公开(公告)号：US20150181710A1

公开(公告)日：2015-06-25

申请号：US14408205

申请日：2013-03-13

Applicant: HSIO TECHNOLOGIES, LLC

Inventor： James Rathburn

IPC: H05K1/18 ,  H05K3/10 ,  H05K1/02

CPC classification number: H05K1/181 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H05K1/0216 ,  H05K1/0256 ,  H05K1/0284 ,  H05K1/16 ,  H05K3/107 ,  H05K3/4664 ,  H05K3/4694 ,  H05K2201/0344 ,  H05K2201/10674 ,  H05K2201/10734 ,  Y10T29/49155 ,  H01L2924/00014

Abstract: A high density region for a low density circuit. At least a first liquid dielectric layer is deposited on the first surface of a first circuitry layer. The dielectric layer is imaged to create plurality of first recesses. Surfaces of the first recesses are plated electro-lessly with a conductive material to form first conductive structures electrically coupled to, and extending generally perpendicular to, the first circuitry layer. A plating resist is applied. A conductive material is electro-plated to the first conductive structure to substantially fill the first recesses, and the plating resist is removed.

Abstract translation: 低密度电路的高密度区域。 至少第一液体介电层沉积在第一电路层的第一表面上。 对电介质层进行成像以产生多个第一凹槽。 第一凹槽的表面电镀不良地与导电材料电镀以形成电耦合到第一电路层并且大致垂直于第一电路层延伸的第一导电结构。 应用电镀抗蚀剂。 将导电材料电镀到第一导电结构以基本上填充第一凹部，并且去除电镀抗蚀剂。

公开(公告)号：US08935850B2

公开(公告)日：2015-01-20

申请号：US13776024

申请日：2013-02-25

Applicant: Ibiden Co., Ltd.

Inventor： Masahiro Kaneko ,  Satoru Kose ,  Hirokazu Higashi

IPC: H05K3/02 ,  H05K3/10 ,  H05K1/11 ,  H01L21/683 ,  H01L25/065 ,  H01L23/498 ,  H01L23/00 ,  H05K3/38 ,  H05K3/00

CPC classification number: H05K3/42 ,  H01L21/6835 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49866 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2221/68345 ,  H01L2224/32057 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48644 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85001 ,  H01L2224/85385 ,  H01L2224/85444 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K1/0313 ,  H05K1/113 ,  H05K1/115 ,  H05K3/007 ,  H05K3/108 ,  H05K3/22 ,  H05K3/388 ,  H05K2201/0344 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/09563 ,  H05K2203/072 ,  H05K2203/1377 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2924/00012 ,  H01L2924/00011 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A method for manufacturing a printed wiring board includes forming a removable layer on a support substrate, forming an interlayer resin insulation layer on the removable layer, forming a penetrating hole in the interlayer resin insulation layer, forming a first conductive layer on the interlayer resin insulation layer and on a side wall of the penetrating hole, forming a conductive circuit on the interlayer resin insulation layer, forming a via conductor in the penetrating hole, removing the support substrate from the interlayer resin insulation layer by using the removable layer, forming a protruding portion of the via conductor protruding from a surface of the interlayer resin insulation layer, and forming a surface-treatment coating on a surface of the protruding portion of the via conductor.

Abstract translation: 一种制造印刷电路板的方法，包括在支撑基板上形成可移除层，在可移除层上形成层间树脂绝缘层，在层间树脂绝缘层中形成贯通孔，在层间树脂绝缘层上形成第一导电层 在所述贯通孔的侧壁上形成导电电路，在所述层间树脂绝缘层上形成导通电路，在所述贯通孔中形成通路导体，使用所述可移除层从所述层间树脂绝缘层除去所述支撑基板， 所述通孔导体的一部分从所述层间树脂绝缘层的表面突出，并且在所述通孔导体的所述突出部分的表面上形成表面处理涂层。

公开(公告)号：US20140014521A1

公开(公告)日：2014-01-16

申请号：US14029637

申请日：2013-09-17

Applicant: ARAKAWA CHEMICAL INDUSTRIES, LTD.

