公开(公告)号：US11661495B2

公开(公告)日：2023-05-30

申请号：US17255473

申请日：2019-06-20

Applicant: KYOCERA Corporation

Inventor： Chie Chikara

IPC: B32B3/10 ,  C08K5/03 ,  B32B15/085 ,  B32B15/20 ,  B32B27/20 ,  B32B27/32 ,  C08K3/36 ,  H05K1/03

CPC classification number: C08K5/03 ,  B32B15/085 ,  B32B15/20 ,  B32B27/20 ,  B32B27/325 ,  C08K3/36 ,  H05K1/0373 ,  B32B2250/03 ,  B32B2250/40 ,  B32B2264/1021 ,  B32B2307/3065 ,  B32B2457/08 ,  H05K2201/012

Abstract: An organic board of the present disclosure has a resin component comprising at least one resin selected from the group consisting of an epoxy resin, a polyimide resin, a phenolic resin, an amino resin, a polyester resin, a polyphenylene resin, a cyclic olefin resin, and a Teflon (registered trademark) resin as the main component, and a non-resin component including at least one of an inorganic filler and a flame retardant, in which the non-resin component is dispersed in the resin component, at least a part of the non-resin component is agglomerated to form an aggregate, a part of the resin component forms a resin material part having a particle shape, the resin material part exists within the aggregate, or the resin component forms a matrix phase surrounding the aggregate, and there are voids at some interfaces between the resin component and the aggregate.

公开(公告)号：US20190055472A1

公开(公告)日：2019-02-21

申请号：US15678813

申请日：2017-08-16

Applicant: International Business Machines Corporation

Inventor： Scott B. King ,  Brandon M. Kobilka ,  Joseph Kuczynski ,  Jason T. Wertz

IPC: C09K21/12 ,  C07F9/12 ,  C07F9/40 ,  C08K5/5357 ,  C08K5/523 ,  C07F9/655 ,  C08K5/5373 ,  C08K5/529 ,  C08K5/5333 ,  C08K5/521 ,  C07F9/113 ,  H05K1/03

CPC classification number: C09K21/12 ,  C07F9/113 ,  C07F9/12 ,  C07F9/2458 ,  C07F9/304 ,  C07F9/4078 ,  C07F9/4084 ,  C07F9/65505 ,  C07F9/65515 ,  C07F9/65586 ,  C08K5/0066 ,  C08K5/521 ,  C08K5/523 ,  C08K5/529 ,  C08K5/5333 ,  C08K5/5357 ,  C08K5/5373 ,  C08L2201/02 ,  H05K1/0326 ,  H05K2201/012

Abstract: A flame-retardant sugar derivative, a process for forming a flame-retardant sugar derivative, and an article of manufacture comprising a flame-retardant sugar derivative are disclosed. The flame-retardant sugar derivative can be synthesized from sorbitol, gluconic acid, or glucaric acid obtained from a bio-based source, and can have at least one phosphoryl or phosphonyl moiety. The process for forming the flame-retardant sugar derivative can include reacting sorbitol, gluconic acid, or glucaric acid and a flame-retardant phosphorus-based molecule to form the flame-retardant sugar derivative.

公开(公告)号：US20190002689A1

公开(公告)日：2019-01-03

申请号：US15744579

申请日：2016-04-08

Applicant: Shengyi Technology Co., Ltd.

Inventor： Guangbing CHEN ,  Xianping ZENG

IPC: C08L71/12 ,  B32B27/28 ,  C08L25/10 ,  C08J5/24 ,  H05K1/03

CPC classification number: C08L71/126 ,  B32B27/00 ,  B32B27/285 ,  B32B2305/076 ,  C08J5/24 ,  C08J2325/10 ,  C08J2371/12 ,  C08J2409/00 ,  C08J2409/06 ,  C08J2425/10 ,  C08J2447/00 ,  C08J2471/12 ,  C08L9/06 ,  C08L25/10 ,  C08L71/12 ,  C08L2312/02 ,  H05K1/034 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0129 ,  H05K2201/015 ,  C08L9/00

Abstract: Provided are a polyphenyl ether resin composition and a prepreg and a laminated board containing same. The polyphenyl ether resin composition comprises the following components: (1) a tetrafunctional or higher multifunctional acrylate-modified thermosetting polyphenyl ether resin; and (2) a vinyl eresin cross-linking agent, the weight of the vinyl resin cross-linking agent being 40-100 parts by weight based on 100 parts by weight of the tetrafunctional or higher multifunctional acrylate-modified thermosetting polyphenyl ether resin. The modified thermosetting polyphenyl ether resin, due to containing a tetrafunctional or higher multifunctional acrylate active group, can cross-link more vinyl resin cross-linking agents. Not only the prepared high-speed electronic circuit substrate has low dielectric constant and dielectric loss, but also double bonds in side chains of the vinyl resin cross-linking agent are reacted completely in a resin curing system, so that the high-speed electronic circuit substrate has a better thermo-oxidative aging resistance.

