公开(公告)号：US09801283B2

公开(公告)日：2017-10-24

申请号：US14334688

申请日：2014-07-18

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kazuto Ogawa ,  Takashi Watanabe ,  Junya Shimakawa

IPC: H05K3/00 ,  H05K1/14 ,  H05K3/34

CPC classification number: H05K3/0052 ,  H05K1/141 ,  H05K3/3442 ,  H05K2201/049 ,  H05K2201/0909 ,  H05K2201/09181 ,  H05K2201/09645 ,  H05K2201/10636 ,  H05K2203/0191 ,  H05K2203/1563 ,  Y02P70/611 ,  Y10T29/4913

Abstract: A method of producing electronic components each including a substrate-type terminal and a device connected to the substrate-type terminal is performed such that the substrate-type terminal includes a substrate body including a rectangular or substantially rectangular first principal surface extending in first and second directions perpendicular or substantially perpendicular to each other. The device is disposed on the first principal surface. The method includes supporting a substrate that is to become an assembly in which the plurality of substrate-type terminals are arranged in a matrix using a first support member, cutting the substrate supported by the first support member into the plurality of substrate-type terminals, and mounting the device on the first principal surface of the substrate body of each of the plurality of substrate-type terminals obtained by cutting.

公开(公告)号：US09711894B2

公开(公告)日：2017-07-18

申请号：US15161291

申请日：2016-05-23

Applicant: FOXCONN INTERCONNECT TECHNOLOGY LIMITED

Inventor： Ru-Yang Guo ,  Hai-Li Wang ,  Shuai-Hui Huang ,  Jian-Fang Li ,  Qing-Man Zhu ,  Jerry Wu

IPC: H01R13/66 ,  H01R13/627 ,  H05K1/02 ,  H01R29/00

CPC classification number: H01R13/6275 ,  H01R13/6658 ,  H01R29/00 ,  H05K1/0292 ,  H05K2201/0909 ,  H05K2201/09127

Abstract: An electrical connector comprises a printed circuit board module including a printed circuit board (PCB) and a plurality of electrical elements disposed on the PCB, the PCB includes a mating end for mating with a mating connector and a plurality of conductive paths electrically connecting with the electrical elements; wherein the PCB includes a fracture surface, and the plurality of conductive paths are exposed to the fracture surface.

公开(公告)号：US09501736B2

公开(公告)日：2016-11-22

申请号：US15013939

申请日：2016-02-02

Applicant: NEOLOGY, INC.

Inventor： Paul Elizondo ,  John Azevedo

IPC: G06K19/07 ,  G06K19/077 ,  H04J3/06 ,  G06K7/00 ,  G06Q10/08 ,  G06K7/10 ,  H05K1/02 ,  H05K1/14 ,  H05K3/30

CPC classification number: G06K7/10475 ,  G06K7/0008 ,  G06K7/10029 ,  G06K7/10039 ,  G06K19/0723 ,  G06K19/07796 ,  G06K19/07798 ,  G06Q10/08 ,  H04J3/0641 ,  H05K1/02 ,  H05K1/0266 ,  H05K1/0268 ,  H05K1/142 ,  H05K3/30 ,  H05K2201/0909 ,  H05K2201/09127

Abstract: A breakaway RFID tag is configured such that it comprises part of a Printed Circuit Board Assembly (PCB). Thus, the breakaway RFID tag can be used to track the PCB as it migrates through a manufacturing process. In one embodiment, the RFID tag can be assembled first and then used to track the PCB as it is populated with components and installed into larger assemblies and ultimately into the end device. Once the PCB is installed into a larger assembly or the end device, the breakaway RFID tag is configured such that it can be broken off and attached to the outside of the larger assembly or end device.

公开(公告)号：US09433098B2

公开(公告)日：2016-08-30

申请号：US13748341

申请日：2013-01-23

Applicant: Mutual-Tek Industries Co., Ltd.