Inventor： Akihisa HAMAZAWA ,  Koji Nishimura ,  Hideki Goda

IPC: H05K1/02

CPC classification number: H05K1/0277 ,  H05K1/0346 ,  H05K1/0373 ,  H05K1/0393 ,  H05K3/108 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0344 ,  H05K2201/068 ,  Y10T29/49124

Abstract: An object of the present invention is to provide a flexible circuit board that maintains high insulation reliability, exhibits high wiring adhesion, has low thermal expansion, and allows the formation of a fine circuit thereon. Specifically, the present invention provides a flexible circuit board, wherein at least a nickel plating layer is laminated on a polyimide film to form a polyimide film provided with a nickel plating layer and a wiring pattern is applied to the nickel plating layer thereof. The polyimide film has a thermal expansion coefficient of 0 to 8 ppm/° C. in the temperature range from 100 to 200° C., and the nickel plating layer has a thickness of 0.03 to 0.3 μm.

Abstract translation: 本发明的目的是提供一种保持高绝缘可靠性，显示出高布线附着力，低热膨胀性并且允许在其上形成微细电路的柔性电路板。 具体地说，本发明提供一种挠性电路基板，其中，在聚酰亚胺膜上层叠有至少一层镍镀层，形成具有镀镍层的聚酰亚胺膜，并且对其镀镍层施加布线图案。 聚酰亚胺膜在100〜200℃的温度范围内的热膨胀系数为0〜8ppm /℃，镍镀层的厚度为0.03〜0.3μm。

公开(公告)号：US20100047517A1

公开(公告)日：2010-02-25

申请号：US12556143

申请日：2009-09-09

Applicant: Satoru Zama ,  Kenichi Ohga

Inventor： Satoru Zama ,  Kenichi Ohga

IPC: B32B3/10 ,  B05D3/02 ,  B05D7/22 ,  B32B15/04

CPC classification number: H05K3/022 ,  C22C1/002 ,  C23C18/31 ,  C25D5/50 ,  H05K1/0393 ,  H05K3/181 ,  H05K3/38 ,  H05K2201/0129 ,  H05K2201/0344 ,  H05K2203/1105 ,  Y10T428/24322 ,  Y10T428/31678

Abstract: A method for manufacturing a metal clad laminate having a film and a metal layer formed of a foundation layer and an upper layer includes the steps of forming the foundation layer on at least a part of a surface of the film by plating to obtain a first laminate; forming the upper layer on the first laminate by plating to obtain a second laminate; and heating the second laminate to obtain the metal clad laminate. Further, the film is a flexible thermoplastic polymer film, the foundation layer is formed of a nickel alloy, the upper layer is formed of copper, at least one of the foundation layer and the upper layer has a compression stress before the step of heating the second laminate, and the metal clad laminate shrinks in a planar direction of the film during the step of heating the second laminate.

Abstract translation: 一种具有由基底层和上层形成的膜和金属层的金属覆层叠层的制造方法，包括以下步骤：通过电镀在所述膜的至少一部分表面上形成所述基底层，以获得第一层压体 ; 通过电镀在第一层压体上形成上层以获得第二层压体; 并加热第二层压板以获得覆金属层压板。 此外，该膜是柔性热塑性聚合物膜，基底层由镍合金形成，上层由铜形成，基础层和上层中的至少一个在加热步骤之前具有压缩应力 第二层压体，并且在加热第二层压体的步骤期间，金属包覆层压板在膜的平面方向上收缩。

公开(公告)号：US20090297873A1

公开(公告)日：2009-12-03

申请号：US12359087

申请日：2009-01-23

Applicant: Jungsup YUM ,  Dongki KO

Inventor： Jungsup YUM ,  Dongki KO

IPC: B32B3/10

CPC classification number: H05K3/426 ,  H05K1/0393 ,  H05K1/116 ,  H05K3/181 ,  H05K2201/0344 ,  H05K2201/09736 ,  H05K2201/09827 ,  Y10T428/12361 ,  Y10T428/24322

Abstract: A flexible film and a display device including the same are provided. The flexible film includes an insulating film including a hole, an inner surface surrounding the hole, a first surface, and a second surface opposite the first surface and a metal layer covering the inner surface and at least one of the first and second surfaces. The metal layer includes a first layer and a second layer. The metal layer has a first portion around the hole and a second portion encompassing the first portion. The first portion has a thickness greater than a thickness of the second portion.