公开(公告)号：US20180346688A1

公开(公告)日：2018-12-06

申请号：US15611237

申请日：2017-06-01

Applicant: International Business Machines Corporation

Inventor： Sarah K. Czaplewski ,  Brandon M. Kobilka ,  Joseph Kuczynski ,  Jason T. Wertz ,  Jing Zhang

IPC: C08K5/5393 ,  C08K5/5333 ,  C08K5/521 ,  C08K5/5399 ,  C09J9/00 ,  C09J11/06 ,  H05K1/03

CPC classification number: C08K5/5393 ,  C07C69/003 ,  C07C69/007 ,  C07F9/091 ,  C07F9/093 ,  C07F9/113 ,  C07F9/1411 ,  C07F9/1412 ,  C08K5/0066 ,  C08K5/521 ,  C08K5/524 ,  C08K5/5333 ,  C08K5/5399 ,  C08L2201/02 ,  C08L2666/84 ,  C09J9/00 ,  C09J11/06 ,  C09J2203/326 ,  C09J2205/102 ,  H05K1/0353 ,  H05K2201/012 ,  H05K2201/0154

Abstract: A flame-retardant aconitic acid-derived small molecule, a process for forming a flame-retardant polymer, and an article of manufacture comprising a material that contains a flame-retardant aconitic acid-derived small molecule are disclosed. The flame-retardant aconitic acid-derived small molecule can be synthesized from aconitic acid obtained from a bio-based source, and can have at least one phosphoryl or phosphonyl moiety with phenyl, allyl, or thioether substituents. The process for forming the flame-retardant polymer can include reacting an aconitic acid derivative with a flame-retardant phosphorus-based molecule to form a flame-retardant aconitic acid-derived small molecule, and combining the flame-retardant aconitic acid-derived small molecule with a polymer. The material in the article of manufacture can be a resin, adhesive, polymer, etc.

公开(公告)号：US20180324956A1

公开(公告)日：2018-11-08

申请号：US15690946

申请日：2017-08-30

Applicant: Elite Electronic Material (Zhongshan) Co., Ltd.

Inventor： Xiang XIONG ,  Zhilong HU

IPC: H05K3/38 ,  C08J5/24 ,  C08L63/00 ,  B32B15/092 ,  B32B15/20 ,  H05K1/03

CPC classification number: H05K3/389 ,  B32B15/092 ,  B32B15/20 ,  B32B2307/206 ,  B32B2457/08 ,  C08G73/0233 ,  C08J5/24 ,  C08J2363/00 ,  C08J2463/00 ,  C08J2479/04 ,  C08L63/00 ,  C08L2205/02 ,  C08L2205/03 ,  H05K1/0373 ,  H05K1/09 ,  H05K3/007 ,  H05K2201/012 ,  H05K2201/0355

Abstract: Disclosed is an assembly comprising an insulation material and a copper foil disposed on the insulation material, wherein the copper foil has a thickness of less than or equal to 6 μm, and the insulation material is made from a resin composition comprising oxazolidone epoxy resin, oxydianiline type benzoxazine resin and a curing agent. The assembly achieves desirable balanced properties in peel strength, glass transition temperature, dimensional change after reflow, thermal resistance, and dielectric properties.

公开(公告)号：US20180249572A1

公开(公告)日：2018-08-30

申请号：US15841448

申请日：2017-12-14

Applicant: ASIA ELECTRONIC MATERIAL CO., LTD.

Inventor： Wei-Chih Lee ,  Li-Chih Yang ,  Chien-Hui Lee

IPC: H05K1/02 ,  H05K3/28

CPC classification number: H05K1/024 ,  B32B27/08 ,  B32B27/32 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2457/08 ,  H05K1/0274 ,  H05K3/28 ,  H05K3/281 ,  H05K2201/012 ,  H05K2201/0145 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0175 ,  H05K2201/0195 ,  H05K2201/0761 ,  H05K2203/066 ,  H05K2203/161

Abstract: A colored thin covering film is provided, including an upper detached layer, a colored ink film, a low dielectric glue layer, and a lower detached layer. The color ink layer is formed between the upper detached layer and the low dielectric glue layer. The low dielectric glue layer is formed between the colored ink layer and the lower detached layer. The thickness of the colored ink layer is between 1 to 10 μm, and the thickness of the low dielectric glue layer is between 3 to 25 μm, such that a total thickness of the colored ink layer and the low dielectric glue layer is allowed to be between 4 to 35 μm. The colored thin covering film has an extremely low dielectric constant and loss, extremely low ion migration, good adhesion, heat dissipation, high flexibility, and low resilience, and can be processed in a low temperature.

公开(公告)号：US10064266B2

公开(公告)日：2018-08-28

申请号：US13185583

申请日：2011-07-19

Applicant: Kevin J. Fitzpatrick ,  Ryan K. Roth

Inventor： Kevin J. Fitzpatrick ,  Ryan K. Roth

IPC: H01H85/04 ,  H05K1/02 ,  H01H85/46 ,  A47L15/46 ,  H01R12/70

CPC classification number: H05K1/0256 ,  A47L15/46 ,  H01H85/04 ,  H01H85/463 ,  H01R12/7088 ,  H05K1/0263 ,  H05K2201/012 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/09872 ,  H05K2201/10181 ,  H05K2201/10189

Abstract: A printed circuit board to which corresponding wiring connectors such as power wiring connectors, may be connected to couple electrical components and a power supply to the printed circuit board and a control housing, which may be used for operably storing such a printed circuit board.

