DEPOSITION APPARATUS AND METHOD OF DEPOSITING THIN LAYER USING THE SAME
    91.
    发明申请
    DEPOSITION APPARATUS AND METHOD OF DEPOSITING THIN LAYER USING THE SAME 审中-公开
    沉积装置和使用该沉积装置沉积薄层的方法

    公开(公告)号:US20140134341A1

    公开(公告)日:2014-05-15

    申请号:US13866941

    申请日:2013-04-19

    CPC classification number: C23C14/24 B05D1/02 B05D1/36

    Abstract: In an aspect, a deposition apparatus including a deposition chamber, a first group deposition source unit, and a second group deposition source unit is provided. The deposition chamber may include a first standby area, a deposition area, and a second standby area. The deposition area may be located between the first and second standby areas. The first group deposition source unit may move to the deposition area from the first standby area and provides a first group deposition material to a base member located in the deposition area. The second group deposition source unit may move to the deposition area from the second standby area and provides a second group deposition material to the base member.

    Abstract translation: 一方面,提供了包括沉积室,第一组沉积源单元和第二组沉积源单元的沉积设备。 沉积室可以包括第一备用区域,沉积区域和第二备用区域。 沉积区域可以位于第一和第二备用区域之间。 第一组沉积源单元可以从第一备用区域移动到沉积区域,并且将第一组沉积材料提供给位于沉积区域中的基底构件。 第二组沉积源单元可以从第二备用区域移动到沉积区域,并且向基底构件提供第二组沉积材料。

    CHIP FOR ELECTROPHORESIS AND METHOD FOR PRODUCING SAME
    93.
    发明申请
    CHIP FOR ELECTROPHORESIS AND METHOD FOR PRODUCING SAME 审中-公开
    电泳用芯片及其制造方法

    公开(公告)号:US20140110261A1

    公开(公告)日:2014-04-24

    申请号:US14127614

    申请日:2012-06-19

    CPC classification number: B01D57/02 B05D1/36 G01N27/44747

    Abstract: A chip (10) for electrophoresis is provided, the chip including a gel (9) composed of a polymer prepared by polymerizing a monomer, and a support (1) configured to support the gel (9). In the chip (10) for electrophoresis, a surface of the support (1) in contact with the gel (9) is covered with a surface treatment compound (4) containing the monomer or a derivative of the monomer.

    Abstract translation: 提供了用于电泳的芯片(10),该芯片包括由通过聚合单体制备的聚合物构成的凝胶(9)和构造成支持凝胶(9)的载体(1)。 在用于电泳的芯片(10)中,与含有单体或单体衍生物的表面处理化合物(4)覆盖与凝胶(9)接触的载体(1)的表面。

    SURFACE COATING SYSTEM AND METHOD OF USING SURFACE COATING SYSTEM
    94.
    发明申请
    SURFACE COATING SYSTEM AND METHOD OF USING SURFACE COATING SYSTEM 有权
    表面涂层体系及使用表面涂层体系的方法

    公开(公告)号:US20140087070A1

    公开(公告)日:2014-03-27

    申请号:US14119999

    申请日:2012-05-25

    Applicant: DIVERSEY, INC.

    Abstract: A coating system for a surface (such as a floor) including a liquid adhesive layer composition including a heat-activated adhesive that forms an adhesive layer upon drying after application to a surface, and a liquid maintenance layer composition comprising a dispersible polymer that forms a maintenance layer upon drying after application to the adhesive layer. The adhesive layer and the maintenance layer may form a peelable coating. An adhesive strength between the adhesive layer and the maintenance layer may be greater than an adhesive strength between the adhesive layer and the surface. The peelable coating may have a tensile strength that is greater than the adhesive strength between the adhesive layer and the surface. The peelable coating may be configured to be peeled from the surface without the adhesive layer and the maintenance layer separating from one another.

    Abstract translation: 一种用于表面(例如地板)的涂覆系统,包括液体粘合剂层组合物,该涂料体系包含在施加到表面之后在干燥时形成粘合剂层的热活化粘合剂,以及液体维持层组合物,其包含形成 维护层在施加到粘合剂层之后干燥。 粘合剂层和维护层可以形成可剥离的涂层。 粘合剂层和维护层之间的粘合强度可以大于粘合剂层和表面之间的粘合强度。 可剥离涂层的拉伸强度可以大于粘合剂层和表面之间的粘合强度。 可剥离涂层可以被配置为从表面剥离而没有粘合剂层和维护层彼此分离。

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