公开(公告)号：US20140184081A1

公开(公告)日：2014-07-03

申请号：US14197288

申请日：2014-03-05

Applicant: TSMC Solid State Lighting Ltd.

Inventor： Wei-Yu Yeh ,  Chih-Hsuan Sun

IPC: H05B33/08

CPC classification number: H05B33/0863 ,  H05B33/0824 ,  H05B33/0869

Abstract: A light-emitting diode (LED) lamp includes a number of different color LEDs that can be turned on and off in different combinations using an external switch operable by a user. A user or a controller can adjust the color temperature of light output by the lamp. The color temperature change may be a user preference and can compensate for decreased phosphor efficiency over time.

Abstract translation: 发光二极管（LED）灯包括许多不同颜色的LED，可以使用可由用户操作的外部开关以不同的组合打开和关闭。 用户或控制器可以调节灯输出的光的色温。 色温变化可能是用户偏好，并且可以补偿随时间降低的磷光体效率。

公开(公告)号：US20140159096A1

公开(公告)日：2014-06-12

申请号：US14180390

申请日：2014-02-14

Applicant: TSMC Solid State Lighting Ltd.

Inventor： Hsing-Kuo Hsia ,  Chih-Kuang Yu

IPC: H01L33/38 ,  H01L33/50

CPC classification number: H01L33/382 ,  H01L24/24 ,  H01L24/82 ,  H01L33/0095 ,  H01L33/486 ,  H01L33/50 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/73267 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2933/0033 ,  H01L2924/00

Abstract: The present disclosure provides a method of fabricating a light emitting diode (LED) package. The method includes bonding a plurality of separated light emitting diode (LED) dies to a substrate, wherein each of the plurality of separated LED dies includes an n-doped layer, a quantum well active layer, and a p-doped layer; depositing an isolation layer over the plurality of separated LED dies and the substrate; etching the isolation layer to form a plurality of via openings to expose portions of each LED die and portions of the substrate; forming electrical interconnects over the isolation layer and inside the plurality of via openings to electrically connect between one of the doped layers of each LED die and the substrate; and dicing the plurality of separated LED dies and the substrate into a plurality of LED packages.

Abstract translation: 本公开提供一种制造发光二极管（LED）封装的方法。 所述方法包括将多个分离的发光二极管（LED）管芯接合到衬底，其中所述多个分离的LED管芯中的每一个包括n掺杂层，量子阱有源层和p掺杂层; 在所述多个分离的LED管芯和所述衬底上沉积隔离层; 蚀刻隔离层以形成多个通路孔，以暴露每个LED管芯的部分和衬底的部分; 在所述隔离层和所述多个通孔开口内部形成电互连，以电连接每个LED管芯的所述掺杂层之一和所述衬底; 以及将所述多个分离的LED管芯和所述衬底切割成多个LED封装。

公开(公告)号：US20140151740A1

公开(公告)日：2014-06-05

申请号：US14174891

申请日：2014-02-07

Applicant: TSMC Solid State Lighting Ltd.

Inventor： Chi Xiang Tseng ,  Hsiao-Wen Lee

IPC: H01L33/50

CPC classification number: H01L33/505 ,  H01L33/54 ,  H01L2224/14 ,  H01L2933/0041

Abstract: An optical emitter includes micro-structure phosphor coating on a light-emitting diode die mounted on a package substrate. The micro-structures are transferred onto a micro-structure phosphor coating precursor by patterning and curing the precursor or by curing the precursor through a mold. The micro-structures are half spheroids, three-sided pyramids, or six-sided pyramids.

Abstract translation: 光发射器包括安装在封装衬底上的发光二极管管芯上的微结构磷光体涂层。 通过图案化和固化前体或通过模具固化前体将微结构转移到微结构荧光体涂层前体上。 微结构是半球体，三面体金字塔或六边形金字塔。

公开(公告)号：US20140078757A1

公开(公告)日：2014-03-20

申请号：US13790092

申请日：2013-03-08

Applicant: TSMC SOLID STATE LIGHTING LTD.

