公开(公告)号：US20080090478A1

公开(公告)日：2008-04-17

申请号：US11867091

申请日：2007-10-04

Applicant: Satoru Amou ,  Haruo Akahoshi ,  Hiroshi Shimizu ,  Akinori Hanawa

Inventor： Satoru Amou ,  Haruo Akahoshi ,  Hiroshi Shimizu ,  Akinori Hanawa

IPC: B32B5/02 ,  B05D3/06 ,  C08F236/06 ,  C08F290/06 ,  C08F4/32 ,  C08K5/34

CPC classification number: B32B5/02 ,  B32B27/04 ,  C08F290/06 ,  C08K5/0025 ,  C08L53/02 ,  C08L53/025 ,  H05K1/032 ,  H05K1/0373 ,  H05K3/4626 ,  H05K2201/012 ,  H05K2201/0158 ,  H05K2201/0209 ,  Y10S428/901 ,  Y10T428/31757 ,  Y10T442/2631 ,  Y10T442/2738 ,  C08L2666/02

Abstract: It is an objective of this invention to obtain: a composition superior in processability, dielectric properties, heat resistance, and adhesiveness by controlling phase separation of a 1,2-polybutadiene resin composition without deterioration of dielectric properties exhibited in high-frequency regions; and a multilayer printed wiring board using the same. This invention relates to a polybutadiene resin composition, comprising: a crosslinking component (A) comprising repeating units represented by the following formula (1) and having a number average molecular weight of 1000 to 20000; a radical polymerization initiator (B), the one-minute half-life temperature of which is 80° C. to 140° C.; and a radical polymerization initiator (C), the one-minute half-life temperature of which is 170° C. to 230° C.; wherein 3 to 10 parts by weight of the component (B) and 5 to 15 parts by weight of the component (C) are contained relative to 100 parts by weight of the component (A). The invention also relates to a prepreg, a laminate, and a printed wiring board, which are produced using the same.

Abstract translation: 本发明的目的是获得：通过控制1,2-聚丁二烯树脂组合物的相分离而不会在高频区域表现出的介电性能降低，从而加工性，介电特性，耐热性和粘合性优异; 和使用其的多层印刷线路板。 本发明涉及一种聚丁二烯树脂组合物，其包含：交联组分（A），其包含由下式（1）表示的数均分子量为1000至20000的重复单元; 自由基聚合引发剂（B），其一分钟半衰期温度为80℃至140℃; 和自由基聚合引发剂（C），其一分钟的半衰期温度为170℃至230℃; 相对于100重量份的成分（A），含有3〜10重量份的成分（B）和5〜15重量份的成分（C）。 本发明还涉及使用其制造的预浸料坯，层压板和印刷线路板。

公开(公告)号：US20080087986A1

公开(公告)日：2008-04-17

申请号：US11986998

申请日：2007-11-27

Applicant: Ravindra Tanikella

Inventor： Ravindra Tanikella

IPC: H01L23/532 ,  H01L23/52

CPC classification number: H01L23/49894 ,  C08F283/04 ,  C08G73/121 ,  C08K3/36 ,  C08K9/10 ,  C08K2201/011 ,  C08L79/08 ,  C08L2666/66 ,  H01L21/4857 ,  H01L21/563 ,  H01L23/293 ,  H01L23/295 ,  H01L23/296 ,  H01L23/3185 ,  H01L23/49822 ,  H01L23/49866 ,  H01L24/16 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07025 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/15763 ,  H01L2924/15787 ,  H01L2924/15791 ,  H01L2924/18161 ,  H01L2924/351 ,  H05K1/112 ,  H05K3/28 ,  H05K3/421 ,  H05K3/422 ,  H05K3/4602 ,  H05K3/4688 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/09436 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09827 ,  H05K2203/1163 ,  H05K2203/121 ,  H01L2924/00 ,  H01L2224/0401

