公开(公告)号：US07759784B2

公开(公告)日：2010-07-20

申请号：US11196269

申请日：2005-08-04

Applicant: Masahiro Ono ,  Shigeru Kondou ,  Kazuhiro Nishikawa ,  Kazuto Nishida

Inventor： Masahiro Ono ,  Shigeru Kondou ,  Kazuhiro Nishikawa ,  Kazuto Nishida

IPC: H01L23/02

CPC classification number: H05K1/183 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2225/1035 ,  H01L2225/1064 ,  H01L2924/1627 ,  H01L2924/3511 ,  H05K2201/0382 ,  H05K2201/10674 ,  H05K2201/2018 ,  H05K2203/0278

Abstract: A 3D circuit module which is highly reliable, easily layered and able to mount electronic components in high density is obtained by providing a support member having a frame in the periphery thereof and a recess; a coating layer for coating the frame and filling in the recess, the coating layer being made of resin material which is adhesive and has a softening temperature lower than the softening temperature of the support member; a wiring pattern formed on the coating layer, the wiring pattern including a first land on the frame, a second land on the recess, and a wiring part for connecting between the first land and the second land; and an electronic component having a projecting electrode formed on a side thereof, the electronic component being bonded to the coating layer and accommodated in the recess, with the projecting electrode connected to the second land.

Abstract translation: 通过在其周边设置具有框架的支撑构件和凹部，获得高度可靠，容易分层并能够以高密度安装电子部件的3D电路模块; 用于涂覆所述框架并填充所述凹部的涂层，所述涂层由粘合剂并且具有低于所述支撑构件的软化温度的软化温度的树脂材料制成; 形成在所述涂层上的布线图案，所述布线图案包括所述框架上的第一平台，所述凹部上的第二平台，以及用于连接所述第一平台和所述第二平台之间的布线部分; 以及电子部件，其具有在其一侧形成的突出电极，所述电子部件被接合到所述涂层并容纳在所述凹部中，所述突出电极连接到所述第二焊盘。

公开(公告)号：US20090314525A1

公开(公告)日：2009-12-24

申请号：US11915990

申请日：2006-05-31

Applicant: Hitoshi Kajino ,  Takeo Taguchi ,  Kanji Sato ,  Masahito Ishii ,  Tatsuo Kataoka

Inventor： Hitoshi Kajino ,  Takeo Taguchi ,  Kanji Sato ,  Masahito Ishii ,  Tatsuo Kataoka

IPC: H05K1/03 ,  H01K3/22 ,  H01R43/16 ,  H05K3/10 ,  H05K1/11

CPC classification number: H05K3/107 ,  H05K1/0265 ,  H05K3/0014 ,  H05K3/0055 ,  H05K3/007 ,  H05K3/045 ,  H05K3/06 ,  H05K3/244 ,  H05K3/421 ,  H05K3/465 ,  H05K3/4682 ,  H05K2201/0108 ,  H05K2201/0317 ,  H05K2201/0352 ,  H05K2201/0382 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2201/09727 ,  H05K2203/0108 ,  H05K2203/0152 ,  H05K2203/025 ,  H05K2203/0376 ,  H05K2203/0723 ,  H05K2203/073 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49204

Abstract: A process for producing a wiring board is provided, comprising allowing a wiring board-forming mold, which comprises a support base and a mold pattern that is formed in a protruded shape on one surface of the support base wherein the sectional width of the mold pattern on the support base side is larger than the sectional width thereof on the tip side in the same section of the mold pattern, to penetrate into a curing resin layer to transfer the mold pattern, curing the curing resin layer, releasing the laminate from the mold, depositing a conductive metal, and polishing the deposited metal layer that to form a depressed wiring pattern, and a wiring board produced by this process. Further, described is a process for producing a wiring board, comprising bringing a precision mold having a mold pattern on a surface of a mold base into contact with a surface of a metal thin film formed on an organic insulating base, pressing the mold to form a depression having a shape corresponding to the mold pattern of the precision mold in the organic insulating base, thereafter forming a metal plating layer having a thickness larger than the depth of the depression to fill the plating metal in the depression, and then polishing the metal plating layer until the organic insulating base is exposed, to form a wiring pattern, and a wiring pattern produced by this process.

