公开(公告)号：US20240349423A1

公开(公告)日：2024-10-17

申请号：US18682745

申请日：2022-05-30

Applicant: GUANGZHOU FANGBANG ELECTRONICS CO., LTD

Inventor： Meijuan Zhang ,  Yuhua Zhu

IPC: H05K1/09 ,  H05K3/06

CPC classification number: H05K1/09 ,  H05K3/064 ,  H05K2201/032 ,  H05K2201/0338 ,  H05K2201/0355

Abstract: The present disclosure relates to the technical field of metal foils. Disclosed is a metal foil, including a conductive layer and a bearing layer, the conductive layer and the bearing layer being stacked. The conductive layer is configured to manufacture a conductive line. When a circuit board is manufactured using the metal foil, the bearing layer is separated from the conductive layer by a first etching solution, and a roughness Rz of a surface, close to the conductive layer, of the bearing layer is less than or equal to 2 microns. When the circuit board is manufactured using the metal foil, a surface of the conductive line is substantially flush with a surface of a substrate after the bearing layer is removed, and the surface roughness of the conductive line is low, so that the product requirement for high dimensional accuracy may be satisfied. Meanwhile, embodiments of the present disclosure further correspondingly provide a circuit board and a method for manufacturing the circuit board.

公开(公告)号：US12115603B2

公开(公告)日：2024-10-15

申请号：US18054208

申请日：2022-11-10

Applicant: KABUSHIKI KAISHA TOSHIBA ,  TOSHIBA MATERIALS CO., LTD.

Inventor： Maki Yonetsu ,  Seiichi Suenaga ,  Sachiko Fujisawa ,  Takashi Sano

IPC: B23K35/30 ,  H05K1/03 ,  B23K1/00 ,  B23K101/40 ,  B23K103/00 ,  H01L23/15 ,  H05K1/09

CPC classification number: B23K35/3006 ,  B23K35/302 ,  H05K1/0306 ,  B23K1/0016 ,  B23K2101/40 ,  B23K2103/56 ,  H01L23/15 ,  H05K1/09 ,  H05K2201/0338

Abstract: A bonded body according to an embodiment includes a ceramic substrate, a copper plate, and a bonding layer that is located on at least one surface of the ceramic substrate and bonds the ceramic substrate and the copper plate. The bonding layer includes titanium. The bonding layer includes first and second regions; the first region includes a layer including titanium as a major component; the layer is formed at an interface of the bonding layer with the ceramic substrate; and the second region is positioned between the first region and the copper plate. The bonded body has a ratio M1/M2 of a titanium concentration M1 at % in the first region and a titanium concentration M2 at % in the second region that is not less than 0.1 and not more than 5 when the Ti concentrations are measured by EDX respectively in measurement regions in the first and second regions.

公开(公告)号：US20240341034A1

公开(公告)日：2024-10-10

申请号：US18623091

申请日：2024-04-01

Applicant: IBIDEN CO., LTD.

Inventor： Masashi KUWABARA ,  Susumu KAGOHASHI

IPC: H05K1/11 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K3/00 ,  H05K3/10 ,  H05K3/42

CPC classification number: H05K1/116 ,  H05K1/0242 ,  H05K1/09 ,  H05K3/002 ,  H05K3/0035 ,  H05K3/0041 ,  H05K3/108 ,  H05K3/423 ,  H05K1/0306 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0338 ,  H05K2201/096 ,  H05K2203/0723

Abstract: A wiring substrate includes a core substrate having a through-hole conductor, a resin insulating layer formed on the core substrate, a conductor layer formed on the insulating layer and including a seed layer and an electrolytic plating layer, and a via conductor formed in the insulating layer. The via conductor electrically connects the through-hole conductor and conductor layer. The via conductor includes the seed layer and electrolytic plating layer extending from the conductor layer. The core substrate includes a glass substrate and has a through hole penetrating through the glass substrate. The through-hole conductor is formed in the through hole. The seed layer is covering inner wall surface of the insulating layer in opening in which the via conductor is formed. The seed layer has a first portion and a second portion electrically connected to the first portion. That part of the first portion is formed on the second portion.

公开(公告)号：US20240334610A1

公开(公告)日：2024-10-03

申请号：US18742067

申请日：2024-06-13

Applicant: InnoLux Corporation

Inventor： Hsin-Li CHEN

IPC: H05K1/18

CPC classification number: H05K1/189 ,  H05K2201/0338 ,  H05K2201/10128

Abstract: An electronic device is provided, including a flexible circuit board and a conductive adhesive material. The flexible circuit board includes a substrate, a conductive layer, and a cover layer. The substrate has a first top surface and a first side. The first top surface has a normal direction. The conductive layer is disposed on the first top surface and has a second top surface and a second side. The cover layer is disposed on the second top surface and has a surface faced to the conductive layer. The conductive adhesive material is disposed on the conductive layer. In a cross-sectional view, an end of the surface of the conductive layer is overlapped with the conductive adhesive material. A distance between a bottom point of the first side and a bottom point of the second side in a direction perpendicular to the normal direction is greater than zero.