Abstract: Highly reliable interconnections for microelectronic packaging. In one embodiment, dielectric layers in a build-up interconnect have a gradation in glass transition temperature; and the later applied dielectric layers are laminated at temperatures lower than the glass transition temperatures of the earlier applied dielectric layers. In one embodiment, the glass transition temperatures of earlier applied dielectric films in a build-up interconnect are increased through a thermosetting process to exceed the temperature for laminating the later applied dielectric films. In one embodiment, a polyimide material is formed with embedded catalysts to promote cross-linking after a film of the polyimide material is laminated (e.g., through photo-chemical or thermal degradation of the encapsulant of the catalysts). In one embodiment, the solder resist opening walls have a wettable layer generated through laser assisted seeding so that there is no gap between the solder resist opening walls and no underfill in the solder resist opening.

Abstract translation: 用于微电子封装的高度可靠的互连。 在一个实施例中，积聚互连中的电介质层具有玻璃化转变温度的等级; 并且稍后施加的电介质层在低于较早施加的电介质层的玻璃化转变温度的温度下被层压。 在一个实施方案中，通过热固化工艺增加了积聚互连中早期施加的介电膜的玻璃化转变温度，以超过用于层压后来施加的电介质膜的温度。 在一个实施方案中，在层压聚酰亚胺材料的膜（例如，通过催化剂的密封剂的光化学或热降解）之后，用嵌入的催化剂形成聚酰亚胺材料以促进交联。 在一个实施例中，阻焊剂开口壁具有通过激光辅助接种产生的可湿性层，使得阻焊剂开口壁之间没有间隙，并且在阻焊剂开口中没有底部填充物。

公开(公告)号：US20070292668A1

公开(公告)日：2007-12-20

申请号：US11836963

申请日：2007-08-10

Applicant: Satoru Amou ,  Morimichi Umino ,  Akira Nagai ,  Yoshihiro Nakamura ,  Nobuyuki Minami

Inventor： Satoru Amou ,  Morimichi Umino ,  Akira Nagai ,  Yoshihiro Nakamura ,  Nobuyuki Minami

IPC: B32B15/08

CPC classification number: H05K1/032 ,  H05K1/024 ,  H05K3/4626 ,  H05K2201/012 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0239 ,  Y10T428/12569 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/24995 ,  Y10T428/249951 ,  Y10T428/249952 ,  Y10T428/31645

Abstract: There are provided a resin composition comprising a crosslinking component with a weight average molecular weight of 1,000 or less having a plurality of styrene groups and represented by the following formula: wherein R is a hydrocarbon skeleton, each of R1s is a hydrogen atom or a hydrocarbon group, each of R2, R3 and R4 is a hydrogen atom or an alkyl group, m is an integer of 1 to 4, and n is an integer of 2 or more, at least one high-molecular weight compound, an inorganic filler, and at least one treating agent for said inorganic filler; its cured product; and a prepreg, a laminate sheet having a conductor layer, and a multilayer printed wiring board obtained by processing the conductor layer of the laminate sheet into wiring.

Abstract translation: 提供一种树脂组合物，其包含具有多个苯乙烯基团的重均分子量为1,000以下的交联组分，由下式表示：其中R为烃骨架，R 1〜 s是氢原子或烃基，R 2，R 3和R 4中的每一个是氢原子或烷基 m为1〜4的整数，n为2以上的整数，至少一种高分子化合物，无机填充剂和至少一种所述无机填料用处理剂。 其固化产品; 和预浸料，具有导体层的层叠片材和通过将层压片材的导体层加工成布线而获得的多层印刷布线板。

公开(公告)号：US07273900B2

公开(公告)日：2007-09-25

申请号：US10935266

申请日：2004-09-08

Applicant: Satoru Amou ,  Morimichi Umino ,  Akira Nagai ,  Yoshihiro Nakamura ,  Nobuyuki Minami

Inventor： Satoru Amou ,  Morimichi Umino ,  Akira Nagai ,  Yoshihiro Nakamura ,  Nobuyuki Minami