Abstract translation: 提供了一种柔性膜和包括该柔性膜的显示装置。 柔性膜包括绝缘膜，包括孔，围绕孔的内表面，第一表面和与第一表面相对的第二表面和覆盖内表面的金属层和第一表面和第二表面中的至少一个。 金属层包括第一层和第二层。 金属层具有围绕孔的第一部分和包围第一部分的第二部分。 第一部分的厚度大于第二部分的厚度。

公开(公告)号：US20090295684A1

公开(公告)日：2009-12-03

申请号：US12358994

申请日：2009-01-23

Applicant: Jungsup YUM ,  Dongki Ko

Inventor： Jungsup YUM ,  Dongki Ko

IPC: G09G3/20 ,  B32B3/10

CPC classification number: H05K3/426 ,  H05K1/0393 ,  H05K3/0032 ,  H05K3/181 ,  H05K2201/0344 ,  H05K2201/09827 ,  Y10T428/24331

Abstract: A flexible film and a display device including the same are disclosed. The flexible film includes an insulating film and first and second metal layers on the insulating film. The insulating film including at least one hole, a first surface corresponding to an inner circumferential surface of the hole, a second surface corresponding to an upper surface of the insulating film, and a third surface corresponding to a lower surface of the insulating film. The first metal layer and the second metal layer are positioned on the first surface and at least one of the second and third surfaces. An angle between the first surface and the second surface is equal to or greater than an angle between the first surface and the third surface.

Abstract translation: 公开了一种柔性膜和包括该柔性膜的显示装置。 柔性膜包括绝缘膜和绝缘膜上的第一和第二金属层。 所述绝缘膜包括至少一个孔，对应于所述孔的内周面的第一表面，对应于所述绝缘膜的上表面的第二表面，以及对应于所述绝缘膜的下表面的第三表面。 第一金属层和第二金属层位于第一表面和第二表面和第三表面中的至少一个表面上。 第一表面和第二表面之间的角度等于或大于第一表面和第三表面之间的角度。

公开(公告)号：US07488678B2

公开(公告)日：2009-02-10

申请号：US11716720

申请日：2007-03-09

Applicant: Satoshi Kimura ,  Hidemichi Furihata ,  Toshihiko Kaneda

Inventor： Satoshi Kimura ,  Hidemichi Furihata ,  Toshihiko Kaneda

IPC: H01L21/4763

CPC classification number: H01L21/288 ,  C23C18/1608 ,  C23C18/1651 ,  C23C18/1893 ,  C23C18/2086 ,  C23C18/30 ,  C23C18/34 ,  C23C18/40 ,  C23C18/54 ,  H01L21/76885 ,  H05K3/184 ,  H05K3/24 ,  H05K2201/0344 ,  H05K2203/0565 ,  H05K2203/073

Abstract: A method of manufacturing an interconnect substrate by electroless plating, including: (a) forming a catalyst layer with a specific pattern on a substrate; (b) immersing the substrate in a first electroless plating solution including a first metal to deposit the first metal on the catalyst layer to form a first metal layer; and (c) immersing the substrate in a second electroless plating solution including a second metal to deposit the second metal on the first metal layer to form a second metal layer, an ionization tendency of the first metal being higher than an ionization tendency of the second metal.

Abstract translation: 一种通过化学镀制造互连基板的方法，包括：（a）在基板上形成具有特定图案的催化剂层; （b）将基板浸入包含第一金属的第一非电镀溶液中以将第一金属沉积在催化剂层上以形成第一金属层; 以及（c）将所述基板浸渍在包含第二金属的第二非电解镀液中以将所述第二金属沉积在所述第一金属层上以形成第二金属层，所述第一金属的电离倾向高于所述第二金属的电离倾向 金属。

公开(公告)号：US20080248194A1

公开(公告)日：2008-10-09

申请号：US11948320

申请日：2007-11-30

Applicant: Akinobu NASU ,  Shyuan-Fang Chen ,  Wen-Jin Li ,  Yi-Tsung Chen

Inventor： Akinobu NASU ,  Shyuan-Fang Chen ,  Wen-Jin Li ,  Yi-Tsung Chen

IPC: B05D5/12

CPC classification number: H05K3/181 ,  C23C18/1651 ,  C23C18/1696 ,  C23C18/1841 ,  C23C18/30 ,  C23C18/40 ,  H05K3/244 ,  H05K2201/0344 ,  H05K2203/0716 ,  H05K2203/072

