公开(公告)号：US07829188B2

公开(公告)日：2010-11-09

申请号：US11732253

申请日：2007-04-03

Applicant: Pui-Yan Lin ,  Govindasamy Paramasivam Rajendran ,  George Elias Zahr

Inventor： Pui-Yan Lin ,  Govindasamy Paramasivam Rajendran ,  George Elias Zahr

IPC: B32B27/20 ,  B32B27/38 ,  C08L63/00 ,  C08K3/34 ,  C08K3/36

CPC classification number: H05K3/4661 ,  B82Y30/00 ,  C08G59/621 ,  C08J5/005 ,  C08J2363/00 ,  C08L63/00 ,  H05K2201/0209 ,  H05K2201/0257 ,  H05K2201/0266 ,  Y10T428/25 ,  Y10T428/259 ,  Y10T428/26 ,  Y10T428/31511 ,  C08L2666/54

Abstract: Epoxy compositions exhibiting low viscosity in the uncured state and low coefficient of thermal expansion in the cured state are provided. Also provided are processes for making the epoxy compositions. The low dielectric constant compositions are well-suited for use in multi-layer printed circuit boards. The desired properties are achieved by employment of a bimodal distribution of nano-scale fillers in the epoxy compositions.

Abstract translation: 提供在未固化状态下显示低粘度和固化状态下的低热膨胀系数的环氧组合物。 还提供了制备环氧组合物的方法。 低介电常数组合物非常适用于多层印刷电路板。 期望的性能通过在环氧组合物中使用纳米级填料的双峰分布来实现。

公开(公告)号：US20090296364A1

公开(公告)日：2009-12-03

申请号：US12471802

申请日：2009-05-26

Applicant: Takayuki YAMAMOTO

Inventor： Takayuki YAMAMOTO

IPC: H05K7/02 ,  H05K1/00

CPC classification number: H05K3/3452 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/3171 ,  H01L23/3192 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L24/13 ,  H01L24/16 ,  H01L2221/68345 ,  H01L2224/0231 ,  H01L2224/02333 ,  H01L2224/0401 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/73203 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15174 ,  H05K1/0254 ,  H05K3/285 ,  H05K3/3436 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/0769 ,  H05K2201/10674 ,  H01L2924/00

Abstract: A wiring substrate includes: an insulating layer; a wiring formed on the insulating layer; and a solder resist layer formed on the insulating layer so as to cover at least a portion of the wiring, the solder resist layer being constituted by a plurality of layers, wherein the plurality of layers contain fillers of different grain diameters, a layer thickness of an innermost layer for constituting the plurality of layers is thicker than a layer thickness of the wiring, and a grain diameter of the filler contained in the innermost layer is smaller than a shortest interval between adjacent lines of the wiring.

Abstract translation: 布线基板包括：绝缘层; 形成在绝缘层上的布线; 以及形成在所述绝缘层上以便覆盖所述布线的至少一部分的阻焊层，所述阻焊层由多层构成，其中所述多层包含不同晶粒直径的填料，层厚度 用于构成多个层的最内层比布线的层厚度厚，并且包含在最内层中的填料的粒径小于布线的相邻线之间的最短间隔。

公开(公告)号：US20090274834A1

公开(公告)日：2009-11-05

申请号：US12113628

申请日：2008-05-01

Applicant: Naveen Chopra ,  Yiliang Wu ,  Peter M. Kazmaier

Inventor： Naveen Chopra ,  Yiliang Wu ,  Peter M. Kazmaier

IPC: B05D5/12 ,  H01B1/02

CPC classification number: H05K1/097 ,  C09D11/52 ,  H01L21/4867 ,  H05K3/102 ,  H05K3/105 ,  H05K3/1283 ,  H05K2201/0266 ,  H05K2201/0272 ,  H05K2203/1131 ,  H05K2203/121 ,  H05K2203/125

Abstract: A method of forming conductive features on a substrate from a solution of metal nanoparticles by providing a depositing solution and liquid depositing the depositing solution onto a substrate. The depositing solution is then heated to a temperature below about 140° C. to anneal the first and second nanoparticles and remove any reaction by-products. The depositing solution may be comprised of a mixture of first metal nanoparticles and second metal nanoparticles or a combination of first metal nanoparticles and a soluble second metal nanopartical precursor. Furthermore, the average diameter of the first metal nanoparticles is about 50 nm to about 100 μm and the average diameter of the second metal nanoparticles is about 0.5 nm to about 20 nm.