Inventor： Shi Yu Chiou ,  Hsu-Tung Chen

IPC: H05K3/02 ,  H05K3/46 ,  B32B37/02 ,  B32B37/18 ,  B32B38/10 ,  H05K3/00 ,  H05K1/02 ,  H05K3/36 ,  B32B37/14

CPC classification number: H05K3/0064 ,  B32B37/02 ,  B32B37/144 ,  B32B37/18 ,  B32B38/10 ,  H05K1/0278 ,  H05K3/0052 ,  H05K3/365 ,  H05K3/4691 ,  H05K2201/0909 ,  Y10T156/1056 ,  Y10T225/307 ,  Y10T225/321 ,  Y10T225/325

Abstract: A method of manufacturing a combined circuit board includes the following steps. First, through portions (TPs) arranged in a predetermined format are formed in a rigid substrate (RS) such that the RS is divided into a predetermined removed region (PRR1) and a predetermined reserved region (PRR2) according to the arrangement of the TPs. Next, a conductive bonding layer (CBL) and a flexible circuit board (FCB) are respectively laminated on two opposite sides of the RS and part of a dielectric bonding layer of the CBL fills the TPs. Next, the RS, the FCB and the CBL are bent according to the TPs such that the PRR2 is bent at the TPs relative to the PRR1. Finally, part of the RS located at the PRR1 and part of the CBL corresponding to the PRR1 are removed to form an indentation to expose part of the FCB.

Abstract translation: 一种组合电路板的制造方法包括以下步骤。 首先，以刚性衬底（RS）形成通过以预定格式布置的部分（TP），使得根据TP的布置将RS划分为预定去除区域（PRR1）和预定保留区域（PRR2） 。 接下来，在RS的两个相对侧上分别层压导电接合层（CBL）和柔性电路板（FCB），并且CBL的介电接合层的一部分填充TP。 接下来，RS，FCB和CBL根据TP弯曲，使得PRR2相对于PRR1在TP处弯曲。 最后，删除位于PRR1的部分RS和对应于PRR1的CBL的一部分，以形成一个缩进以暴露部分FCB。

公开(公告)号：US20160165726A1

公开(公告)日：2016-06-09

申请号：US14686743

申请日：2015-04-14

Applicant: Samsung Display Co., Ltd.

Inventor： Jae Sok LEE ,  Seung Chang WOO

IPC: H05K1/14 ,  H05K1/18

CPC classification number: H05K1/147 ,  H05K1/0292 ,  H05K1/189 ,  H05K2201/0909 ,  H05K2201/10128

Abstract: A curved display device and method for manufacturing the same is provided. The method for manufacturing a curved display device may include providing a display panel, a plurality of signal transfer elements, and a plurality of printed circuit boards, connecting one end of each of the signal transfer elements to the display panel and connecting the other end of each of the signal transfer elements to one of the printed circuit boards, on which one or more division guide portions are formed, dividing each of the printed circuit board into a plurality of sub printed circuit boards through cutting of the division guide portions; and bending the display panel connected to the sub printed circuit boards so that the display panel has a curvature.

Abstract translation: 提供一种弯曲显示装置及其制造方法。 用于制造弯曲显示装置的方法可以包括提供显示面板，多个信号传送元件和多个印刷电路板，将每个信号传送元件的一端连接到显示面板并将另一端 每个信号传送元件连接到其上形成有一个或多个分割引导部分的一个印刷电路板，通过切割分割引导部分将印刷电路板分成多个副印刷电路板; 并弯曲连接到副印刷电路板的显示面板，使得显示面板具有曲率。

公开(公告)号：US09295151B2

公开(公告)日：2016-03-22

申请号：US14000568

申请日：2012-02-01

Applicant: Masami Hasegawa ,  Satoshi Hirayama ,  Naoki Kito

Inventor： Masami Hasegawa ,  Satoshi Hirayama ,  Naoki Kito

IPC: H05K1/03 ,  H05K3/00 ,  H05K3/40 ,  H01L23/13 ,  H01L23/10 ,  H01L23/498 ,  C04B41/00 ,  H05K1/14 ,  H01L23/15

CPC classification number: H05K1/0306 ,  C04B41/0036 ,  H01L23/10 ,  H01L23/13 ,  H01L23/15 ,  H01L23/49805 ,  H01L2924/0002 ,  H05K1/14 ,  H05K3/0029 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/403 ,  H05K2201/017 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/0909 ,  H05K2201/09154 ,  H01L2924/00

Abstract: A wiring substrate includes a substrate main body which is formed of a ceramic laminate and has a rectangular shape in plan view, and which has a front surface and a back surface and has four side surfaces, each being located between the front surface and the back surface, and having a groove surface located on a side toward the front surface and a fracture surface located on a side toward the back surface; and a metalized layer which is formed on the front surface of the substrate main body so as to extend along the four side surfaces, and which has a rectangular frame shape in plan view, wherein a horizontal surface of the ceramic laminate of the substrate main body is exposed between the metalized layer and the groove surface of each side surface of the substrate main body.

