公开(公告)号：US07745912B2

公开(公告)日：2010-06-29

申请号：US11089995

申请日：2005-03-25

Applicant: Jiun Hann Sir

Inventor： Jiun Hann Sir

IPC: H01L23/495 ,  H01L29/40

CPC classification number: H05K3/3436 ,  H01L2924/15311 ,  H05K3/303 ,  H05K3/42 ,  H05K2201/0133 ,  H05K2201/10378 ,  H05K2203/0191 ,  Y02P70/613

Abstract: An apparatus, method, and system for providing a stress absorption layer for integrated circuits includes a stiffening layer adapted to limit flexing. A compliance layer is physically associated with the stiffening layer, with the compliance layer adapted to absorb stress caused by mismatched thermal properties between two materials. A thru hole passes through both the stiffening layer and the compliance layer, with the thru hole being adapted to receive a solder joint. The stress absorption layer contacts both a semiconductor package and a substrate. The solder joint disposed in the thru hole connects the semiconductor package to the substrate.

Abstract translation: 用于为集成电路提供应力吸收层的装置，方法和系统包括适于限制弯曲的加强层。 柔性层与加强层物理相关，柔性层适于吸收由两种材料之间的不匹配的热性质引起的应力。 通孔穿过加强层和柔性层，通孔适于接纳焊接接头。 应力吸收层与半导体封装和衬底接触。 布置在通孔中的焊点将半导体封装连接到基板。

公开(公告)号：US20100149776A1

公开(公告)日：2010-06-17

申请号：US12624552

申请日：2009-11-24

Applicant: Jae-Hoon CHOI ,  Jae-Seon Hwang ,  Hyo-Jae Bang ,  Hai-Young Lee

Inventor： Jae-Hoon CHOI ,  Jae-Seon Hwang ,  Hyo-Jae Bang ,  Hai-Young Lee

IPC: H05K1/18 ,  H05K1/11

CPC classification number: H01L23/49827 ,  H01L2224/16225 ,  H01L2924/3011 ,  H05K1/025 ,  H05K3/326 ,  H05K2201/0133 ,  H05K2201/09336 ,  H05K2201/09718 ,  H05K2201/10378 ,  H05K2203/0278

Abstract: A pressure conductive sheet includes a connector body formed of a thin plate of insulation material, an elastic body deposited as one body with the connector body, pluralities of connection terminals provided with a given interval to pass through the elastic body and the connector body, and a ground plate constituting a matching circuit, the ground plate being buried by a given width in between the connector body and the elastic body. The ground plate is coupled to a ground terminal among the connection terminals and is separated from an outer circumference face of a signal terminal. The connector body, the elastic body, the connection terminals and the ground plate are combined with one another to substantially reduce an interference between signal terminals through the matching circuit formed based on capacitance of a gap between a ground face of the ground plate and the signal terminal, and to improve electrical characteristics.

Abstract translation: 压力传导片包括由绝缘材料薄板形成的连接器主体，与连接器本体一体地沉积的弹性体，设置有给定间隔的多个连接端子以穿过弹性体和连接器主体，以及 构成匹配电路的接地板，接地板在连接器主体和弹性体之间被掩埋一定宽度。 接地板与连接端子之间的接地端子连接，并与信号端子的外周面分离。 连接器主体，弹性体，连接端子和接地板彼此组合，以通过基于接地板的接地面和信号之间的间隙的电容形成的匹配电路来大大减小信号端子之间的干扰 端子，并提高电气特性。