Abstract translation: 一种通过提供沉积溶液和将沉积溶液沉积在基底上的金属纳米颗粒溶液在基底上形成导电特征的方法。 然后将沉积溶液加热到低于约140℃的温度，以退火第一和第二纳米颗粒并除去任何反应副产物。 沉积溶液可以由第一金属纳米颗粒和第二金属纳米颗粒的混合物或第一金属纳米颗粒和可溶性第二金属纳米颗粒前体的组合构成。 此外，第一金属纳米颗粒的平均直径为约50nm至约100μm，第二金属纳米颗粒的平均直径为约0.5nm至约20nm。

公开(公告)号：US20090133912A1

公开(公告)日：2009-05-28

申请号：US12065791

申请日：2006-09-04

Applicant: Kenji Miyata ,  Hidenori Ishikura

Inventor： Kenji Miyata ,  Hidenori Ishikura

IPC: C08K3/36 ,  B32B15/092 ,  H05K1/16 ,  C08L63/02

CPC classification number: H05K1/056 ,  C08K3/013 ,  C08K3/22 ,  C08K3/36 ,  C08L63/00 ,  H01L23/142 ,  H01L23/145 ,  H01L23/3737 ,  H01L2924/0002 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0266 ,  Y10T428/31522 ,  C08L2666/16 ,  H01L2924/00

Abstract: A substrate, a circuit board and a multilayer circuit board are provided which, although being made of an inorganic filler as a crushed product, are capable of providing a highly reliable hybrid integrated circuit because of having excellent adhesion to a metal plate or metal foil and exhibiting a high thermal conductivity.A resin composition comprising a curable resin comprising an epoxy resin and a curing agent for the epoxy resin; and an inorganic filler filled in the curable agent; wherein the curing agent comprises a phenol novolak resin, and wherein the inorganic filler comprises a coarse powder containing particles having an average particle size of 5 to 20 μm, preferably particles is having a maximum particle size of 100 μm or below and a particle size of 5 to 50 μm in an amount of 50 vol % or above; and a fine powder containing particles having an average particle size of 0.2 to 1.5 μm, preferably particles having a particle size of 2.0 μm or below in an amount of 70 vol % or above. A substrate for a hybrid integrated circuit, a circuit board and a multilayer circuit board, which use the resin composition.

Abstract translation: 提供了一种基板，电路板和多层电路板，其虽然由作为粉碎产品的无机填料制成，但由于对金属板或金属箔具有优异的附着力，所以能够提供高可靠性的混合集成电路， 表现出高导热性。 一种树脂组合物，其含有包含环氧树脂的固化性树脂和环氧树脂的固化剂; 和填充在固化剂中的无机填料; 其中所述固化剂包括苯酚酚醛清漆树脂，并且其中所述无机填料包括含有平均粒度为5至20μm的颗粒的粗粉末，优选颗粒的最大粒径为100μm或更小，并且颗粒尺寸为 5〜50μm的量为50体积％以上; 以及含有平均粒径为0.2〜1.5μm的粒子的细粉末，优选粒径为2.0μm以下的粒子的量为70体积％以上。 用于混合集成电路的基板，电路板和多层电路板，其使用该树脂组合物。

公开(公告)号：US20090123716A1

公开(公告)日：2009-05-14

申请号：US11886910

申请日：2006-03-17

Applicant: Tadahiro Ohmi

Inventor： Tadahiro Ohmi

IPC: H01B3/00 ,  B05D5/00 ,  H05K1/03 ,  B32B5/16

CPC classification number: H05K1/0373 ,  H05K1/0233 ,  H05K2201/0215 ,  H05K2201/0266 ,  H05K2201/086 ,  Y10T428/2495

Abstract: To provide a magnetic substance-containing insulator that can achieve an effect of increasing the permeability without comparatively increasing the mixing concentration of a magnetic substance and, by applying the thus obtained magnetic substance-containing insulator to a circuit board, that can improve the characteristic impedance and achieve an effect of reducing the power consumption, and to provide a circuit board and an electronic component each using such a magnetic substance-containing insulator.A magnetic substance-containing insulator 10 includes plural magnetic substance particles 1a, 1b and an insulator 2 holding the plural magnetic substance particles 1a, 1b, wherein a group of the magnetic substance particles is composed of plural particle sizes.