Abstract translation: 布线基板包括由陶瓷层叠体形成的矩阵形状的基板主体，并且具有前表面和后表面，并且具有四个侧表面，每个侧表面位于前表面和背面之间 表面，并且具有位于朝向前表面的一侧的凹槽表面和位于朝向后表面的一侧的断裂表面; 以及金属化层，其形成在所述基板主体的前表面上，以便沿着所述四个侧表面延伸，并且在平面图中具有矩形框架形状，其中所述基板主体的陶瓷层叠体的水平表面 在金属化层与基板主体的各侧面的槽面之间露出。

公开(公告)号：US09210811B2

公开(公告)日：2015-12-08

申请号：US14095878

申请日：2013-12-03

Applicant: FuKui Precision Component (Shenzhen) Co., Ltd. ,  Zhen Ding Technology Co., Ltd.

Inventor： Biao Li

IPC: H05K1/00 ,  H05K1/14 ,  H05K3/36 ,  H05K3/46

CPC classification number: H05K1/14 ,  H05K3/361 ,  H05K3/4691 ,  H05K2201/0909 ,  H05K2201/09109 ,  H05K2201/09127 ,  Y10T29/302

Abstract: A compact rigid-flexible board includes two flexible PCBs, two rigid substrates, a third trace layer and a fourth trace layer. The first flexible PCB includes a first depressing portion, a first exposed portion and a third depressing portion, and a separated second exposed portion. The second flexible PCB includes fourth and fifth depressing portions, and a second exposed portion. The first rigid substrate includes sixth, seventh, and eighth depressing portions. The second rigid substrate includes ninth and tenth depressing portions. The third trace layer, the sixth, first, fourth, and ninth depressing portions and the fourth trace layer are stacked in sequence. The third trace layer, the seven, second, fifth, and tenth depressing portions, and the fourth trace layer are stacked in sequence. The third trace layer and the eighth and third depressing portions are stacked in sequence.

Abstract translation: 紧凑的刚性柔性板包括两个柔性PCB，两个刚性基板，第三轨迹层和第四轨迹层。 第一柔性PCB包括第一按压部分，第一暴露部分和第三按压部分，以及分离的第二暴露部分。 第二柔性PCB包括第四和第五按压部分和第二暴露部分。 第一刚性基板包括第六，第七和第八按压部分。 第二刚性基板包括第九和第十按压部。 第三迹线层，第六，第一，第四和第九按压部分和第四迹线层依次层叠。 第三迹线层，七，第二，第五和第十按压部分和第四迹线层依次层叠。 第三迹线层和第八和第三按压部分依次层叠。

公开(公告)号：US20150334823A1

公开(公告)日：2015-11-19

申请号：US14281733

申请日：2014-05-19

Applicant: Dyi-Chung HU

Inventor： Dyi-Chung HU

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H01L23/15 ,  H05K1/03

CPC classification number: H01L23/15 ,  H01L23/13 ,  H01L23/145 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K1/0271 ,  H05K1/0284 ,  H05K1/0306 ,  H05K1/111 ,  H05K1/112 ,  H05K1/181 ,  H05K3/0052 ,  H05K3/4605 ,  H05K2201/068 ,  H05K2201/0909 ,  H05K2201/09154

Abstract: Substrate components for packaging IC chips and electronic device packages are disclosed. A substrate component for packaging IC chips comprises: a glass core base with at least one conductive through via connecting a combination of metallization and dielectric structures on both an upper surface and a lower surface of the glass core base; and, tapered edges created at a peripheral region of the glass core base; wherein dielectric layers are disposed over the tapered edges at the peripheral region of the glass core base. In accordance with an embodiment of the invention, the dielectric layers have a substantial planar upper surface, a lower surface conformably interfaced with the tapered edges at peripheral region of the glass core base, and a steep cutting face with the tapered edges of the glass core base. Alternatively, the tapered edges at peripheral region of the glass core base are not covered by the dielectric layers, and an encapsulated material sealing the tapered edges at peripheral region of the glass core base.

