公开(公告)号：US12114427B2

公开(公告)日：2024-10-08

申请号：US17831301

申请日：2022-06-02

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Lung-Yuan Wang ,  Wen-Liang Lien

IPC: H05K3/32 ,  H01L23/31 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K3/46 ,  H05K1/02

CPC classification number: H05K1/144 ,  H01L23/3157 ,  H05K1/111 ,  H05K1/181 ,  H05K3/32 ,  H05K3/4682 ,  H05K1/0203 ,  H05K2201/042

Abstract: A method for fabricating an assemble substrate is provided, including stacking a circuit portion on a plurality of circuit members. The circuit members are spaced apart from one another in a current packaging process to increase a layer area. The assemble substrate thus fabricated meets the requirements for a packaging substrate of a large size, and has a high yield and low fabrication cost.

公开(公告)号：US12087990B2

公开(公告)日：2024-09-10

申请号：US17046840

申请日：2018-04-13

Applicant: SAAB AB

Inventor： Sten Gunnarsson

IPC: H01P5/107 ,  H05K1/02 ,  H05K1/14

CPC classification number: H01P5/107 ,  H05K1/0225 ,  H05K1/0246 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/096 ,  H05K2201/09609 ,  H05K2201/10098

Abstract: A waveguide launch system configured for translating radio frequency signal waves is provided. The system comprises a first printed circuit board lamina comprising an electrically conductive ground member and configured for attachment of a separate waveguide element, having a first cross-section area, thereto. A second printed circuit board lamina comprising an electrically conductive backshort cover configured to reflect the RF signal waves is bonded to a first printed circuit board lamina. An electrically conductive barrier arrangement extends through the second printed circuit board lamina. The electrically conductive barrier arrangement and the electrically conductive backshort cover form an integrated electrically conductive backshort volume of an integrated backshort having a second cross-section area. The second cross-section area is smaller than the first cross-section area.

公开(公告)号：US12087680B2

公开(公告)日：2024-09-10

申请号：US18156484

申请日：2023-01-19

Applicant: WOLFSPEED, INC.

Inventor： Zach Cole ,  Steven Ericksen

IPC: H05K5/00 ,  H01L23/498 ,  H01L25/07 ,  H05K1/14 ,  H05K1/18

CPC classification number: H01L23/49838 ,  H01L25/072 ,  H05K1/147 ,  H05K1/181 ,  H05K1/142 ,  H05K2201/042 ,  H05K2201/10151 ,  H05K2201/10166

Abstract: A power module includes at least one electrically conductive power substrate; and a plurality of power devices arranged on and connected to the at least one electrically conductive power substrate. The power module further includes at least one elevated signal element electrically connected to the plurality of power devices and/or at least one elevated power plane electrically connected to the at least one electrically conductive power substrate and electrically connected to the plurality of power devices.

公开(公告)号：US12062853B2

公开(公告)日：2024-08-13

申请号：US18313727

申请日：2023-05-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kwanghyun Baek ,  Seungtae Ko ,  Kijoon Kim ,  Juho Son ,  Sangho Lee ,  Youngju Lee ,  Jungyub Lee ,  Yonghun Cheon ,  Dohyuk Ha

IPC: H01Q21/06 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q1/42 ,  H04B7/0413 ,  H05K1/18 ,  H05K9/00

CPC classification number: H01Q21/065 ,  H01Q1/2283 ,  H01Q1/246 ,  H01Q1/42 ,  H04B7/0413 ,  H05K1/181 ,  H05K9/0049 ,  H05K2201/042 ,  H05K2201/10015 ,  H05K2201/10098 ,  H05K2201/10719 ,  H05K2201/10734

Abstract: A communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT) are provided. The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. According to the disclosure, an antenna module includes a first substrate layer on which at least one substrate is stacked; an antenna coupled to an upper end surface of the first substrate layer; a second substrate layer having an upper end surface coupled to a lower end surface of the first substrate layer and on which at least one substrate is stacked; and a radio frequency (RF) element coupled to a lower end surface of the second substrate layer.

公开(公告)号：US12035462B2

公开(公告)日：2024-07-09

申请号：US17559204

申请日：2021-12-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hongkyu Lee ,  Hyoseok Na

IPC: H04R1/04 ,  H04R1/08 ,  H04R3/00 ,  H04R19/04 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14

CPC classification number: H05K1/0259 ,  H04R1/04 ,  H04R1/086 ,  H04R3/00 ,  H04R19/04 ,  H05K1/115 ,  H05K1/141 ,  H05K1/144 ,  H04R2201/003 ,  H04R2499/11 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/10151

Abstract: An electronic device is provided. The electronic device includes a printed circuit board (PCB) on which a plurality of PCBs is stacked and comprising a hole penetrating the plurality of PCBs, a microphone disposed on a first surface of the PCB and to which a sound is delivered through the hole, and an electrical conductive path formed in at least a part of or the entire hole. The electrical conductive path may be electrically connected to at least one of a ground of the PCB or a ground of the microphone.

公开(公告)号：US12022616B2

公开(公告)日：2024-06-25

申请号：US18200230

申请日：2023-05-22

Applicant: Shenzhen Newsonic Technologies Co., Ltd.