Abstract translation: 为了提供一种含磁性物质的绝缘体，其可以实现增加磁导率的效果，而不增加磁性物质的混合浓度，并且通过将如此获得的含磁性物质的绝缘体涂覆到电路板上，可以改善特性阻抗 并且实现降低功耗的效果，并且提供使用这种含磁性物质的绝缘体的电路板和电子部件。 含有磁性物质的绝缘体10包括多个磁性体颗粒1a，1b和保持多个磁性体颗粒1a，1b的绝缘体2，其中一组磁性体颗粒由多个粒径组成。

公开(公告)号：US20090117357A1

公开(公告)日：2009-05-07

申请号：US12265561

申请日：2008-11-05

Applicant: Beom Joon CHO ,  Jong Myeon Lee ,  Myung Whun Chang

Inventor： Beom Joon CHO ,  Jong Myeon Lee ,  Myung Whun Chang

IPC: B32B18/00 ,  B32B5/16 ,  C04B35/00

CPC classification number: B32B18/00 ,  C04B35/638 ,  C04B2235/3217 ,  C04B2235/5292 ,  C04B2235/5436 ,  C04B2235/6562 ,  C04B2235/6567 ,  C04B2235/721 ,  C04B2235/9615 ,  C04B2237/562 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/0269 ,  H05K2203/308 ,  Y10T428/24942 ,  Y10T428/2495 ,  Y10T428/25 ,  Y10T428/252

Abstract: There is provided a hard-to-sinter constraining green sheet and a method of manufacturing a multilayer ceramic substrate using the same. The hard-to-sinter constraining green sheet disposed at least one of top and bottom surfaces of a non-sintered multi-layer ceramic substrate, the hard-to-sinter constraining green sheet including: a first constraining layer having a surface to be positioned on the multi-layer ceramic substrate, the first constraining layer including a first organic binder and a first inorganic binder having a spherical shape or a quasi-spherical shape; and a second constraining layer bonded to a top surface of the first constraining layer and including a second organic binder and a second inorganic powder having a flake shape, the second constraining layer having a powder packing density lower than a powder packing density of the first constraining layer.

Abstract translation: 提供了难以烧结的约束生片和使用其制造多层陶瓷基板的方法。 所述难烧结约束生片设置在非烧结多层陶瓷衬底的顶表面和底表面中的至少一个上，所述难烧结约束生片包括：具有待定位表面的第一约束层 在多层陶瓷基板上，第一约束层包括第一有机粘合剂和具有球形或准球形的第一无机粘合剂; 以及第二约束层，其结合到所述第一约束层的顶表面并且包括第二有机粘合剂和具有片状的第二无机粉末，所述第二约束层的粉末填充密度低于所述第一约束层的粉末堆积密度 层。

公开(公告)号：US20090105388A1

公开(公告)日：2009-04-23

申请号：US12227969

申请日：2007-06-06

Applicant: Shinya Tanaka ,  Yoshitaka Takezawa ,  Keiji Fukushima

Inventor： Shinya Tanaka ,  Yoshitaka Takezawa ,  Keiji Fukushima

IPC: C08K3/22

CPC classification number: H05K1/0373 ,  C08G59/24 ,  C08G59/5033 ,  C08K3/22 ,  C08K2003/2227 ,  C08K2201/014 ,  H05K2201/0209 ,  H05K2201/0266 ,  C08L63/00

Abstract: An epoxy resin composition comprising an epoxy compound represented by the formula (1): wherein Ar1, Ar2 and Ar3 each denotes any one of divalent groups represented by the following formulas: a curing agent and an alumina powder, wherein the alumina powder is a mixture of an alumina (A) having D50 of 2 μm or more and 100 μm or less, an alumina (B) having D50 of 1 μm or more and 10 μm or less, and an alumina (C) having D50 of 0.01 μm or more and 5 μm or less, in which D50 is a particle size at 50% cumulation from the smallest particle side of a weight cumulative particle size distribution, and the content of the alumina (A), that of the alumina (B) and that of the alumina (C) are respectively 50% by volume or more and 90% by volume or less, 5% by volume or more and 40% by volume or less, and 1% by volume or more and 30% by volume or less, based on the volume of the alumina powder (provided that the total % by volume of the alumina (A), the alumina (B) and the alumina (C) is 100% by volume).