公开(公告)号：US07736459B2

公开(公告)日：2010-06-15

申请号：US12216873

申请日：2008-07-11

Applicant: Takashi Matsumura

Inventor： Takashi Matsumura

IPC: B29C65/02 ,  B29C65/48 ,  B32B37/06 ,  B32B37/10 ,  B32B37/26

CPC classification number: H05K3/303 ,  B30B5/02 ,  B30B15/024 ,  H01L21/568 ,  H01L21/6835 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75251 ,  H01L2224/753 ,  H01L2224/75314 ,  H01L2224/75315 ,  H01L2224/75317 ,  H01L2224/75754 ,  H01L2224/75755 ,  H01L2224/7598 ,  H01L2224/81005 ,  H01L2224/83101 ,  H01L2224/838 ,  H01L2224/83907 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/19105 ,  H05K2201/0133 ,  H05K2203/0191 ,  H05K2203/0278 ,  Y02P70/613 ,  Y10T156/16 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A compression bonding device has a dam member so that when a pressing head is pressed against an object to be pressed, the bonding part is surrounded by the dam member. Thus, even if the surface of the bonding part bulges by pressing, the bulging part is stopped by the dam member and the surface of the bonding part does not horizontally extend. As a result of the absence of horizontal extension of the bonding part, electric components of the object to be pressed are not subjected to a force that horizontally moves the electric components and the electric components are vertically pressed downward and connected to the terminals of the substrate. Thus, an electric device having high connection reliability is obtained.

Abstract translation: 压接装置具有阻挡构件，使得当按压头被按压被按压物体时，接合部被堤坝构件包围。 因此，即使接合部的表面通过按压而凸出，凸起部被阻挡构件阻止，接合部的表面也不会水平延伸。 由于不存在接合部的水平延伸，所以被加压物的电气部件不会受到使电气部件水平移动并且电气部件被垂直向下压并连接到基板的端子的力 。 因此，获得了具有高连接可靠性的电气装置。

公开(公告)号：US07722950B2

公开(公告)日：2010-05-25

申请号：US11559637

申请日：2006-11-14

Applicant: David Guo ,  Carlos L. Barton

Inventor： David Guo ,  Carlos L. Barton

IPC: B32B7/12

CPC classification number: H05K3/386 ,  B32B7/06 ,  B32B7/12 ,  B32B15/08 ,  B32B15/092 ,  B32B15/20 ,  B32B27/08 ,  B32B27/26 ,  B32B27/281 ,  B32B27/38 ,  B32B37/12 ,  B32B2270/00 ,  B32B2307/202 ,  B32B2307/204 ,  B32B2307/308 ,  B32B2363/00 ,  B32B2457/08 ,  C08G59/186 ,  C08G59/4253 ,  C09J163/00 ,  C09J2203/326 ,  C09J2421/00 ,  C09J2463/00 ,  C23C26/00 ,  C23C28/00 ,  H05K3/281 ,  H05K3/4626 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2201/0355 ,  Y10T428/24917 ,  Y10T428/2857 ,  Y10T428/287 ,  Y10T428/2887 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31522 ,  Y10T428/31529 ,  Y10T428/31826 ,  Y10T428/31935

Abstract: An adhesive for a circuit material, comprises a blend of a cure system; and a solid epoxy resin and a nitrile rubber functionalized with epoxy-reactive groups, wherein the solid epoxy resin and the nitrile rubber are reacted to form an adduct prior to blending with the cure system. The adhesive has low dendritic growth and improved solder resistance.

Abstract translation: 用于电路材料的粘合剂包括固化体系的混合物; 和固体环氧树脂和用环氧基反应性基团官能化的丁腈橡胶，其中固体环氧树脂和丁腈橡胶在与固化体系共混之前反应形成加合物。 粘合剂具有低树枝状生长和改善的阻焊性。

公开(公告)号：US07709968B2

公开(公告)日：2010-05-04

申请号：US10985119

申请日：2004-11-10

Applicant: Philip Damberg ,  Belgacem Haba ,  David B. Tuckerman ,  Teck-Gyu Kang

Inventor： Philip Damberg ,  Belgacem Haba ,  David B. Tuckerman ,  Teck-Gyu Kang

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L23/4985 ,  H01L23/49811 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K1/118 ,  H05K3/326 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/10674 ,  H01L2924/00

Abstract: A microelectronic package includes a microelectronic element having faces and contacts, a flexible substrate overlying and spaced from a first face of the microelectronic element, and a plurality of conductive terminals exposed at a surface of the flexible substrate. The conductive terminals are electrically interconnected with the microelectronic element and the flexible substrate includes a gap extending at least partially around at least one of the conductive terminals. In certain embodiments, the package includes a support layer, such as a compliant layer, disposed between the first face of the microelectronic element and the flexible substrate. In other embodiments, the support layer includes at least one opening that is at least partially aligned with one of the conductive terminals.

