公开(公告)号：US20150334829A1

公开(公告)日：2015-11-19

申请号：US14809117

申请日：2015-07-24

Applicant: Tessera, Inc.

Inventor： Cyprian UZOH ,  Vage OGANESIAN ,  Ilyas MOHAMMED ,  Belgacem Haba ,  Piyush Savalia ,  Craig Mitchell

IPC: H05K1/09 ,  H01L23/00

CPC classification number: H01L24/05 ,  H01L2224/04042 ,  H01L2224/05083 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05169 ,  H01L2224/056 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01074 ,  H01L2924/013 ,  H05K1/09 ,  H05K3/4007 ,  H05K2201/032 ,  H05K2201/0326 ,  H05K2201/0338

Abstract: A barrier layer includes a variable-composition nickel alloy layer with a minor constituent of boron, carbon, phosphorus, and tungsten varying throughout the nickel alloy layer in a direction from the bottom surface to the top surface of the nickel alloy layer.

Abstract translation: 阻挡层包括在镍合金层的从底面到顶面的方向上遍及镍合金层的硼，碳，磷和钨的次要成分的可变成分的镍合金层。

公开(公告)号：US20150319863A1

公开(公告)日：2015-11-05

申请号：US14700438

申请日：2015-04-30

Applicant: Dhananjaya Turpuseema ,  Thomas P. Warwick ,  Thomas Smith ,  James V. Russell

Inventor： Dhananjaya Turpuseema ,  Thomas P. Warwick ,  Thomas Smith ,  James V. Russell

IPC: H05K1/18 ,  H05K3/36 ,  H05K3/46 ,  H05K3/32 ,  H05K1/14 ,  H05K3/00

CPC classification number: H05K1/188 ,  H05K1/144 ,  H05K1/183 ,  H05K1/186 ,  H05K3/0026 ,  H05K3/0094 ,  H05K3/321 ,  H05K3/366 ,  H05K3/4655 ,  H05K3/4679 ,  H05K2201/032 ,  H05K2201/0355 ,  H05K2201/042 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09545 ,  H05K2201/09572 ,  H05K2203/0485 ,  H05K2203/063 ,  H05K2203/11 ,  Y10T29/49128 ,  Y10T29/4914

Abstract: A method and electrical interconnect structure internal to a printed circuit board for the purposes of creating a reliable, high performing connection method between embedded component terminals, signal traces and or power/ground planes which may occupy the same vertical space as the embedded components, such as a capacitor or resistor. Further easing the assembly and reliability through the manufacturing process of said embedded component structures. In one structure castellated drilled, plated vias connect the trace or plane within the printed circuit board to the electrical terminals of the embedded component using a permanent and highly conductive attach material. In another structure, the trace or plane connect by selective side-wall plating, which surrounds the electrical terminal of the component. This structure also uses a permanent and highly conductive attach material to electrically connect the component terminal to the plated side-wall and in a final embodiment the terminals are connected through a conductive attach material through a via in the z axis to a conductive pad.

Abstract translation: 印刷电路板内部的方法和电互连结构，用于在嵌入式组件端子，信号迹线和/或电源/接地平面之间建立可靠的，高性能的连接方法，其可能占据与嵌入式组件相同的垂直空间，例如 作为电容器或电阻器。 通过所述嵌入式组件结构的制造过程进一步减轻组装和可靠性。 在一种结构化的钻孔中，电镀通孔使用永久且高度导电的附着材料将印刷电路板中的迹线或平面连接到嵌入式部件的电气端子。 在另一种结构中，迹线或平面通过选择性侧壁电镀连接，该电镀围绕部件的电端子。 该结构还使用永久且高度导电的附着材料将组件端子电连接到电镀侧壁，并且在最终实施例中，端子通过导电附着材料通过z轴上的通孔连接到导电焊盘。

公开(公告)号：US20150299477A1

公开(公告)日：2015-10-22

申请号：US14436565

申请日：2013-10-18

Applicant: NAMICS CORPORATION

Inventor： Yoshiaki YOSHII

IPC: C09D5/24 ,  H05K1/09 ,  H05K3/10 ,  H05K1/18

CPC classification number: C09D5/24 ,  C09D7/40 ,  C09D201/00 ,  H01B1/16 ,  H01B1/22 ,  H05K1/092 ,  H05K1/18 ,  H05K3/10 ,  H05K2201/032 ,  H05K2203/1126 ,  H05K2203/12

Abstract: A conductive paste including: (A) a silver powder; (B) a glass frit; (C) an organic binder; and (D) a powder containing copper, tin, and manganese.