Abstract translation: 公开了用于封装IC芯片和电子器件封装的衬底元件。 用于封装IC芯片的基板部件包括：具有至少一个导电通孔的玻璃芯基座，该导电通孔在玻璃芯基座的上表面和下表面上连接金属化和电介质结构的组合; 以及在玻璃核心基座的周边区域处产生的锥形边缘; 其中电介质层设置在玻璃芯基底的周边区域的锥形边缘上方。 根据本发明的实施例，电介质层具有基本的平面上表面，下表面与玻璃芯基底的周边区域处的锥形边缘顺应地接合，以及具有玻璃芯的锥形边缘的陡峭切割面 基础。 或者，玻璃芯基部的周边区域的锥形边缘不被电介质层覆盖，并且在玻璃芯基部的周边区域封装有锥形边缘的封装材料。

公开(公告)号：US20150247609A1

公开(公告)日：2015-09-03

申请号：US14712734

申请日：2015-05-14

Applicant: LedEngin, Inc.

Inventor： XIANTAO YAN

IPC: F21K99/00 ,  F21V5/00

CPC classification number: F21V19/003 ,  F21K9/90 ,  F21V5/007 ,  F21V5/04 ,  F21V9/30 ,  F21V21/14 ,  F21V23/005 ,  F21V29/70 ,  F21Y2101/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/08 ,  H01L33/48 ,  H01L33/58 ,  H01L33/647 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K1/0278 ,  H05K1/0283 ,  H05K1/0306 ,  H05K1/144 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/0097 ,  H05K3/4626 ,  H05K3/4688 ,  H05K2201/042 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/09263 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2203/0143 ,  H05K2203/171 ,  H01L2924/00

Abstract: A flexible sheet of light-emitting diode (LED) light emitters includes a support substrate having a thermally conductive material. The flexible sheet of LED light emitters also has an LED emitter sheet overlying the support substrate, and the LED emitter sheet including a plurality of LED light emitters. The flexible sheet of LED light emitters also has a flexible circuit sheet overlying the LED emitter sheet, and a phosphor sheet overlying the flexible circuit sheet. The phosphor sheet includes a wave-length converting material. The flexible sheet of LED light emitters also has a lens sheet overlying the phosphor sheet. The lens sheet includes a plurality of lenses.

Abstract translation: 发光二极管（LED）发光体的柔性片包括具有导热材料的支撑基板。 LED光发射器的柔性片还具有覆盖在支撑基板上的LED发射片，并且LED发射片包括多个LED发光体。 LED发光体的柔性片也具有覆盖LED发射片的柔性电路片和覆盖柔性电路片的荧光体片。 荧光体片包括波长转换材料。 LED发光体的柔性片也具有覆盖荧光体片的透镜片。 透镜片包括多个透镜。

公开(公告)号：US09079264B2

公开(公告)日：2015-07-14

申请号：US13867439

申请日：2013-04-22

Applicant: MITSUBISHI MATERIALS CORPORATION

Inventor： Hiroshi Tonomura ,  Takeshi Kitahara ,  Hiroya Ishizuka ,  Yoshirou Kuromitsu ,  Yoshiyuki Nagatomo

IPC: B44C1/22 ,  B23K1/20 ,  H01L21/48 ,  H01L23/15 ,  H01L23/373 ,  H01L23/40 ,  H01L23/473 ,  H05K3/38 ,  C04B35/584 ,  C04B37/02 ,  H05K1/03 ,  H05K3/00

CPC classification number: B23K1/20 ,  C04B35/584 ,  C04B37/026 ,  C04B2235/72 ,  C04B2235/721 ,  C04B2235/723 ,  C04B2235/96 ,  C04B2237/121 ,  C04B2237/128 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/52 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/86 ,  H01L21/4807 ,  H01L21/481 ,  H01L23/15 ,  H01L23/3735 ,  H01L23/4006 ,  H01L23/473 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/1305 ,  H01L2924/13055 ,  H05K1/0306 ,  H05K3/0029 ,  H05K3/0052 ,  H05K3/38 ,  H05K3/381 ,  H05K2201/0355 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2203/095 ,  Y10T29/49155 ,  H01L2924/00

Abstract: Disclosed is a ceramic substrate including silicon in which the concentration of a silicon oxide and a silicon composite oxide in the surface thereof is less than or equal to 2.7 Atom %.

Abstract translation: 公开了包括硅的陶瓷基板，其表面中的氧化硅和硅复合氧化物的浓度小于或等于2.7原子％。