Inventor： Guojun Weng ,  Xiaolong Wang

IPC: H05K1/14 ,  H01L21/56 ,  H01L23/00 ,  H01L23/538 ,  H01L25/00 ,  H01L25/065 ,  H05K1/11 ,  H05K3/34 ,  H05K3/40

CPC classification number: H05K1/144 ,  H01L21/568 ,  H01L23/5384 ,  H01L24/16 ,  H01L25/0655 ,  H01L25/50 ,  H05K1/115 ,  H05K3/34 ,  H05K3/4038 ,  H01L2224/16227 ,  H01L2224/16238 ,  H05K2201/042 ,  H05K2201/09036 ,  H05K2201/09509 ,  H05K2201/10098 ,  H05K2201/10674 ,  H05K2201/10984

Abstract: A radio frequency front-end module, a manufacturing method thereof and a communication device are provided. The radio frequency front-end module includes a first base substrate and a metal bonding structure; a second functional substrate, including a second base substrate, a groove in the second base substrate, and a bonding metal layer; and a first radio frequency front-end component, at least partially located in the groove, the first base substrate and the second base substrate are oppositely arranged, and a surface of the second base substrate close to the first base substrate includes a groove surface inside the groove and a substrate surface outside the groove, and the bonding metal layer includes a first metal portion located on the groove surface and a second metal portion located on the substrate surface, the first radio frequency front-end component is at least partially surrounded by the first metal portion.

公开(公告)号：US20240138052A1

公开(公告)日：2024-04-25

申请号：US18483870

申请日：2023-10-09

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihito OTSUBO

IPC: H05K1/02 ,  H01L23/367 ,  H01L25/10 ,  H01L25/16 ,  H05K1/14 ,  H05K1/18

CPC classification number: H05K1/0203 ,  H01L23/3675 ,  H01L25/105 ,  H01L25/162 ,  H05K1/144 ,  H05K1/181 ,  H01L2225/1094 ,  H05K2201/042 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10522 ,  H05K2201/10545 ,  H05K2201/1056

Abstract: A first sealing resin is disposed between a first lower main surface and a second upper main surface. An upper circuit board first mounting electrode is disposed on the first lower main surface. A lower circuit board first mounting electrode is disposed on the second upper main surface. A first component is mounted on the lower circuit board first mounting electrode and is disposed in the first sealing resin. A first conductor layer is disposed on an upper circuit board. As viewed in the downward direction, a heat conduction member overlaps the first component, is disposed in a space between the first lower main surface and the second upper main surface, and is coupled to the first conductor layer via a conductor. A part of a heat dissipation member is exposed from the first sealing resin in a direction orthogonal to an up-down axis.

公开(公告)号：US20240136739A1

公开(公告)日：2024-04-25

申请号：US18475392

申请日：2023-09-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihito OTSUBO

IPC: H01R12/52 ,  H05K1/18

CPC classification number: H01R12/52 ,  H05K1/181 ,  H05K2201/042 ,  H05K2201/10234 ,  H05K2201/10318 ,  H05K2201/10522 ,  H05K2201/10545

Abstract: A circuit module includes an upper circuit board, a lower circuit board, a first conductor member, a second conductor member, and a first component. The upper circuit board has a first upper main surface and a first lower main surface. The lower circuit board has a second upper main surface and a second lower main surface, is disposed below the upper circuit board, and overlaps the upper circuit board as viewed in the downward direction. The first component is mounted on the first lower main surface or the second upper main surface. The first conductor member is a metal pin and is connected to the first lower main surface. The second conductor member is a metal pin and is connected to the second upper main surface. The second conductor member is electrically connected to the first conductor member.

公开(公告)号：US20240106339A1

公开(公告)日：2024-03-28

申请号：US18175295

申请日：2023-02-27

Applicant: Delphi Technologies IP Limited

Inventor： David Paul Buehler ,  Kevin M. Gertiser ,  David W. Ihms ,  Mark Wendell Gose

IPC: H02M7/00 ,  H05K1/14 ,  H05K1/18

CPC classification number: H02M7/003 ,  H05K1/145 ,  H05K1/181 ,  H05K2201/042 ,  H05K2201/10166

Abstract: A power module includes: a first substrate having an outer surface and an inner surface, the first substrate extending from a first longitudinal end toward a second longitudinal end; a power switch including a semiconductor die, the power switch being coupled to the inner surface of the first substrate; a second substrate having an outer surface and an inner surface, the power switch being coupled to the inner surface of the second substrate, the second substrate extending from a first longitudinal end toward a second longitudinal end, wherein the first longitudinal end of the first substrate is longitudinally offset from the first longitudinal end of the second substrate; a first electrically conductive spacer coupled to inner surface of the first substrate and to the inner surface of the second substrate; and a flex circuit coupled to the power switch.

公开(公告)号：US20240098875A1

公开(公告)日：2024-03-21

申请号：US18269599

申请日：2021-05-27

Applicant: QKM TECHNOLOGY (DONG GUAN) CO., LTD

Inventor： Jinbo SHI ,  Lihui CHEN ,  Chunhua YU ,  Qi SHA ,  Hong LIU ,  Hong WANG

IPC: H05K1/02 ,  B25J9/16 ,  H05K1/14

CPC classification number: H05K1/0203 ,  B25J9/161 ,  H05K1/144 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/066

Abstract: Provided are a driver controller integrated board, a control system, and a robot. The driver controller integrated board includes a control module (1), a drive module (2), and a first substrate (3). The control module (1) and the drive module (2) are disposed on the first substrate (3), and the control module (1) is electrically connected to the drive module (2).