Abstract translation: 导电浆料，包括：（A）银粉; （B）玻璃料; （C）有机粘合剂; 和（D）含有铜，锡和锰的粉末。

公开(公告)号：US20150235728A1

公开(公告)日：2015-08-20

申请号：US14361062

申请日：2014-04-03

Applicant: Nuovo Film, Inc.

Inventor： Hakfei Poon

IPC: H01B1/02 ,  H05K1/02 ,  C23C22/73 ,  C23C22/78 ,  B22F9/16 ,  C23C22/58

CPC classification number: H01B1/02 ,  B22F9/16 ,  C23C22/58 ,  C23C22/73 ,  C23C22/78 ,  G06F3/041 ,  G06F2203/04103 ,  G06F2203/04112 ,  H01B1/22 ,  H01B13/30 ,  H01L31/022466 ,  H01L31/1884 ,  H05K1/0274 ,  H05K1/0298 ,  H05K1/03 ,  H05K1/09 ,  H05K2201/0108 ,  H05K2201/0302 ,  H05K2201/032 ,  Y10T428/249921

Abstract: Discloses herein is a method to make a surface functionalized metal nanowire. The surface functionalized metal nanowire retains the electrical conductivity but lose the luster. This is a key enabler for making ultra-low haze (haze

Abstract translation: 本文公开了制备表面官能化金属纳米线的方法。 表面官能化金属纳米线保持导电性，但失去光泽。 这是制造超低雾度（雾度<0.5）银纳米线基导电膜的关键推动因素。

公开(公告)号：US20150156887A1

公开(公告)日：2015-06-04

申请号：US14209143

申请日：2014-03-13

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Ji Sung Cho ,  Toshiko Yokota ,  Makoto Dobashi ,  Jin Gu Kim ,  Ichiro Ogura ,  Je Hong Kyoung

IPC: H05K3/02 ,  H05K1/09

CPC classification number: H05K3/022 ,  H05K1/09 ,  H05K3/16 ,  H05K2201/0137 ,  H05K2201/032 ,  H05K2201/0338 ,  Y10T428/12569

Abstract: Disclosed herein are a method of forming an amorphous alloy film and a printed wiring board manufactured by the same. The amorphous alloy film may be formed on a copper foil as one of rust-proofing treatment methods of the copper foil to thereby simultaneously show and improve corrosion-resistance and conductivity, and the amorphous alloy film may be formed by the sputtering deposition method, such that high melting point materials may be manufactured as a thin film at a relatively low temperature and the amorphous alloy film having strong adhesion strength with a substrate may be obtained.

Abstract translation: 本文公开了形成非晶合金膜的方法和由其制造的印刷线路板。 非晶合金膜可以形成在铜箔上作为铜箔的防锈处理方法之一，从而同时显示并提高耐腐蚀性和导电性，并且非晶合金膜可以通过溅射沉积法形成，例如 可以在相对低的温度下制造高熔点材料作为薄膜，并且可以获得与基板具有强粘合强度的非晶态合金膜。

公开(公告)号：US20150009638A1

公开(公告)日：2015-01-08

申请号：US14368878

申请日：2013-01-21

Applicant: Atotech Deutschland GmbH

Inventor： Boris Alexander Janssen

IPC: H05K1/09 ,  H05K1/02 ,  C23C18/16 ,  H05K3/22 ,  C23C18/50

CPC classification number: H05K1/09 ,  B05D5/12 ,  C23C18/16 ,  C23C18/1633 ,  C23C18/36 ,  C23C18/50 ,  H05K1/028 ,  H05K3/22 ,  H05K3/244 ,  H05K2201/032