Abstract translation: 提供了一种制造布线板的方法，包括允许包括支撑基底和在支撑基底的一个表面上形成为突出形状的模具图案的布线板形成模具，其中模具图案的截面宽度 在支撑基侧，在模具图案的同一部分的前端侧的截面宽度大于其，以渗透到固化树脂层中以转移模具图案，固化固化树脂层，从模具中释放层压体 ，沉积导电金属，并抛光沉积的金属层以形成凹陷的布线图案，以及通过该工艺生产的布线板。 此外，描述了一种制造布线板的方法，包括将具有模具图案的精密模具在模具基体的表面上与形成在有机绝缘基底上的金属薄膜的表面接触，压制模具以形成 具有与有机绝缘基体中的精密模具的模具图案对应的形状的凹部，然后形成厚度大于凹陷深度的金属镀层，以填充凹陷中的电镀金属，然后研磨金属 直到有机绝缘基底露出，形成布线图案，以及通过该工艺制造的布线图案。

公开(公告)号：US20090241337A1

公开(公告)日：2009-10-01

申请号：US12382876

申请日：2009-03-26

Applicant: Masaaki Tanaka ,  Kimiharu Kayukawa

Inventor： Masaaki Tanaka ,  Kimiharu Kayukawa

IPC: H01R43/02

CPC classification number: H01L24/81 ,  B23K1/0016 ,  B23K2101/42 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13019 ,  H01L2224/13076 ,  H01L2224/13078 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/81193 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01R12/52 ,  H01R43/0256 ,  H05K3/326 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/0382 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49213 ,  H01L2224/05599

Abstract: In a method of bonding a first bump on a surface of a first member and a second bump on a surface of a second member, a tip portion of the first bump is provided with a projection having a hardness greater than a hardness of each of the first and second bumps. The first and second members are positioned with respect to each other such that the first and second bumps face each other. The tip portion of the first bump is brought into contact with a tip portion of the second bump by sticking the projection into the tip portion of the second bump.

Abstract translation: 在第一构件的表面上的第一凸块与第二构件的表面上的第二凸块接合的方法中，第一凸块的前端部设置有硬度大于硬度的突起 第一和第二颠簸。 第一和第二构件相对于彼此定位成使得第一和第二凸起面对彼此。 第一凸起的顶端部通过将突起粘贴到第二凸块的顶端部而与第二凸块的前端部接触。

公开(公告)号：US07554230B2

公开(公告)日：2009-06-30

申请号：US11455927

申请日：2006-06-20

Applicant: Takayuki Kitagawa

Inventor： Takayuki Kitagawa

IPC: H02K11/00 ,  H02K5/22 ,  H02K9/22

CPC classification number: H05K3/326 ,  H02K5/225 ,  H02K11/33 ,  H02K2211/03 ,  H05K3/202 ,  H05K3/306 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/09118 ,  H05K2201/1059 ,  Y10S310/03

Abstract: A control circuit device for a motor is provided with a circuit board which has an electrically-conductive terminal for electrically connecting the motor with an exterior connector, a heat radiating unit which is connected with the circuit board to radiate heat generated by the circuit board. The heat radiating unit has a convex member at a surface thereof of the side where the electrically conductive terminal is arranged. The electrically conductive terminal is integrally formed with a concave member for being engaged with the convex member. The convex member is engaged with the concave member. Thus, a heat sink can be readily mounted without increasing the cost.