公开(公告)号：US12101879B2

公开(公告)日：2024-09-24

申请号：US18217958

申请日：2023-07-03

Applicant: LG INNOTEK CO., LTD.

Inventor： Jun Young Lim ,  Woong Sik Kim ,  Hyung Kyu Yoon

IPC: H05K1/09 ,  H05K1/02 ,  H05K1/03 ,  H05K1/18 ,  H05K3/28 ,  H05K3/34 ,  H05K1/11 ,  H05K3/24

CPC classification number: H05K1/09 ,  H05K1/028 ,  H05K1/0393 ,  H05K1/181 ,  H05K3/28 ,  H05K3/3452 ,  H05K1/111 ,  H05K1/18 ,  H05K1/189 ,  H05K3/244 ,  H05K2201/0154 ,  H05K2201/0191 ,  H05K2201/0338 ,  H05K2201/10136

Abstract: A flexible printed circuit board (FPCB), which is applied to various electronic display devices, may include a base, a first metal layer and a second metal layer on both surfaces of the base, a first plating layer on the first metal layer, a second plating layer on the second metal layer, and a first insulating pattern and a second insulating pattern respectively disposed on some region of the first plating layer and the second plating layer, wherein the first plating layer and the second plating layer may have different thicknesses.

公开(公告)号：US12089327B2

公开(公告)日：2024-09-10

申请号：US18046280

申请日：2022-10-13

Applicant: KURARAY CO., LTD.

Inventor： Kikuo Arimoto ,  Takafumi Sawada ,  Yuuichi Banba ,  Shuji Nagano

IPC: H05K1/03 ,  B32B15/04 ,  B32B15/08 ,  B32B15/18 ,  B32B15/20 ,  C08J5/18 ,  C09K19/00 ,  C09K19/02 ,  C23C14/20 ,  H05K1/09 ,  H05K3/02

CPC classification number: H05K1/0353 ,  B32B15/04 ,  B32B15/043 ,  B32B15/08 ,  B32B15/18 ,  B32B15/20 ,  C08J5/18 ,  C09K19/00 ,  C09K19/02 ,  C23C14/20 ,  C23C14/205 ,  H05K1/0313 ,  H05K1/09 ,  H05K3/022 ,  H05K1/0393 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0338 ,  Y10T428/12556 ,  Y10T428/12569 ,  Y10T428/1266 ,  Y10T428/12667 ,  Y10T428/12708 ,  Y10T428/12715 ,  Y10T428/12722 ,  Y10T428/12736 ,  Y10T428/12743 ,  Y10T428/1275 ,  Y10T428/12757 ,  Y10T428/12785 ,  Y10T428/12806 ,  Y10T428/12819 ,  Y10T428/12826 ,  Y10T428/12847 ,  Y10T428/12854 ,  Y10T428/12861 ,  Y10T428/12868 ,  Y10T428/12875 ,  Y10T428/12882 ,  Y10T428/12889 ,  Y10T428/12896 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/12917 ,  Y10T428/12931 ,  Y10T428/12937 ,  Y10T428/12944 ,  Y10T428/12951 ,  Y10T428/26 ,  Y10T428/31678

Abstract: Provide is a metal-coated liquid-crystal polymer film that is suitable for microcircuit processing and capable of reducing the transmission loss of circuits. The metal-coated liquid-crystal polymer film comprising: a polymer film comprising a polymer film main body capable of forming an optically anisotropic melt phase; a first metal layer layered on at least one side of the polymer film main body; and a second metal layer layered on the first metal layer, wherein in an analysis of oxygen concentration in a thickness direction using XPS, the average oxygen concentration of the first metal layer is 2.5 atom % or less.

公开(公告)号：US20240260179A1

公开(公告)日：2024-08-01

申请号：US18426547

申请日：2024-01-30

Applicant: IBIDEN CO., LTD.

Inventor： Jun SAKAI ,  Shiho SHIMADA

IPC: H05K1/02 ,  H05K1/05 ,  H05K3/16

CPC classification number: H05K1/0298 ,  H05K1/053 ,  H05K3/16 ,  H05K2201/0209 ,  H05K2201/0338 ,  H05K2203/0723

Abstract: A printed wiring board includes a conductor layer, an outermost insulating layer formed on the conductor layer and having an opening exposing a portion of the conductor layer, and a metal post formed in the opening of the outermost insulating layer and including a seed layer and an electrolytic plating layer formed on the seed layer such that the metal post has a height exceeding a surface of the outermost insulating layer and has a portion exceeding a height of the outermost insulating layer, the seed layer of the metal post has a first layer and a second layer formed on the first layer. The portion exceeding the height of the outermost insulating layer is formed such that a width of the first layer is larger than a width of the second layer, and a width of the electrolytic plating layer is larger than the width of the first layer.

