ,  B82B3/00 ,  B22F7/04 ,  B29C70/02 ,  C03B19/12 ,  H05K3/40 ,  B22F3/22 ,  B22F3/10 ,  H01L21/768 ,  H01L21/48 ,  B81C99/00 ,  H01L21/56

CPC classification number: B82B3/0038 ,  B22F3/1021 ,  B22F3/22 ,  B22F7/04 ,  B29C70/02 ,  B81C99/0085 ,  C03B19/12 ,  H01L21/4867 ,  H01L21/563 ,  H01L21/76898 ,  H01L2224/32145 ,  H01L2924/1461 ,  H05K3/4053 ,  H05K2201/0215 ,  H05K2201/0305 ,  H05K2203/0425 ,  H01L2924/00

Abstract: A method for forming a functional part in a minute space includes the steps of: filling a minute space with a dispersion functional material in which a thermally-meltable functional powder is dispersed in a liquid dispersion medium; evaporating the liquid dispersion medium present in the minute space; and heating the functional powder and hardening it under pressure.

公开(公告)号：US20180070437A1

公开(公告)日：2018-03-08

申请号：US15716541

申请日：2017-09-27

Applicant: Avary Holding (Shenzhen) Co., Limited. ,  HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.

Inventor： MING-JAAN HO ,  HSIAO-TING HSU

IPC: H05K1/02 ,  H05K1/09 ,  C08K3/28 ,  C09D5/24 ,  C09D125/18 ,  H01B1/22 ,  C08F112/32 ,  H05K1/11

CPC classification number: H05K1/0219 ,  C08F12/22 ,  C08F112/32 ,  C08K3/28 ,  C08K2201/001 ,  C09D5/24 ,  C09D125/18 ,  H01B1/22 ,  H05K1/09 ,  H05K1/115 ,  H05K2201/0141 ,  H05K2201/0215 ,  H05K2201/0329 ,  H05K2201/05

Abstract: A circuit board includes a flexible board, a composite film, and a copper layer. The composite film is formed on the flexible board and defines at least one through hole. The composite film includes a base layer having an active surface, and a conductive layer formed by coated a conductive polymer on the active surface. The conductive polymer is made by a mixture comprising liquid crystal monomers, a silver complex, an initiator, and a catalytic agent, and a solvent, the mixture is heated to undergo atom transfer radical polymerization. The copper layer covers the conductive layer and an inner wall of each of the at least one through hole. The copper layer is electrically connected to the flexible substrate by the through hole.

公开(公告)号：US20180018040A1

公开(公告)日：2018-01-18

申请号：US15548740

申请日：2016-02-05

Applicant: DONGWOO FINE-CHEM CO., LTD.

Inventor： Byung Hoon SONG ,  Dong Ki KEUM ,  Dae Chul PARK

IPC: G06F3/044

CPC classification number: G06F3/044 ,  G06F3/041 ,  G06F2203/04103 ,  G06F2203/04112 ,  H01B1/02 ,  H01B1/124 ,  H01B1/22 ,  H05K1/095 ,  H05K2201/0108 ,  H05K2201/0215 ,  H05K2201/026 ,  H05K2201/09681 ,  H05K2201/10151

Abstract: A conductive sheet according to an aspect of the present invention includes a first nanostructure and a second nanostructure disposed to intersect each other. A thickness of an intersect region of the first nanostructure and the second nanostructure is 0.6 to 0.9 times the sum of thicknesses of non-intersection regions of the first nanostructure and the second nanostructure.

公开(公告)号：US09852979B2

公开(公告)日：2017-12-26

申请号：US15339550

申请日：2016-10-31

Applicant: Texas Instruments Incorporated

Inventor： Matthew D. Romig ,  Frank Stepniak ,  Saumya Gandhi

IPC: H01L23/522 ,  H01L21/768 ,  H01L23/528 ,  H01L21/288 ,  H01L21/78 ,  H01L29/02 ,  H01L21/3105 ,  H05K1/18 ,  H05K1/11 ,  H05K1/16 ,  H01L49/02 ,  H01L23/00

CPC classification number: H01L23/5223 ,  H01L21/288 ,  H01L21/31051 ,  H01L21/76805 ,  H01L21/76831 ,  H01L21/76874 ,  H01L21/76877 ,  H01L21/78 ,  H01L23/5226 ,  H01L23/528 ,  H01L24/14 ,  H01L28/60 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19104 ,  H05K1/113 ,  H05K1/162 ,  H05K1/181 ,  H05K1/185 ,  H05K2201/0187 ,  H05K2201/0215 ,  H05K2201/10734

Abstract: An electronic system comprising an electronic body (301) with terminal pads (310) and at least one capacitor embedded in the electronic body. The capacitor including an insulating and adhesive first polymeric film (302) covering the body surface except the terminal pads; a sheet (320) of high-density capacitive elements, the first capacitor terminal being a metal foil (321) attached to film (302), the second terminal a conductive polymeric compound (324), and the insulator a dielectric skin (323). Sheet (320) has sets of via holes: the first set holes reaching metal foil 321), the second set holes reaching the terminals (310), and the third set holes reaching the conductive polymeric compound (324). An insulating second polymeric film (303) lining the sidewalls of the holes and planarizing the sheet surface; and metal (432) filling the via holes between the polymeric sidewalls and forming conductive traces and attachment pads on the system surface.