Inventor： Kuan-Chun Chen ,  Hao-Chung Kuo ,  You-Da Lin ,  Zhen-Yu Li

IPC: H01L33/64 ,  F21V21/00

CPC classification number: H01L25/0753 ,  F21S6/00 ,  F21V3/049 ,  F21V7/22 ,  F21V21/00 ,  F21V29/74 ,  F21V29/89 ,  F21Y2101/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L27/156 ,  H01L33/0079 ,  H01L33/06 ,  H01L33/20 ,  H01L33/24 ,  H01L33/32 ,  H01L33/36 ,  H01L33/502 ,  H01L33/62 ,  H01L33/64 ,  H01L33/642 ,  H01L33/647 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The present disclosure involves a lighting apparatus. The lighting apparatus includes a polygon die. The polygon die includes a plurality of light-emitting diodes (LEDs). Each LED includes a plurality of epi-layers, the epi-layers containing a p-type layer, an n-type layer, and a multiple quantum well (MQW) disposed between the p-type layer and the n-type layer. Each LED includes a p-type electrode and an n-type electrode electrically coupled to the p-type layer and the n-type layer, respectively. The polygon die also includes a submount to which each of the LEDs is coupled. The p-type and the n-type electrodes are located between the submount and the epi-layers. The submount contains a plurality of conductive elements configured to electrically couple at least a portion of the plurality of LEDs in series.

Abstract translation: 本公开涉及一种照明装置。 照明装置包括多边形模具。 多边形管芯包括多个发光二极管（LED）。 每个LED包括多个外延层，外延层包含设置在p型层和n型层之间的p型层，n型层和多量子阱（MQW）。 每个LED包括分别电耦合到p型层和n型层的p型电极和n型电极。 多边形管芯还包括每个LED耦合到的基座。 p型和n型电极位于底座和外延层之间。 底座包含多个导电元件，其被配置为将多个LED的至少一部分串联耦合。

公开(公告)号：US20130299855A1

公开(公告)日：2013-11-14

申请号：US13941784

申请日：2013-07-15

Applicant: TSMC Solid State Lighting Ltd.

Inventor： Hao-Wei Ku ,  Chung Yu Wang ,  Yu-Sheng Tang ,  Hain-Hung Chen ,  Hao-Yu Yang ,  Ching-Yi Chen ,  Hsiao-Wen Lee ,  Chi Xiang Tseng ,  Sheng-Shin Guo ,  Tien-Ming Lin ,  Shang-Yu Tsai

IPC: H01L27/15

CPC classification number: H01L27/15 ,  H01L24/97 ,  H01L25/167 ,  H01L33/486 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/8592 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An optical emitter is fabricated by bonding a Light-Emitting Diode (LED) die to a package wafer, electrically connecting the LED die and the package wafer, forming a phosphor coating over the LED die on the package wafer, molding a lens over the LED die on the package wafer, molding a reflector on the package wafer, and dicing the wafer into at least one optical emitter.

Abstract translation: 通过将发光二极管（LED）裸片结合到封装晶片，电连接LED管芯和封装晶片，在封装晶片上的LED管芯上形成荧光体涂层，在LED上模制透镜来制造光发射器 在封装晶片上模制，在封装晶片上模制反射器，并将晶片切割成至少一个光发射器。

公开(公告)号：US20130045556A1

公开(公告)日：2013-02-21

申请号：US13632212

申请日：2012-10-01

Applicant: TSMC Solid State Lighting Ltd.

Inventor： Hsin-Chieh Huang

IPC: H01L33/20

CPC classification number: H01L33/22 ,  H01L33/04 ,  H01L33/24

Abstract: A device includes a textured substrate having a trench extending from a top surface of the textured substrate into the textured substrate, wherein the trench comprises a sidewall and a bottom. A light-emitting device (LED) includes an active layer over the textured substrate. The active layer has a first portion parallel to the sidewall of the trench and a second portion parallel to the bottom of the trench.

Abstract translation: 一种器件包括纹理化衬底，其具有从纹理化衬底的顶表面延伸到纹理衬底中的沟槽，其中沟槽包括侧壁和底部。 发光器件（LED）包括纹理衬底上的有源层。 有源层具有平行于沟槽侧壁的第一部分和平行于沟槽底部的第二部分。

公开(公告)号：US09625107B2

公开(公告)日：2017-04-18

申请号：US14316942

申请日：2014-06-27

Applicant: TSMC Solid State Lighting Ltd.

Inventor： Sheng-Shin Guo ,  Wei-Yu Yeh ,  Chih-Hsuan Sun ,  Pei-Wen Ko

IPC: F21K9/232 ,  F21K99/00 ,  F21V3/04 ,  F21V7/04 ,  F21W121/00 ,  F21Y101/00 ,  F21K9/64 ,  F21Y115/10 ,  F21Y107/60

CPC classification number: F21K9/64 ,  F21K9/232 ,  F21V3/08 ,  F21V7/041 ,  F21W2121/00 ,  F21Y2101/00 ,  F21Y2107/60 ,  F21Y2115/10

Abstract: A lighting apparatus includes a first substrate, a plurality of first light-emitting devices disposed on the first substrate, a second substrate disposed over the first substrate, and a plurality of second light-emitting devices disposed on the second substrate. A reflective surface is disposed between the first substrate and the second substrate. The reflective surface is configured to reflect light emitted by at least some of the first light-emitting devices in a direction that is at least partially toward the first substrate. The reflective surface has one of: a saw-patterned side view profile, or a curved side view profile that is free of having an inflection point.