Abstract: The present invention relates to a method for electroless deposition of a bendable nickel-phosphorous alloy layer onto flexible substrates such as flexible printed circuit boards and the like. The nickel-phosphorous alloy layer is deposited from an aqueous plating bath comprising nickel ions, hypophosphite ions, at least one complexing agent and a grain refining additive selected from the group consisting of formaldehyde and formaldehyde precursors. The nickel-phosphorous alloy layers obtained have a columnar microstructure oriented perpendicular to the flexible substrate and are sufficiently bendable.

Abstract translation: 本发明涉及一种将可弯曲的镍 - 磷合金层无电沉积到诸如柔性印刷电路板等柔性基板上的方法。 镍 - 磷合金层由包含镍离子，次亚磷酸根离子，至少一种络合剂和选自甲醛和甲醛前体的晶粒细化添加剂的水性镀浴沉积。 获得的镍 - 磷合金层具有垂直于柔性基板的柱状微结构，并且是足够弯曲的。

公开(公告)号：US08749989B1

公开(公告)日：2014-06-10

申请号：US12655318

申请日：2009-12-28

Applicant: Harvey L. Kaylie ,  Aron Raklyar

Inventor： Harvey L. Kaylie ,  Aron Raklyar

IPC: H05K7/10 ,  H05K7/12

CPC classification number: H05K1/111 ,  H01L23/13 ,  H01L23/15 ,  H01L23/49805 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/113 ,  H05K2201/032 ,  H05K2201/0753 ,  H05K2201/10378 ,  H01L2924/00

Abstract: An LTCC carrier composed of thermosetting polymer, woven glass fiber and ceramic has gold over nickel contact pads on top and bottom surfaces and conductive vias therethrough between aligned pairs of top and bottom pads. The vias prevent undesirable inductive paths from limiting high frequency operation of the circuitry. Solder deposits on the top pads attach the LTCC component, which is further secured to the carrier by epoxy, thus improving resistance to thermal stress and mechanical shock. A slot through the carrier body between top and bottom surfaces further reduces thermal stress and mechanical shock. Metallized castellations on opposite carrier sides provide additional surface area for reflow solder joints with the PCB, and a means for visually inspecting the solder joint quality. A gap in the metallization on the top layer of the carrier prevents solder spreading during multiple soldering cycles, which may result in poor solder joints.

Abstract translation: 由热固性聚合物，编织玻璃纤维和陶瓷组成的LTCC载体在顶部和底部表面上的镍接触焊盘上具有金，并且在对准的顶部和底部焊盘对之间穿过其中的导电通孔。 通孔防止不期望的电感路径限制电路的高频操作。 顶部焊盘上的焊料沉积物连接LTCC部件，其通过环氧树脂进一步固定到载体上，从而改善对热应力和机械冲击的抗性。 在顶面和底面之间穿过承载体的槽进一步降低了热应力和机械冲击。 在相对的载体侧上的金属化的蓖耳体为PCB的回流焊接提供额外的表面积，以及用于目视检查焊点质量的手段。 载体顶层上的金属化中的间隙防止在多个焊接周期期间的焊料扩散，这可能导致差的焊接点。

公开(公告)号：US20130299216A1

公开(公告)日：2013-11-14

申请号：US13944105

申请日：2013-07-17

Applicant: FUJIFILM Corporation

Inventor： Akira ICHIKI

IPC: H05K1/03

CPC classification number: H05K1/0274 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K1/03 ,  H05K3/106 ,  H05K2201/0108 ,  H05K2201/0317 ,  H05K2201/032

Abstract: A transparent electrode sheet includes a transparent support having thereon patterned electrodes, and an absolute value of a difference between a reflection chromaticity of a surface of the electrode of far side from the transparent support and a reflection chromaticity of a surface of the electrode of near side to the transparent support is not more than 2.