Abstract translation: 一种环氧树脂组合物，其包含由式（1）表示的环氧化合物：其中Ar1，Ar2和Ar3各自表示由下式表示的任意一种二价基团：固化剂和氧化铝粉末，其中氧化铝粉末是混合物 的D50为2μm以上且100μm以下的氧化铝（A），D50为1μm以上且10μm以下的氧化铝（B）和D50为0.01μm以上的氧化铝（C） 和5μm以下，其中D50是从重量累积粒度分布的最小粒子侧累积的50％的粒径，氧化铝（A）的含量，氧化铝（B）的含量和 氧化铝（C）分别为50体积％以上且90体积％以下，5体积％以上且40体积％以下，1体积％以上且30体积％以下， 基于氧化铝粉末的体积（氧化铝（A），氧化铝（B）和氧化铝（C）的总体积％）为100体积％ y体积）。

公开(公告)号：US07473853B2

公开(公告)日：2009-01-06

申请号：US11362516

申请日：2006-02-27

Applicant: Makoto Murai ,  Ryosuke Usui

Inventor： Makoto Murai ,  Ryosuke Usui

IPC: H05K1/16

CPC classification number: C23C28/00 ,  C23C28/322 ,  C23C28/345 ,  H01L23/3121 ,  H01L23/3733 ,  H01L23/3735 ,  H01L23/3737 ,  H01L23/49822 ,  H01L23/49894 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/0206 ,  H05K1/056 ,  H05K3/284 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/0269 ,  H05K2201/068 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2203/0315 ,  Y10T428/24331 ,  Y10T428/24917 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

Abstract: The present invention provides a circuit device capable of controlling deformation of a circuit device while preventing an insulating layer from peeling from a substrate. The circuit device includes a substrate, an insulating layer formed on the substrate, a filler filled into the insulating layer, a conductive layer formed on the insulating layer, and a circuit element formed on the conductive layer, wherein an average particle diameter of the filler filled into the insulating layer is controlled so that a Young's modulus of a part of the insulating layer on a substrate side can be smaller than a Young's modulus of a part of the insulating layer on an opposite side relative to the substrate side.

Abstract translation: 本发明提供一种能够控制电路装置的变形同时防止绝缘层从基板剥离的电路装置。 该电路装置包括基板，形成在基板上的绝缘层，填充到绝缘层中的填充物，形成在绝缘层上的导电层和形成在导电层上的电路元件，其中填料的平均粒径 控制填充到绝缘层中，使得基板侧的绝缘层的一部分的杨氏模量可以小于相对于基板侧的相对侧的绝缘层的一部分的杨氏模量。

公开(公告)号：US20080099539A1

公开(公告)日：2008-05-01

申请号：US11975227

申请日：2007-10-17

Applicant: Cheng Tay ,  Pek Tan ,  Swee Cheng ,  Eng Yap

Inventor： Cheng Tay ,  Pek Tan ,  Swee Cheng ,  Eng Yap

IPC: B23K31/02 ,  B23K37/00

CPC classification number: B23K1/0016 ,  B23K2101/42 ,  H01L21/4853 ,  H01L21/486 ,  H05K3/3484 ,  H05K2201/0266 ,  H05K2201/035 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2203/043 ,  H05K2203/1476

Abstract: In one embodiment, a method is provided. The method comprises filling a microvia formed in a bond pad with solder paste comprising solder balls of the first size; and coating the bond pad with solder paste comprising solder balls of the second size, wherein the second size is greater than the first size.

Abstract translation: 在一个实施例中，提供了一种方法。 该方法包括用形成第一尺寸的焊球的焊膏填充在焊盘中形成的微孔; 以及用包括第二尺寸的焊球的焊膏涂覆所述接合焊盘，其中所述第二尺寸大于所述第一尺寸。

公开(公告)号：US20070164349A1

公开(公告)日：2007-07-19

申请号：US11616182

申请日：2006-12-26

Applicant: Mayumi Nakasato ,  Makoto Murai ,  Ryosuke Usui ,  Hideki Mizuhara ,  Yasunori Inoue

Inventor： Mayumi Nakasato ,  Makoto Murai ,  Ryosuke Usui ,  Hideki Mizuhara ,  Yasunori Inoue

IPC: H01L29/788

CPC classification number: H01L21/6835 ,  H01L23/145 ,  H01L23/3737 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2221/68345 ,  H01L2221/68377 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/0206 ,  H05K1/0373 ,  H05K3/421 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0209 ,  H05K2201/0248 ,  H05K2201/0266 ,  H05K2201/09509 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: A circuit board includes a substrate and an insulating layer. The substrate has a first surface. The insulating layer has a second surface and is connected to the substrate. The first surface is in contact with the second surface. Heat-conductive particles are provided in the insulating layer. A part of the particles projects from the second surface of the insulating layer and is in contact with the first surface of the substrate.

Abstract translation: 电路板包括基板和绝缘层。 衬底具有第一表面。 绝缘层具有第二表面并连接到基板。 第一表面与第二表面接触。 在绝缘层中设置导热粒子。 一部分颗粒从绝缘层的第二表面突出并且与衬底的第一表面接触。