公开(公告)号：US20180215971A1

公开(公告)日：2018-08-02

申请号：US15744446

申请日：2016-03-02

Applicant: Shengyi Technology Co., Ltd.

Inventor： Guangbing CHEN ,  Xianping ZENG ,  Chiji GUAN

IPC: C09J171/12 ,  C08J5/24 ,  C09J11/04 ,  C09J11/06 ,  H05K1/03 ,  H05K1/02

CPC classification number: C09J171/12 ,  C08G65/485 ,  C08G77/20 ,  C08J5/24 ,  C08J2371/12 ,  C08J2483/07 ,  C08L71/126 ,  C09J11/04 ,  C09J11/06 ,  H05K1/0237 ,  H05K1/0353 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0162 ,  C08L83/04 ,  C08K5/14

Abstract: The present invention relates to a polyphenyl ether resin composition and a use thereof in a high-frequency circuit substrate. The polyphenyl ether resin composition comprises a vinyl-modified polyphenyl ether resin and an organic silicon resin containing unsaturated double bonds and having a three-dimensional net structure. The high-frequency circuit substrate of the present invention has a high glass-transition temperature, a high thermal decomposition temperature, a high interlayer adhesive force, a low dielectric constant and a low dielectric loss tangent, and is very suitable as a circuit substrate of high-speed electronic equipment.

公开(公告)号：US20180201761A1

公开(公告)日：2018-07-19

申请号：US15743930

申请日：2015-12-07

Applicant: Shengyi Technology Co., Ltd.

Inventor： Ying XU ,  Kehong FANG

IPC: C08K5/53 ,  C08K3/22 ,  C08K3/30 ,  C08K5/136 ,  C08G59/50 ,  C08J5/24 ,  B32B5/26 ,  B32B5/02 ,  B32B15/14 ,  H05K1/03

CPC classification number: C08K5/53 ,  B32B5/022 ,  B32B5/024 ,  B32B5/26 ,  B32B15/14 ,  B32B27/04 ,  B32B27/18 ,  B32B27/38 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2457/08 ,  C08G59/38 ,  C08G59/5033 ,  C08G59/621 ,  C08G59/686 ,  C08J5/24 ,  C08J2363/00 ,  C08J2363/02 ,  C08K3/22 ,  C08K3/30 ,  C08K3/34 ,  C08K5/136 ,  C08K2003/2227 ,  C08K2003/3045 ,  C08K2201/005 ,  H05K1/034 ,  H05K1/0373 ,  H05K2201/012

Abstract: The present invention relates to an epoxy resin composition for a copper clad laminate, and an application of the epoxy resin composition. The epoxy resin composition may be used for the preparation of pre-pregs and copper clad laminates. By respectively using brominated bisphenol A and a phosphorus-containing phenolic aldehyde as bromine and phosphorus sources, and adjusting the proportions of the brominated bisphenol A and the phosphorus-containing phenolic aldehyde within the epoxy resin composition, the bromine content is controlled at 5-12%, the phosphorus content is controlled at 0.2-1.5%, and the flame retardancy achieves the level of UL94 V-0. Pre-pregs and laminates manufactured using the epoxy resin composition have reduced halogen content and improved heat resistance. Substrate pressure resistance is improved, moisture absorption is low, adhesion, reactivity and processability are good, comparative tracking index (CTI)>600V is satisfied, and production costs are significantly reduced.

公开(公告)号：US09988520B2

公开(公告)日：2018-06-05

申请号：US15358353

申请日：2016-11-22

Applicant: Chemtura Corporation

Inventor： Larry D. Timberlake ,  Mark V. Hanson

IPC: C08K3/32 ,  C08K5/5317 ,  C08L63/00 ,  C08J5/24 ,  B32B27/06 ,  B32B27/38 ,  C08J5/12 ,  C08J5/10 ,  B32B5/10 ,  H05K1/03 ,  H05K3/46 ,  C08K5/00

CPC classification number: C08K5/5317 ,  B32B5/10 ,  B32B27/06 ,  B32B27/38 ,  B32B2262/101 ,  B32B2307/3065 ,  B32B2363/00 ,  B32B2457/00 ,  B32B2457/08 ,  C08J5/10 ,  C08J5/124 ,  C08J5/24 ,  C08J2363/00 ,  C08J2463/00 ,  C08K5/0066 ,  C08L63/00 ,  C08L2201/02 ,  C08L2203/20 ,  H05K1/0373 ,  H05K3/4626 ,  H05K2201/012 ,  H05K2203/1147 ,  C08K5/5333

Abstract: Resin compositions, e.g., epoxy resin compositions, comprising flame retardant materials obtained by heating phosphonic acid salts at temperatures above 200° C., have excellent properties and exhibit manageable curing behavior. Laminates, composites, molded articles and the like, which have excellent flame retardant properties and physical characteristics, are readily prepared from the resin compositions of the invention.