Abstract translation: 透明电极片包括其上具有图案化电极的透明支撑体和远侧透明支撑体的电极表面的反射色度与近侧电极表面的反射色度之差的绝对值 对透明支持不超过2。

公开(公告)号：US20130216855A1

公开(公告)日：2013-08-22

申请号：US13823349

申请日：2012-08-30

Applicant: Tomota Nagaura ,  Kazuhiko Sakaguchi

Inventor： Tomota Nagaura ,  Kazuhiko Sakaguchi

IPC: H05K1/09

CPC classification number: H05K1/09 ,  B32B15/01 ,  C23C18/165 ,  C23C18/31 ,  C23C28/023 ,  C25D1/04 ,  C25D3/04 ,  C25D3/12 ,  C25D3/14 ,  C25D3/16 ,  C25D3/38 ,  C25D3/562 ,  C25D3/565 ,  C25D3/58 ,  C25D5/14 ,  C25D7/0614 ,  C25D9/08 ,  C25D11/38 ,  H05K3/025 ,  H05K2201/0317 ,  H05K2201/032 ,  H05K2201/0338 ,  H05K2201/0355 ,  H05K2203/0307 ,  Y10T428/12438 ,  Y10T428/12493 ,  Y10T428/12514 ,  Y10T428/12611 ,  Y10T428/12667 ,  Y10T428/12861 ,  Y10T428/12882 ,  Y10T428/1291 ,  Y10T428/12931 ,  Y10T428/12944 ,  Y10T428/12958 ,  Y10T428/24917

Abstract: The present invention provides a carrier-attached copper foil, wherein an ultrathin copper foil is not peeled from the carrier prior to the lamination to an insulating substrate, but can be peeled from the carrier after the lamination to the insulating substrate. A carrier-attached copper foil comprising a copper foil carrier, an intermediate layer laminated on the copper foil carrier, and an ultrathin copper layer laminated on the intermediate layer, wherein the intermediate foil is configured with a Ni layer in contact with an interface of the copper foil carrier and a Cr layer in contact with an interface of the ultrathin copper layer, said Ni layer containing 1,000-40,000 μg/dm2 of Ni and said Cr layer containing 10-100 μg/dm2 of Cr is provided.

Abstract translation: 本发明提供一种载体附着铜箔，其中在层压到绝缘基板之前，超薄铜箔不从载体剥离，而是可以在与绝缘基板层合之后从载体上剥离。 一种载体附着铜箔，包括铜箔载体，层压在所述铜箔载体上的中间层和层压在所述中间层上的超薄铜层，其中所述中间箔配置有与所述中间层的界面接触的Ni层 铜箔载体和与超薄铜层的界面接触的Cr层，所述Ni层含有1,000-40,000mug / dm 2的Ni，所述Cr层含有10-100mug / dm 2的Cr。

公开(公告)号：US20130014978A1

公开(公告)日：2013-01-17

申请号：US13183870

申请日：2011-07-15

Applicant: Cyprian Uzoh ,  Vage Oganesian ,  Ilyas Mohammed ,  Belgacem Haba ,  Piyush Savalia ,  Craig Mitchell

Inventor： Cyprian Uzoh ,  Vage Oganesian ,  Ilyas Mohammed ,  Belgacem Haba ,  Piyush Savalia ,  Craig Mitchell

IPC: H05K1/09 ,  B05D1/36 ,  B05D5/12

CPC classification number: H01L24/05 ,  H01L2224/04042 ,  H01L2224/05083 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05169 ,  H01L2224/056 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01074 ,  H01L2924/013 ,  H05K1/09 ,  H05K3/4007 ,  H05K2201/032 ,  H05K2201/0326 ,  H05K2201/0338

Abstract: Barrier layers for use in electrical applications. In some embodiments the barrier layer is a laminated barrier layer. In some embodiments the barrier layer includes a graded barrier layer.

Abstract translation: 用于电气应用的阻隔层。 在一些实施例中，阻挡层是层压阻挡层。 在一些实施例中，阻挡层包括梯度阻挡层。