IPC: C08F8/00

CPC classification number: H05K1/032 ,  H05K1/024 ,  H05K3/4626 ,  H05K2201/012 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0239 ,  Y10T428/12569 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/24995 ,  Y10T428/249951 ,  Y10T428/249952 ,  Y10T428/31645

Abstract: There are provided a resin composition comprising a crosslinking component with a weight average molecular weight of 1,000 or less having a plurality of styrene groups and represented by the following formula: wherein R is a hydrocarbon skeleton, each of R1s is a hydrogen atom or a hydrocarbon group, each of R2, R3 and R4 is a hydrogen atom or an alkyl group, m is an integer of 1 to 4, and n is an integer of 2 or more, at least one high-molecular weight compound, an inorganic filler, and at least one treating agent for said inorganic filler; its cured product; and a prepreg, a laminate sheet having a conductor layer, and a multilayer printed wiring board obtained by processing the conductor layer of the laminate sheet into wiring.

Abstract translation: 提供一种树脂组合物，其包含具有多个苯乙烯基团的重均分子量为1,000以下的交联组分，由下式表示：其中R为烃骨架，R 1〜 s是氢原子或烃基，R 2，R 3和R 4中的每一个是氢原子或烷基 m为1〜4的整数，n为2以上的整数，至少一种高分子化合物，无机填充剂和至少一种所述无机填料用处理剂。 其固化产品; 和预浸料，具有导体层的层叠片材和通过将层压片材的导体层加工成布线而获得的多层印刷布线板。

公开(公告)号：US20030021889A1

公开(公告)日：2003-01-30

申请号：US10182816

申请日：2002-08-02

Inventor： Yasuhiro Wakizaka

IPC: B05D005/12

CPC classification number: H05K3/4661 ,  H05K3/381 ,  H05K3/388 ,  H05K3/4644 ,  H05K2201/0129 ,  H05K2201/0158 ,  H05K2203/0796 ,  H05K2203/095 ,  H05K2203/1105

Abstract: A method for manufacturing a multilayer circuit board, in which adhesion between electrical insulating layer and a conductive layer is high and the patternability is also excellent, is provided. The method for manufacturing the multilayer circuit board comprises a step of; 1) bringing the surface of the electrical insulating layer produced by setting a setting resin composition containing an alicyclic olefin polymer or an aromatic polyether polymer into contact with a permanganic acid compound or a plasma, 2) dry-plating the surface and then wet- or dry-plating the surface, 3) dry-plating the surface several times and then wet-plating the surface, or 4) plating the surface and then annealing it, so as to form a conductive layer.

Abstract translation: 提供了一种多层电路板的制造方法，其中电绝缘层和导电层之间的粘附性高并且图案性也优异。 制造多层电路板的方法包括以下步骤： 1）通过将含有脂环族烯烃聚合物或芳香族聚醚聚合物的固化树脂组合物与高锰酸化合物或等离子体接触来制造电绝缘层的表面，2）对表面进行干式电镀，然后湿法或 对表面进行干式电镀，3）对表面进行几次干式电镀，然后对表面进行镀覆，或者4）对表面进行电镀，然后退火，形成导电层。

公开(公告)号：US06420093B1

公开(公告)日：2002-07-16

申请号：US09496495

申请日：2000-02-02

Applicant: Kaoru Ohba ,  Brian Martin ,  Hideki Akimoto ,  Albert Charles Marie Achen ,  Philip E. Garrou ,  Britton Lee Kaliszewski ,  Ying-Hung So

Inventor： Kaoru Ohba ,  Brian Martin ,  Hideki Akimoto ,  Albert Charles Marie Achen ,  Philip E. Garrou ,  Britton Lee Kaliszewski ,  Ying-Hung So

IPC: G03F700

CPC classification number: H05K3/4655 ,  C08G61/02 ,  H05K3/4652 ,  H05K2201/0158 ,  H05K2201/0358

Abstract: The invention is a process for building-up printed wiring boards using metal foil coated with toughened benzocyclobutene-based dielectric polymers. The invention is also a toughened dielectric polymer comprising benzocyclobutene-based monomers or oligomers, ethylenically unsaturated polymer additive, and, optionally, a photoactive compound.