Abstract translation: 微电子封装包括具有面和触点的微电子元件，覆盖并与微电子元件的第一面间隔开的柔性基板，以及暴露在柔性基板的表面处的多个导电端子。 导电端子与微电子元件电互连，并且柔性基板包括至少部分地围绕至少一个导电端子延伸的间隙。 在某些实施例中，封装包括设置在微电子元件的第一面和柔性基板之间的支撑层，例如顺应层。 在其他实施例中，支撑层包括至少一个与导电端子之一至少部分对准的开口。

公开(公告)号：US20100085665A1

公开(公告)日：2010-04-08

申请号：US12246368

申请日：2008-10-06

Applicant: Aaron Steve Macpherson

Inventor： Aaron Steve Macpherson

IPC: G11B5/55

CPC classification number: G11B5/4846 ,  H05K1/0281 ,  H05K3/0058 ,  H05K3/386 ,  H05K2201/0133 ,  H05K2201/2045

Abstract: Method and apparatus for attenuating resonances in a flex circuit which interconnects a stationary element and a moveable element, such as a connector and a head stack assembly (HSA) in a data storage device. An intermediary portion of the flex circuit forms a dynamic loop between the stationary element and the moveable element. A damper member is attached to the flex circuit so as to continuously extend adjacent the stationary element and along less than an overall extent of the dynamic loop. The damper member attenuates resonances excited in the flex circuit during movement of the moveable element.

Abstract translation: 用于衰减在静态元件和诸如数据存储设备中的连接器和头部堆叠组件（HSA）的可移动元件之间互连的柔性电路中的谐振的方法和装置。 柔性电路的中间部分在固定元件和可移动元件之间形成动态回路。 阻尼器构件附接到柔性电路，以便在静止元件附近连续地延伸并且沿着小于动态回路的整个范围。 阻尼器构件在可移动元件移动期间衰减在柔性电路中激发的谐振。

公开(公告)号：US07692307B2

公开(公告)日：2010-04-06

申请号：US11636250

申请日：2006-12-08

Applicant: Sudarshan Rangaraj ,  Shankar Ganapathysubramanian ,  Richard Harries ,  Mitul Modi ,  Sankara J. Subramanian

Inventor： Sudarshan Rangaraj ,  Shankar Ganapathysubramanian ,  Richard Harries ,  Mitul Modi ,  Sankara J. Subramanian

IPC: H01L23/48

CPC classification number: H05K1/0271 ,  H01L23/13 ,  H01L2924/0002 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/0187 ,  H05K2201/068 ,  Y10T29/49158 ,  H01L2924/00

Abstract: A compliant structure for an electronic device comprises a substrate (110) composed of a first material (111) and a compliant zone (120) within the substrate. A plurality of solder joints (280) are located between, and form a connection between, the substrate and the electronic device (290). The compliant zone reduces the degree of deformation experienced by the solder joints due to thermal mismatch loading between the substrate and the die during attachment of the die to the substrate (chip attach). This reduction in solder joint deformation reduces the likelihood that the solder joints will crack.

Abstract translation: 用于电子设备的柔性结构包括由衬底内的第一材料（111）和柔性区（120）组成的衬底（110）。 多个焊接接头（280）位于衬底和电子器件（290）之间，并形成衬底和电子器件（290）之间的连接。 柔性区域在将管芯附着到衬底（芯片连接）期间由于衬底和裸片之间的热失配加载而减小焊点所经历的变形程度。 焊点变形的这种减少降低了焊点会破裂的可能性。