公开(公告)号：US09461204B2

公开(公告)日：2016-10-04

申请号：US14645472

申请日：2015-03-12

Applicant: TSMC Solid State Lighting Ltd.

Inventor： Hsin-Chieh Huang

IPC: H01L33/60 ,  H01L33/22 ,  H01L33/20 ,  H01L33/46 ,  H01L33/00

CPC classification number: H01L33/22 ,  H01L33/0066 ,  H01L33/0075 ,  H01L33/0079 ,  H01L33/20 ,  H01L33/46 ,  H01L2933/0025

Abstract: A device includes a textured substrate, which further includes a plurality of trenches. Each of the plurality of trenches includes a first sidewall and a second sidewall opposite the first sidewall. A plurality of reflectors configured to reflect light is formed, with each of the plurality of reflectors being on one of the first sidewalls of the plurality of trenches. The second sidewalls of the plurality of trenches are substantially free from any reflector.

公开(公告)号：US09349712B2

公开(公告)日：2016-05-24

申请号：US14626968

申请日：2015-02-20

Applicant: TSMC Solid State Lighting Ltd.

Inventor： Chih-Kuang Yu ,  Chyi Shyuan Chern

IPC: H01L25/075 ,  H01L27/15 ,  H01L33/00 ,  H01L33/62 ,  H01L33/32 ,  H01L33/46 ,  H01L33/48 ,  H01L33/50

CPC classification number: H01L25/0753 ,  H01L27/153 ,  H01L33/0079 ,  H01L33/32 ,  H01L33/46 ,  H01L33/486 ,  H01L33/50 ,  H01L33/507 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The present disclosure provides one embodiment of a light-emitting structure. The light-emitting structure includes a carrier substrate having first metal features; a transparent substrate having second metal features; a plurality of light-emitting diodes (LEDs) bonded with the carrier substrate and the transparent substrate, sandwiched between the carrier substrate and the transparent substrate; and metal pillars bonded to the carrier substrate and the transparent substrate, each of the metal pillars being disposed between adjacent two of the plurality of LEDs, wherein the first metal features, the second metal features and the metal pillars are configured to electrically connect the plurality of LEDs.

Abstract translation: 本公开提供了发光结构的一个实施例。 发光结构包括具有第一金属特征的载体衬底; 具有第二金属特征的透明基板; 与载体基板和透明基板结合的多个发光二极管（LED）夹在载体基板和透明基板之间; 以及结合到所述载体基板和所述透明基板的金属柱，每个所述金属柱设置在所述多个LED的相邻两个之间，其中所述第一金属特征，所述第二金属特征和所述金属柱被配置为电连接所述多个 的LED。

公开(公告)号：US09347624B2

公开(公告)日：2016-05-24

申请号：US14598282

申请日：2015-01-16

Applicant: TSMC Solid State Lighting Ltd.

Inventor： Pei-Wen Ko ,  Wei-Yu Yeh

IPC: F21V13/02 ,  F21S6/00 ,  F21V17/12 ,  F21K99/00 ,  F21V29/70 ,  F21Y101/02 ,  F21V29/76 ,  F21V29/50

CPC classification number: F21K9/54 ,  F21K9/62 ,  F21S6/00 ,  F21V13/02 ,  F21V17/12 ,  F21V29/50 ,  F21V29/70 ,  F21V29/763 ,  F21Y2115/10

Abstract: The present disclosure involves a lighting apparatus. The lighting apparatus includes a photonic device that generates light. The lighting apparatus includes a printed circuit board (PCB) on which the photonic device is located. The lighting apparatus includes a diffuser cap having a curved profile covering the PCB and the photonic device. The diffuser cap has a textured surface for scattering light generated by the photonic device. The lighting apparatus includes a thermally conductive cup that surrounds the diffuser cap and thermal conductively coupled to the PCB. The cup has a reflective inner surface that reflects light transmitting through the diffuser cap. The lighting apparatus includes a heat dissipation structure for dissipating heat generated by the photonic device. The heat dissipation structure is thermally coupled to the cup.