Abstract translation: 本发明是使用镀有苯乙烯类韧性介电聚合物的金属箔来构建印刷线路板的方法。 本发明还是包含苯并环丁烯类单体或低聚物，烯属不饱和聚合物添加剂和任选的光活性化合物的增韧介电聚合物。

公开(公告)号：US20020050402A1

公开(公告)日：2002-05-02

申请号：US10012426

申请日：2001-12-07

Inventor： Robert M. Japp ,  Mark D. Poliks

IPC: H05K001/03 ,  H05K001/09

CPC classification number: H05K3/4641 ,  H05K1/0366 ,  H05K2201/0141 ,  H05K2201/0158 ,  H05K2201/0278 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/0323 ,  H05K2201/068 ,  H05K2201/09309 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49165

Abstract: Conductive materials that have low coefficients of thermal expansion (CTEs) and that are used for power and ground planes are disclosed. Fibrous materials (such as carbon, graphite, glass, quartz, polyethylene, and liquid crystal polymer fibers) with low CTEs are metallized to provide a resultant conductive material with a low CTE. Such fibers may be metallized in their individual state and then formed into a fabric, or these materials may be formed into a fabric and then metallized or a combination of both metallizations may be used. In addition, a graphite or carbon sheet may be metallized on one or both sides to provide a material that has a low CTE and high conductivity. These metallized, low CTE power and ground planes may be laminated with other planes/cores into a composite, or laminated into a core which is then laminated with other planes/cores into a composite. The resultant composite may be used for printed circuit boards (PCBs) or PCBs used as laminate chip carriers.

Abstract translation: 公开了具有低热膨胀系数（CTE）并且用于电力和接地平面的导电材料。 具有低CTE的纤维材料（例如碳，石墨，玻璃，石英，聚乙烯和液晶聚合物纤维）被金属化以提供具有低CTE的所得导电材料。 这样的纤维可以以其单独状态进行金属化，然后形成织物，或者这些材料可以形成织物，然后金属化，或者可以使用两种金属化的组合。 此外，石墨或碳片可以在一侧或两侧进行金属化，以提供具有低CTE和高导电性的材料。 这些金属化的低CTE功率和接地层可以与其它平面/芯层压成复合材料，或者层压成芯，然后将其与其它平面/芯层叠合成复合材料。 所得的复合材料可用于印刷电路板（PCB）或用作层压芯片载体的PCB。

公开(公告)号：US06329603B1

公开(公告)日：2001-12-11

申请号：US09288051

申请日：1999-04-07

Applicant: Robert M. Japp ,  Mark D. Poliks

Inventor： Robert M. Japp ,  Mark D. Poliks

IPC: H05K103

CPC classification number: H05K3/4641 ,  H05K1/0366 ,  H05K2201/0141 ,  H05K2201/0158 ,  H05K2201/0278 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/0323 ,  H05K2201/068 ,  H05K2201/09309 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49165

Abstract: Conductive materials that have low coefficients of thermal expansion (CTEs) and that are used for power and ground planes are disclosed. Fibrous materials (such as carbon, graphite, glass, quartz, polyethylene, and liquid crystal polymer fibers) with low CTEs are metallized to provide a resultant conductive material with a low CTE. Such fibers may be metallized in their individual state and then formed into a fabric, or these materials may be formed into a fabric and then metallized or a combination of both metallizations may be used. In addition, a graphite or carbon sheet may be metallized on one or both sides to provide a material that has a low CTE and high conductivity. These metallized, low CTE power and ground planes may be laminated with other planes/cores into a composite, or laminated into a core which is then laminated with other planes/cores into a composite. The resultant composite may be used for printed circuit boards (PCBs) or PCBs used as laminate chip carriers.