Abstract: Methods and apparatus for producing a copper layer on substrate in a flat panel display manufacturing process, where the copper is electrodelessly deposited on a substrate to form a copper interconnection layer. A copper solution containing: CuSO4 5H2O as a copper source, potassium sodium tartrate or trisodium citrate as a complexing agent, glyoxylate, glyoxilic acid or sodium phosphate as a reducing agent, a sulfur organic compound as a stabilizing agent, and a pH adjusting agent, is used to form the copper interconnection layer on the substrate.

Abstract translation: 在平板显示器制造工艺中在基板上制造铜层的方法和装置，其中铜无电极沉积在基板上以形成铜互连层。 作为铜源的包含CuSO 4 H 2 O 2 O 2的铜溶液，作为络合剂的酒石酸钾钠盐或柠檬酸钠盐，乙醛酸盐，乙氧基化磷酸盐或磷酸钠作为还原剂 作为稳定剂的硫有机化合物和pH调节剂，用于在基板上形成铜互连层。

公开(公告)号：US20070085654A1

公开(公告)日：2007-04-19

申请号：US11549792

申请日：2006-10-16

Applicant: Swapan Bhattacharya ,  Stephen Horst ,  Ioannis Papapolymerou ,  Manos Tentzeris

Inventor： Swapan Bhattacharya ,  Stephen Horst ,  Ioannis Papapolymerou ,  Manos Tentzeris

IPC: H01C10/00

CPC classification number: H01C17/18 ,  H01C7/006 ,  H01C17/06526 ,  H05K1/167 ,  H05K3/181 ,  H05K3/381 ,  H05K3/387 ,  H05K2201/0141 ,  H05K2201/0344 ,  H05K2203/095

Abstract: The present invention includes an apparatus including a thin film resistor. The thin film resistor includes a resistive component, a body, and a reactant. The resistive component includes a nickel-composite material. The body has a predetermined, sturdy shape. The body carries the resistive component. The reactant manipulates the body to enable the resistive component to adhere to the body.

Abstract translation: 本发明包括一种包括薄膜电阻器的装置。 薄膜电阻器包括电阻元件，主体和反应物。 电阻元件包括镍复合材料。 身体有一个预定的，坚固的形状。 身体携带电阻元件。 反应物操纵身体以使电阻组件粘附到身体上。

公开(公告)号：US20060060558A1

公开(公告)日：2006-03-23

申请号：US11094618

申请日：2005-03-30

Applicant: Duck Maeng ,  Byung Sun ,  Jong Bae ,  Tae Kim

Inventor： Duck Maeng ,  Byung Sun ,  Jong Bae ,  Tae Kim

IPC: C23F1/00 ,  H01B13/00

CPC classification number: H05K3/4661 ,  C23F1/02 ,  H05K3/108 ,  H05K3/4602 ,  H05K2201/0344 ,  H05K2201/09563

Abstract: Disclosed is a method of fabricating a package substrate using electroless nickel plating. The method includes preparing a base substrate, on which an internal layer circuit pattern is formed through a predetermined masking process; forming an insulating layer on the base substrate to achieve interlayer electric insulation; forming a first via hole through the insulating layer to achieve interlayer electric connection; forming a seed layer on the insulating layer through which the first via hole is formed; and forming an external layer circuit pattern on the seed layer through the other predetermined masking process. The seed layer is partially or selectively flash etched so as to prevent via open and undercut formed at the external layer circuit pattern.

Abstract translation: 公开了使用无电镀镍制造封装衬底的方法。 该方法包括：准备基板，通过预定的掩模工艺在其上形成内层电路图形; 在基底基板上形成绝缘层以实现层间电绝缘; 通过绝缘层形成第一通孔以实现层间电连接; 在形成有第一通孔的绝缘层上形成籽晶层; 以及通过另一个预定的掩蔽过程在种子层上形成外部层电路图案。 种子层被部分或选择性地快速蚀刻，以防止在外部层电路图案处形成的通孔打开和底切。