公开(公告)号：US20040221683A1

公开(公告)日：2004-11-11

申请号：US10782909

申请日：2004-02-23

Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.

Inventor： Kohei Shimoda ,  Masatoshi Majima ,  Keiji Koyama ,  Issei Okada ,  Tetsuya Kuwabara

IPC: B22F009/24

CPC classification number: H05K3/321 ,  B22F1/0007 ,  B22F1/0022 ,  B22F1/0096 ,  B22F9/24 ,  B22F2998/00 ,  B82Y30/00 ,  C08K3/08 ,  C09D5/24 ,  H01B1/02 ,  H01B1/22 ,  H05K2201/0248 ,  C08L21/00

Abstract: A metal powder composed of nickel or an alloy thereof and used for a producing a conductivity-afforded material is provided, in which particles are integrated in particle aggregates having a chain structure. The average diameter of the particle aggregates is in the range of 30 to 200 nm, and the average length thereof is in the range of 0.5 to 50 nullm. The increased conductivity bestowing effect can be obtained by the addition of a small amount of the metal powder.

Abstract translation: 提供由镍或其合金构成并用于制备导电性材料的金属粉末，其中颗粒整合在具有链结构的颗粒聚集体中。 粒子聚集体的平均粒径在30〜200nm的范围内，平均长度在0.5〜50μm的范围内。 通过添加少量的金属粉末可以获得增加的导电性赋予效果。

公开(公告)号：US06593255B1

公开(公告)日：2003-07-15

申请号：US09705353

申请日：2000-11-03

Applicant: Ernest L. Lawton ,  Vedagiri Velpari ,  William B. Rice ,  Walter J. Robertson ,  Bruce E. Novich ,  Xiang Wu ,  Kami Lammon-Hilinski

Inventor： Ernest L. Lawton ,  Vedagiri Velpari ,  William B. Rice ,  Walter J. Robertson ,  Bruce E. Novich ,  Xiang Wu ,  Kami Lammon-Hilinski

IPC: B32B900

CPC classification number: B32B9/00 ,  C03C25/00 ,  C03C25/10 ,  C03C25/26 ,  C03C25/28 ,  C03C25/32 ,  C03C25/42 ,  C03C25/47 ,  C03C25/48 ,  C08J5/08 ,  H05K1/0366 ,  H05K3/0047 ,  H05K2201/0166 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0215 ,  H05K2201/0239 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0254 ,  H05K2201/029 ,  H05K2203/127 ,  Y10T428/2927 ,  Y10T428/2933 ,  Y10T428/2938 ,  Y10T428/2964 ,  Y10T442/20 ,  Y10T442/3049

Abstract: A fabric comprising at least one fiber strand comprising a plurality of fibers and having a resin compatible coating composition on at least a surface of the at least one fiber strand, wherein the at least one fiber strand has an Air Jet Transport Drag Force value of greater than 100,000 gram force per gram mass of strand as determined by a needle air jet nozzle unit having an internal air jet chamber having a diameter of 2 millimeters and a nozzle exit tube having a length of 20 centimeters at a strand feed rate of 274 meters per minute and an air pressure of 310 kiloPascals. A reinforced laminate comprising: (a) at least one matrix material; and (b) at least one fabric comprising at least one fiber strand comprising a plurality of fibers and having a resin compatible coating composition on at least a surface of the at least one fiber strand, wherein the at least one fiber strand has an Air Jet Transport Drag Force value of greater than 100,000 gram force per gram mass of strand as determined by a needle air jet nozzle unit having an internal air jet chamber having a diameter of 0.2 millimeters and a nozzle exit tube having a length of 20 centimeters at a strand feed rate of 274 meters per minute and an air pressure of 310 kiloPascals.

Abstract translation: 一种织物，其包含至少一根纤维束，其包含多根纤维，并且在所述至少一条纤维束的至少一个表面上具有树脂相容的涂料组合物，其中所述至少一条纤维束具有更大的空气喷射输送阻力值 通过具有直径为2毫米的内部空气喷射室的针气喷嘴单元确定的每克质量的绞线的100,000克力和具有274米长度的绞线进给速度的20厘米长度的喷嘴出口管 分钟，气压310千帕。 一种增强层压板，包括：（a）至少一种基体材料; 和（b）至少一种织物，其包含至少一根包含多根纤维并且在所述至少一根纤维束的至少一个表面上具有树脂相容性涂料组合物的纤维束，其中所述至少一根纤维束具有空气喷射 运输阻力通过具有直径为0.2毫米的内部空气喷射室的针空气喷嘴单元和在一根股线上具有20厘米长度的喷嘴出口管确定的每克质量的股线的大于100,000克力的运输阻力值 进料速度为274米/分钟，空气压力为310千帕。

公开(公告)号：US20020098319A1

公开(公告)日：2002-07-25

申请号：US09987396

申请日：2001-11-14

Applicant: SONY CHEMICALS CORP.