Abstract translation: 公开了具有低热膨胀系数（CTE）并且用于电力和接地平面的导电材料。 具有低CTE的纤维材料（例如碳，石墨，玻璃，石英，聚乙烯和液晶聚合物纤维）被金属化以提供具有低CTE的所得导电材料。 这样的纤维可以以其单独状态进行金属化，然后形成织物，或者这些材料可以形成织物，然后金属化，或者可以使用两种金属化的组合。 此外，石墨或碳片可以在一侧或两侧金属化，以提供具有低CTE和高导电性的材料。 这些金属化的低CTE功率和接地层可以与其它平面/芯层压成复合材料，或者层压成芯，然后将其与其它平面/芯层叠合成复合材料。 所得的复合材料可用于印刷电路板（PCB）或用作层压芯片载体的PCB。

公开(公告)号：US06297459B1

公开(公告)日：2001-10-02

申请号：US09019304

申请日：1998-02-05

Applicant: Robert John Wojnarowski ,  Herbert Stanley Cole ,  Theresa Ann Sitnik-Nieters ,  Wolfgang Daum

Inventor： Robert John Wojnarowski ,  Herbert Stanley Cole ,  Theresa Ann Sitnik-Nieters ,  Wolfgang Daum

IPC: H05K109

CPC classification number: H05K1/024 ,  H05K3/386 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0158 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917

Abstract: A low dielectric constant printed circuit board includes: a low dielectric constant porous polymer layer having holes therethrough, the porous layer having pores; and a patterned metallization layer over surfaces of the low dielectric constant porous polymer layer and surfaces of the holes, the patterned metallization layer not significantly protruding into the pores of the porous layer.

Abstract translation: 低介电常数印刷电路板包括：具有穿过其中的孔的低介电常数多孔聚合物层，多孔层具有孔; 以及在低介电常数多孔聚合物层的表面和孔的表面上的图案化金属化层，图案化金属化层不会显着地突出到多孔层的孔中。

公开(公告)号：US06291374B1

公开(公告)日：2001-09-18

申请号：US09531947

申请日：2000-03-21

Applicant: Vincent R. Landi

Inventor： Vincent R. Landi

IPC: D03D300

CPC classification number: C08J5/24 ,  B32B15/08 ,  C08J2309/00 ,  C08K3/22 ,  C08K3/34 ,  C08K3/40 ,  C08K5/0066 ,  C08K7/14 ,  C08L9/00 ,  C08L23/16 ,  C08L53/00 ,  H05K1/0203 ,  H05K1/032 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/162 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/029 ,  H05K2201/0293 ,  Y10T442/2934 ,  Y10T442/2992 ,  Y10T442/3415 ,  Y10T442/3423 ,  Y10T442/3431 ,  Y10T442/3455 ,  C08L2666/06 ,  C08L2666/24

Abstract: An electrical substrate material is presented comprising a resin matrix which includes a thermosetting polybutadiene or polyisoprene resin, an ethylene propylene rubber, and optionally a thermoplastic unsaturated butadiene- or isoprene-containing polymer; a particulate filler, a flame retardant additive, a curing agent, and a woven or unwoven fabric. The presence of the ethylene propylene rubber enhances the heat age properties of the substrate material, particularly the dielectric strength and the mechanical properties, while other electrical, chemical, and mechanical properties of the material are not adversely effected.

Abstract translation: 提供一种电气基材材料，其包括包含热固性聚丁二烯或聚异戊二烯树脂的树脂基质，乙丙橡胶和任选的含热塑性不饱和丁二烯或含异戊二烯的聚合物; 颗粒状填料，阻燃添加剂，固化剂，织造或无纺织物。 乙烯丙烯橡胶的存在增强了基材材料的热老化性能，特别是介电强度和机械性能，而材料的其它电学，化学和机械性能也不会受到不利影响。