公开(公告)号：US20170208684A1

公开(公告)日：2017-07-20

申请号：US15476235

申请日：2017-03-31

Applicant: Infineon Technologies AG

Inventor： Joachim Mahler ,  Ralf Otremba

IPC: H05K1/03 ,  H05K1/11 ,  H05K3/00 ,  H05K3/02 ,  H05K1/02 ,  H05K3/40

CPC classification number: H05K1/036 ,  H05K1/0203 ,  H05K1/032 ,  H05K1/0373 ,  H05K1/115 ,  H05K3/0014 ,  H05K3/007 ,  H05K3/0094 ,  H05K3/02 ,  H05K3/105 ,  H05K3/4038 ,  H05K3/4626 ,  H05K2201/0104 ,  H05K2201/0129 ,  H05K2201/0215 ,  H05K2201/0224 ,  H05K2201/0281 ,  H05K2203/107 ,  H05K2203/1136 ,  Y10T29/49126 ,  Y10T428/24909

Abstract: A printed circuit board includes an electrically conductive layer and a dielectric layer including a polymer. The polymer includes at least one of a carbon layer structure and a carbon-like layer structure.

公开(公告)号：US09688835B2

公开(公告)日：2017-06-27

申请号：US14385281

申请日：2013-03-15

Applicant: MITSUBISHI CHEMICAL EUROPE GMBH

Inventor： Bernardus Antonius Gerardus Schrauwen

IPC: C08K3/22 ,  H01Q1/36 ,  H05K1/03 ,  H05K3/00 ,  H05K3/18 ,  H05K3/10

CPC classification number: C08K3/22 ,  C08K3/2279 ,  C08K2003/2231 ,  C08K2003/2241 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/1646 ,  C23C18/204 ,  C23C18/38 ,  H01Q1/36 ,  H05K1/0373 ,  H05K3/0014 ,  H05K3/105 ,  H05K3/181 ,  H05K2201/0129 ,  H05K2201/0215 ,  H05K2201/09118 ,  H05K2203/107

Abstract: A thermoplastic composition including a) a thermoplastic resin and b) a laser direct structuring (LDS) additive in an amount of at least 1 wt. % with respect to the weight of the total composition, wherein the LDS additive includes a mixed metal oxide including at least tin and a second metal selected from the group consisting of antimony, bismuth, aluminum and molybdenum, wherein the LDS additive includes at least 40 wt. % of tin and wherein the weight ratio of the second metal to tin is at least 0.02:1.

公开(公告)号：US09648735B2

公开(公告)日：2017-05-09

申请号：US14729158

申请日：2015-06-03

Applicant: Infineon Technologies AG

Inventor： Joachim Mahler ,  Ralf Otremba

IPC: H05K1/03 ,  H05K3/00 ,  H05K1/11 ,  H05K3/10 ,  H05K3/46

CPC classification number: H05K1/036 ,  H05K1/0203 ,  H05K1/032 ,  H05K1/0373 ,  H05K1/115 ,  H05K3/0014 ,  H05K3/007 ,  H05K3/0094 ,  H05K3/02 ,  H05K3/105 ,  H05K3/4038 ,  H05K3/4626 ,  H05K2201/0104 ,  H05K2201/0129 ,  H05K2201/0215 ,  H05K2201/0224 ,  H05K2201/0281 ,  H05K2203/107 ,  H05K2203/1136 ,  Y10T29/49126 ,  Y10T428/24909

Abstract: A printed circuit board includes an electrically conductive layer and a dielectric layer including a polymer, wherein the polymer includes metallic particles.

公开(公告)号：US20170099731A1

公开(公告)日：2017-04-06

申请号：US15128093

申请日：2015-04-07

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： TATSUYA ARISAWA ,  YOSHIHIKO NAKAMURA ,  TOMOYUKI ABE ,  KIYOTAKA KOMORI ,  SYOUJI HASIMOTO ,  MITSUYOSHI NISHINO

IPC: H05K1/03 ,  C08J5/24 ,  H05K3/00 ,  B32B15/08 ,  B32B27/20

CPC classification number: H05K1/0373 ,  B32B15/08 ,  B32B27/20 ,  B32B2305/076 ,  B32B2457/08 ,  C08J5/10 ,  C08J5/24 ,  C08J2300/24 ,  C08J2363/00 ,  C08J2371/12 ,  H05K1/0366 ,  H05K3/0067 ,  H05K2201/0209 ,  H05K2201/0215

Abstract: A resin composition for printed circuit board contains a resin component containing a thermosetting resin, and an inorganic filler. The inorganic filler contains crushed silica having a specific surface area in a range from 0.1 m2/g to 15 m2/g, inclusive, and molybdenum compound particles each having a molybdenum compound in at least a surface layer portion. A content of the crushed silica is in a range from 10 parts by mass to 150 parts by mass inclusive with respect to 100 parts by mass of the resin component.