Inventor： Motohide Takeichi ,  Junji Shinozaki

IPC: H05K007/00 ,  H05K005/00 ,  G06F001/16 ,  B32B003/06 ,  H01R013/64 ,  H01R024/00

CPC classification number: H05K3/323 ,  H01L21/563 ,  H01L23/295 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/3511 ,  H05K1/189 ,  H05K2201/0209 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0251 ,  H05K2201/10674 ,  Y10T428/24008 ,  H01L2924/00 ,  H01L2224/0401

Abstract: The present invention is a connection material which enables a flexible circuit board to be connected to a bare IC chip without causing a shoulder touch effect. The connection material contains an insulating adhesive and a flaky or fibrous insulating filler dispersed therein is used for connecting a film-like flexible circuit board and a bare IC chip. The aspect ratio of the flaky or fibrous insulating filler is no less than 20.

Abstract translation: 本发明是一种连接材料，其能够使柔性电路板连接到裸IC芯片而不产生肩部接触效果。 连接材料包含绝缘粘合剂，其中分散在其中的片状或纤维绝缘填料用于连接薄膜状柔性电路板和裸IC芯片。 片状或纤维状绝缘填料的纵横比不小于20。

公开(公告)号：US20010051682A1

公开(公告)日：2001-12-13

申请号：US09897966

申请日：2001-07-05

Applicant: IDEMITSU PETROCHEMICAL CO., LTD.

Inventor： Eiji Tamura ,  Wataru Kosaka ,  Toshimi Arashi

IPC: B05D003/04

CPC classification number: H05K3/381 ,  C23C18/1653 ,  C23C18/2013 ,  C23C18/285 ,  C23C18/30 ,  C23C18/34 ,  C23C18/40 ,  H05K1/0373 ,  H05K3/181 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0248 ,  H05K2201/09118 ,  H05K2203/025

Abstract: A process for producing an electrolessly plated molded article, which includes molding a resin composition made of a thermoplastic resin having a specific Izod impact strength and a Rockwell surface hardness and an inorganic filler, then treating the surface of the molded article with air blast using an abrasive having a sharp granular shape, and then conducting catalyst coating, activation treatment and electroless plating. It has been possible to apply the electroless plating with a high adhesion strength to the molded article of the thermoplastic resin composition without conducting the chemical etching treatment.

公开(公告)号：US20010020748A1

公开(公告)日：2001-09-13

申请号：US09854269

申请日：2001-05-11

Inventor： Thomas H. DiStefano

IPC: H01L023/52

CPC classification number: H01L24/81 ,  H01L21/561 ,  H01L21/563 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/49805 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/742 ,  H01L24/94 ,  H01L2224/02319 ,  H01L2224/02333 ,  H01L2224/0401 ,  H01L2224/11003 ,  H01L2224/1184 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/274 ,  H01L2224/29101 ,  H01L2224/29298 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/18301 ,  H05K3/3436 ,  H05K3/363 ,  H05K2201/0215 ,  H05K2201/0248 ,  H05K2201/09427 ,  H05K2201/10977 ,  H05K2203/0465 ,  H05K2203/074 ,  H05K2203/306 ,  Y02P70/613 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: A soldered assembly for a microelectronic element includes a microelectronic element, solder columns extending from a surface of the microelectronic element and terminals connected to distal ends of the columns. The assembly can be handled and mounted using conventional surface-mount techniques, but provides thermal fatigue resistance. The solder columns may be inclined relative to the chip surface, and may contain long, columnar inclusions preferentially oriented along the lengthwise axes of the columns.

Abstract translation: 用于微电子元件的焊接组件包括微电子元件，从微电子元件的表面延伸的焊料柱和连接到柱的远端的端子。 组件可以使用传统的表面贴装技术进行处理和安装，但提供耐热疲劳性能。 焊料柱可以相对于芯片表面倾斜，并且可以包含沿着柱的纵向轴线优先取向的长的柱状夹杂物。

公开(公告)号：US5879568A

公开(公告)日：1999-03-09

申请号：US870379

申请日：1997-06-06

Applicant: Naoyuki Urasaki ,  Kouichi Tsuyama ,  Kazuhito Kobayashi ,  Norio Okano ,  Hiroshi Shimizu ,  Nobuyuki Ogawa ,  Akishi Nakaso ,  Toyoki Ito ,  Daisuke Fujimoto ,  Kazuhisa Otsuka ,  Shigeharu Arike ,  Yoshiyuki Tsuru