公开(公告)号：US20240244747A1

公开(公告)日：2024-07-18

申请号：US17927576

申请日：2021-12-31

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Nianqi YAO ,  Feifei LI ,  Ce NING ,  Zhengliang LI ,  Hehe HU ,  Jiayu HE ,  Jie HUANG ,  Kun ZHAO ,  Zhanfeng CAO ,  Ke WANG

IPC: H05K1/11 ,  H01L23/498 ,  H01L33/62 ,  H05K1/09 ,  H05K1/18

CPC classification number: H05K1/111 ,  H01L23/49838 ,  H01L33/62 ,  H05K1/09 ,  H05K1/181 ,  H05K2201/0338 ,  H05K2201/10106 ,  H05K2201/10151

Abstract: A wiring board includes a base substrate and first connection pads disposed on the base substrate. The first connection pads each include electrical connection layer(s); each electrical connection layer includes a main material layer and protective layer(s) disposed on a side of the main material layer away from the base substrate; the protective layer(s) include a first reference protective layer, which is a protective layer farthest away from the base substrate in the protective layer(s); and a material of the main material layer includes copper. The electrical connection layer(s) includes a first electrical connection layer, which is an electrical connection layer farthest away from the base substrate in the electrical connection layer(s); and in protective layer(s) in the first electrical connection layer, at least a material of the first reference protective layer is capable of forming a first intermetallic compound with a first solder.

公开(公告)号：US20240107685A1

公开(公告)日：2024-03-28

申请号：US18475288

申请日：2023-09-27

Applicant: IBIDEN CO., LTD.

Inventor： Susumu KAGOHASHI ,  Jun SAKAI ,  Kyohei YOSHIKAWA ,  Takuya INISHI

IPC: H05K3/46 ,  H05K1/03 ,  H05K1/11 ,  H05K3/06 ,  H05K3/16

CPC classification number: H05K3/4688 ,  H05K1/0306 ,  H05K1/0313 ,  H05K1/116 ,  H05K3/062 ,  H05K3/16 ,  H05K3/4608 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0338 ,  H05K2203/0369

Abstract: A printed wiring board includes a first conductor layer, a resin insulating layer having an opening, a second conductor layer including a seed layer and an electrolytic plating layer formed on the seed layer, and a via conductor including the seed layer and the electrolytic plating layer and connecting the first conductor and second conductor layers. The seed layer has a first portion on the surface of the insulating layer, a second portion on an inner wall surface in the opening of the insulating layer, and a third portion on a portion of the first conductor layer exposed by the opening of the insulating layer such that the first portion is thicker than the second portion and the third portion, the second portion has a first film and a second film electrically connected to the first film, and a portion of the first film is formed on the second film.

公开(公告)号：US11832395B2

公开(公告)日：2023-11-28

申请号：US17132472

申请日：2020-12-23

Applicant: LANDA LABS (2012) LTD

Inventor： Benzion Landa ,  Naomi Elfassy ,  Stanislav Thygelbaum

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K3/20 ,  H05K3/28 ,  H05K3/38 ,  H05K3/40 ,  H05K7/02 ,  H05K7/06 ,  H01L21/48 ,  H01L31/20 ,  H01L31/0216 ,  H01L31/0224 ,  H01L31/0392 ,  B41M5/44 ,  B41M5/392 ,  B41M5/395 ,  B41M1/12 ,  H05K3/34 ,  H05K1/16

CPC classification number: H05K3/207 ,  B41M1/12 ,  H01L31/02167 ,  H01L31/022425 ,  H01L31/022433 ,  H01L31/03926 ,  H01L31/206 ,  H05K1/0393 ,  H05K1/092 ,  H05K3/3485 ,  H05K3/386 ,  H05K1/165 ,  H05K2201/0195 ,  H05K2201/035 ,  H05K2201/0338 ,  H05K2201/0391 ,  H05K2201/10098 ,  H05K2203/0139 ,  H05K2203/1105 ,  H05K2203/1131 ,  H05K2203/1476 ,  H05K2203/1545 ,  Y02E10/50

Abstract: A method is disclosed for applying an electrical conductor to an electrically insulating substrate, which comprises providing a flexible membrane with a pattern of groove formed on a first surface thereof, and loading the grooves with a composition comprising conductive particles. The composition is, or may be made, electrically conductive. Once the membrane is loaded, the grooved first surface of the membrane is brought into contact with a front or/and back of the substrate. A pressure is then applied between the substrate and the membrane(s) so that the composition loaded to the grooves adheres to the substrate. The membrane(s) and the substrate are separated and the composition in the groove is left on the surface of the electrically insulating substrate. The electrically conductive particles in the composition are then sintered to form a pattern of electrical conductors on the substrate, the pattern corresponding to the pattern formed in the membrane(s).