公开(公告)号：US20100081342A1

公开(公告)日：2010-04-01

申请号：US12493760

申请日：2009-06-29

Applicant: Shinichi NIKAIDO ,  Katsuya YAMAGAMI ,  Yasuhiro OUCHI

Inventor： Shinichi NIKAIDO ,  Katsuya YAMAGAMI ,  Yasuhiro OUCHI

IPC: H01R13/40 ,  H01R13/405 ,  H01R9/24

CPC classification number: H05K3/326 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/90 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/30107 ,  H01R12/714 ,  H05K1/114 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/10378 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: This double-sided connector is provided with: an insulating member having an insulating substrate and an elastomer insert-molded on both faces of the insulating substrate, and a through-hole formed along a thickness direction of the insulating substrate and the elastomer; a conductive member formed on an inner face of the through-hole, both ends of the conductive member exposed at the both faces; and a contact terminal part provided at one end of the conductive member. A protrusion is formed on at least a first face of the two faces of the insulating member and near one of the two ends of the through-hole, the protrusion formed by a part of the elastomer protruding from the first face. The contact terminal part includes a ring part formed around the end of the through-hole on the first face, a sloping part connected to the ring part and extended slantingly toward a top of the protrusion, and an approximately hemispherical point of contact part connected to the sloping part and covering the top.

Abstract translation: 该双面连接器设置有：具有绝缘基板和在绝缘基板的两个表面上插入成型的弹性体的绝缘构件和沿绝缘基板和弹性体的厚度方向形成的通孔; 形成在所述通孔的内表面上的导电构件，所述导电构件的两端在所述两个面上露出; 以及设置在导电构件的一端的接触端子部。 在所述绝缘构件的两个面的至少第一面和所述贯通孔的两端中的一端附近形成突起，所述突起由从所述第一面突出的所述弹性体的一部分形成。 接触端子部包括形成在第一面上的贯通孔的端部周围的环状部，与环状部连接并向着突起的顶部倾斜延伸的倾斜部，以及大致半球形的接触点部， 倾斜部分并覆盖顶部。

公开(公告)号：US07629045B2

公开(公告)日：2009-12-08

申请号：US11044533

申请日：2005-01-28

Applicant: Kenji Takai ,  Norio Moriike ,  Kenichi Kamiyama ,  Takako Watanabe ,  Shin Takanezawa ,  Koji Morita ,  Katsuyuki Masuda ,  Kiyoshi Hasegawa

Inventor： Kenji Takai ,  Norio Moriike ,  Kenichi Kamiyama ,  Takako Watanabe ,  Shin Takanezawa ,  Koji Morita ,  Katsuyuki Masuda ,  Kiyoshi Hasegawa

IPC: B32B3/00

CPC classification number: H05K3/4655 ,  H05K3/108 ,  H05K3/28 ,  H05K3/386 ,  H05K3/389 ,  H05K3/4652 ,  H05K2201/0133 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/0212 ,  H05K2201/0358 ,  H05K2203/0759 ,  Y10T428/12431 ,  Y10T428/24917 ,  Y10T428/2804 ,  Y10T428/287 ,  Y10T428/31681

Abstract: The invention relates to an adhesion assisting agent-bearing metal foil comprising a layer of an adhesion assisting agent containing an epoxy resin as an indispensable component on a metal, wherein the adhesion assisting agent layer has a thickness of 0.1 to 10 μm. The invention also relates to a printed wiring board being a multilayer wiring board having a plurality of layers, wherein an adhesion assisting agent layer is formed between insulating layers.

Abstract translation: 本发明涉及一种粘附辅助剂金属箔，其包含在金属上含有环氧树脂作为不可或缺成分的粘合助剂层，其中粘合助剂层的厚度为0.1-10μm。 本发明还涉及作为具有多层的多层布线基板的印刷布线板，其中在绝缘层之间形成粘附辅助剂层。

公开(公告)号：US07609530B2

公开(公告)日：2009-10-27

申请号：US11983248

申请日：2007-11-08

Applicant: Chris R. Snider

Inventor： Chris R. Snider

IPC: H05K9/00

CPC classification number: H05K9/003 ,  H05K9/0032 ,  H05K2201/0133

Abstract: A conductive elastomeric shielding device (400) for use with an electronic device includes a raised surface (401) and a sidewall (405) formed with the raised surface (401). A turret section (406) is formed with the sidewall (405) where an engagement member (407) projects from the turret section (406) for frictional engagement with an aperture (408) in a printed circuit (PC) board (410). The raised surface and sidewall are manufactured of an elastomeric shielding material for shielding radio frequency (RF) radiation for electronic components used therewith.