Inventor： Naoyuki Urasaki ,  Kouichi Tsuyama ,  Kazuhito Kobayashi ,  Norio Okano ,  Hiroshi Shimizu ,  Nobuyuki Ogawa ,  Akishi Nakaso ,  Toyoki Ito ,  Daisuke Fujimoto ,  Kazuhisa Otsuka ,  Shigeharu Arike ,  Yoshiyuki Tsuru

IPC: H05K1/00 ,  H05K3/00 ,  H05K3/02 ,  H05K3/46 ,  B44C1/22

CPC classification number: H05K3/4655 ,  H05K3/0035 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01078 ,  H05K2201/0209 ,  H05K2201/0248 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0554 ,  H05K3/0094 ,  H05K3/025 ,  H05K3/4652 ,  H05K3/4676

Abstract: A multilayer printed circuit board small in interlayer thickness, capable of fine wiring, minimized in IVH and BVH diameters, high in strength and also excellent in wire bonding workability can be produced by a process comprising the steps of coating a thermosetting resin varnish compounded with electrically insulating whiskers on a roughened side of a copper foil, semi-curing the resin by heating to form a thermosetting resin layer, integrally laminating it on an interlayer board in which plated through-holes and conductor circudits have been formed, and roughening the cured thermosetting resin layer on the via hole wall surfaces with a roughening agent.

Abstract translation: 可以通过包括以下步骤的方法制备层间厚度小的能够精细布线，IVH和BVH直径最小化，强度高以及引线键合加工性优异的多层印刷电路板，其中包括以下步骤：涂覆电化学复合的热固性树脂清漆 在铜箔的粗糙面上的绝缘晶须，通过加热半固化以形成热固性树脂层，将其整体地层压在已经形成电镀通孔和导体环形的夹层板上，并使固化的热固性树脂 树脂层在通孔壁表面上用粗糙剂。

公开(公告)号：US5127158A

公开(公告)日：1992-07-07

申请号：US575295

申请日：1990-08-30

Applicant: Akikazu Nakano

Inventor： Akikazu Nakano

IPC: H05K1/03 ,  H05K3/02

CPC classification number: H05K1/0373 ,  H05K1/0366 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0239 ,  H05K2201/0248 ,  H05K2201/0251 ,  H05K2201/09118 ,  H05K3/022 ,  Y10T29/4916

Abstract: A process for producing a printed circuit board includes steps, sequentially conducted of dispersing in water or organic solvent:(A) 95 to 20% by weight of a styrene polymer having a syndiotactic structure, (B) 5 to 80% by weight of a fibrous filler having a fiber length of 1 to 50 mm, and (C) 0.1 to 30 parts by weight of at least one of a binder and a binding fiber in proportion to 100 parts by weight of the total amount of the components (A) and (B), to make a slurry having a concentration of 0.5 to 100 g/l; separating the solids from the slurry and drying and molding them. Thereafter the solids are either subjected to melting with heating and pressure forming into the molded article, or they are impregnated with a thermoplastic resin which is then cured. Finally, a metal layer is provided on the molded article.

公开(公告)号：US09812418B2

公开(公告)日：2017-11-07

申请号：US15351992

申请日：2016-11-15

Applicant: Fujitsu Limited

Inventor： Kozo Shimizu ,  Seiki Sakuyama

IPC: H01L23/00 ,  H01L25/065 ,  H01L23/367 ,  H01L25/00 ,  B23K1/00 ,  B23K3/08 ,  H01L23/31 ,  H01L23/488 ,  H01L23/498 ,  B23K35/02 ,  B23K35/26 ,  H05K1/02 ,  H05K3/34 ,  H01L23/14 ,  B23K101/40 ,  B23K101/42 ,  H05K1/09 ,  H05K1/11

CPC classification number: H01L24/17 ,  B23K1/0008 ,  B23K1/0016 ,  B23K3/085 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/264 ,  B23K2101/40 ,  B23K2101/42 ,  H01L23/145 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3675 ,  H01L23/488 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05082 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/11334 ,  H01L2224/1146 ,  H01L2224/13016 ,  H01L2224/13076 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/1601 ,  H01L2224/16145 ,  H01L2224/16157 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/16505 ,  H01L2224/16507 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/75253 ,  H01L2224/75501 ,  H01L2224/75502 ,  H01L2224/759 ,  H01L2224/81005 ,  H01L2224/81075 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81411 ,  H01L2224/81815 ,  H01L2224/81948 ,  H01L2224/81986 ,  H01L2225/06513 ,  H01L2924/014 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/10335 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/1579 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/16747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3512 ,  H01L2924/35121 ,  H05K1/0203 ,  H05K1/09 ,  H05K1/113 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0248 ,  H05K2201/09972 ,  H05K2201/1056 ,  H05K2203/1121 ,  H05K2203/304 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/01046 ,  H01L2924/00

Abstract: An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.

公开(公告)号：US09173282B2

公开(公告)日：2015-10-27

申请号：US13638536

申请日：2011-03-31

Applicant: Pulugurtha Markondeya Raj ,  Nitesh Kumbhat ,  Venkatesh Sundaram ,  Rao R. Tummala

Inventor： Pulugurtha Markondeya Raj ,  Nitesh Kumbhat ,  Venkatesh Sundaram ,  Rao R. Tummala

IPC: H01R9/00 ,  H05K1/02 ,  H01L23/498 ,  H01L25/065 ,  H01R12/52 ,  H01R12/71 ,  H05K3/34 ,  H05K1/18 ,  H05K3/10 ,  H01L29/41 ,  H01L23/13 ,  H01L25/10 ,  H01L23/00

CPC classification number: H05K1/0213 ,  H01L23/13 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/105 ,  H01L29/413 ,  H01L2224/131 ,  H01L2224/16237 ,  H01L2224/45147 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81207 ,  H01L2224/81385 ,  H01L2224/81399 ,  H01L2224/81815 ,  H01L2224/8182 ,  H01L2224/8185 ,  H01L2224/81897 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/15791 ,  H01R12/52 ,  H01R12/714 ,  H05K1/18 ,  H05K3/107 ,  H05K3/3436 ,  H05K2201/0248 ,  H05K2201/0281 ,  H05K2201/10378 ,  H05K2201/10674 ,  Y02P70/613 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/48

Abstract: The various embodiments of the present invention provide a stress-relieving, second-level interconnect structure that is low-cost and accommodates TCE mismatch between low-TCE packages and PCBs. The various embodiments of the interconnect structure are reworkable and can be scaled to pitches from about 1 millimeter (mm) to about 150 micrometers (μm). The interconnect structure comprises a dielectric body element and at least one interconnection array that provides a conductive path between two electronic components. Each interconnection array comprises a plurality of wires that provide both conductivity and compliance to the overall interconnect structure. The versatility and scalability of the interconnect structure of the present invention make it a desirable structure to utilize in current two-dimensional and ever-evolving three-dimensional IC structures.

Abstract translation: 本发明的各种实施例提供了一种应力消除的二级互连结构，其低成本并且适应低TCE封装和PCB之间的TCE不匹配。 互连结构的各种实施例是可再加工的，并且可以缩放到约1毫米（mm）至约150微米（μm）的间距。 互连结构包括介电体元件和提供两个电子部件之间的导电路径的至少一个互连阵列。 每个互连阵列包括提供导电性和整体互连结构的柔性的多条导线。 本发明的互连结构的多功能性和可扩展性使其成为在目前的二维和不断发展的三维IC结构中使用的理想结构。

公开(公告)号：US08940193B2

公开(公告)日：2015-01-27

申请号：US13158356

申请日：2011-06-10

Applicant: Lex Kosowsky ,  Robert Fleming

Inventor： Lex Kosowsky ,  Robert Fleming

IPC: H01B1/06 ,  H01B1/12 ,  H01C7/10 ,  B05D5/12 ,  B82Y10/00 ,  H01B1/22 ,  H01B1/24 ,  H01C7/105 ,  H01C17/065 ,  H05K1/02 ,  H05K3/18 ,  H05K1/03 ,  H05K1/16

CPC classification number: H01C7/1006 ,  B82Y10/00 ,  H01B1/22 ,  H01B1/24 ,  H01C7/105 ,  H01C17/0652 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0373 ,  H05K1/167 ,  H05K3/188 ,  H05K2201/0248 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0272 ,  H05K2201/0738 ,  H05K2203/0723 ,  H05K2203/105 ,  Y10S977/742 ,  Y10S977/779 ,  Y10T428/30 ,  Y10T428/31678

Abstract: One or more embodiments provide for a device that utilizes voltage switchable dielectric material having semi-conductive or conductive materials that have a relatively high aspect ratio for purpose of enhancing mechanical and electrical characteristics of the VSD material on the device.

Abstract translation: 一个或多个实施例提供了一种使用具有半导体或导电材料的电压可切换介电材料的器件，该器件具有相对较高的纵横比，以便增强器件上的VSD材料的机械和电学特性。