Abstract translation: 一种用于电动机的控制电路装置设置有电路板，该电路板具有用于将电动机与外部连接器电连接的导电端子，与电路板连接以辐射由电路板产生的热量的散热单元。 散热单元在布置导电端子的一侧的表面具有凸形构件。 导电端子与凹形构件整体形成，用于与凸形构件接合。 凸形构件与凹形构件接合。 因此，可以容易地安装散热器而不增加成本。

公开(公告)号：US20090059548A1

公开(公告)日：2009-03-05

申请号：US12203408

申请日：2008-09-03

Applicant: Akio Yasuda ,  Mutsumi Yoshino

Inventor： Akio Yasuda ,  Mutsumi Yoshino

IPC: H05K7/04

CPC classification number: H05K3/3421 ,  H05K1/056 ,  H05K1/111 ,  H05K3/202 ,  H05K3/4092 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/10272 ,  Y02P70/611 ,  Y02P70/613

Abstract: An electronic device mounting structure includes an electronic device, a busbar, and a solder. The electronic device has a body and a lead protruding from the body. The busbar has a flat portion and a wall portion rising from a periphery of the flat portion. The flat portion of the busbar extends parallel to a tip portion of the lead and is in contact with a back surface of the tip portion. The wall portion of the busbar faces a side surface of the tip portion with a predetermined space. The solder is located in the space and joins the side surface of the tip portion and the wall portion of the busbar

Abstract translation: 电子装置安装结构包括电子装置，母线和焊料。 电子设备具有从主体突出的主体和引线。 母线具有平坦部分和从平坦部分的周边上升的壁部分。 母线的平坦部分平行于引线的尖端部分延伸并与尖端部分的后表面接触。 母线的壁部分以预定的空间面对尖端部分的侧表面。 焊料位于该空间中并且连接在顶端部分的侧表面和母线的壁部分上

公开(公告)号：US20080302564A1

公开(公告)日：2008-12-11

申请号：US11760887

申请日：2007-06-11

Applicant: Kevin C. Olson ,  Thomas W. Goodman ,  Peter Elenius

Inventor： Kevin C. Olson ,  Thomas W. Goodman ,  Peter Elenius

IPC: H05K1/05 ,  H05K3/10

CPC classification number: H01L23/142 ,  H01L23/13 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/13091 ,  H05K1/056 ,  H05K1/183 ,  H05K2201/0382 ,  H05K2203/135 ,  Y10T29/49155 ,  H01L2924/00

Abstract: A substrate for an electronic device package includes an electrically conductive core shaped to define a cavity for receiving an electronic device, a first insulating layer positioned on a first side of the core, and a first contact positioned adjacent to a surface within the cavity. Method of fabricating the substrates is also provided.

Abstract translation: 用于电子器件封装的衬底包括形成为限定用于接收电子器件的空腔的导电芯，位于芯的第一侧上的第一绝缘层和邻近腔内的表面定位的第一接触。 还提供了制造基板的方法。

公开(公告)号：US20070268703A1

公开(公告)日：2007-11-22

申请号：US11751127

申请日：2007-05-21

Applicant: Jean-Claude Gasquet ,  Alcina Tanghe

Inventor： Jean-Claude Gasquet ,  Alcina Tanghe

IPC: F21V29/00

CPC classification number: F21V29/70 ,  F21K9/00 ,  F21S41/141 ,  F21S43/14 ,  F21S45/47 ,  F21S48/215 ,  F21V17/16 ,  F21V29/004 ,  F21Y2107/10 ,  F21Y2107/50 ,  F21Y2115/10 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/0382 ,  H05K2201/09054 ,  H05K2201/10106 ,  H01L2924/00

Abstract: A heat dissipation component for a vehicle lighting and/or signalling device of the type comprising a printed circuit board, a light-emitting diode comprising a heat dissipation base and a pair of electrical connection tabs and a heat dissipater extending facing the printed circuit board, wherein the heat dissipater comprises a heat exchange portion held against the base the diode and in that the heat exchange portion of the heat dissipater comprises means for orienting the diode that protrude substantially perpendicularly to the heat exchange portion of the dissipater, the heat exchange face of the base of the diode being arranged on an orienting means in such a way that the diode is oriented relative to a reference orientation and a reference plane of the dissipater.

Abstract translation: 一种用于车辆照明和/或信号装置的散热部件，其类型包括印刷电路板，包括散热基座和一对电连接接头的发光二极管和面向印刷电路板延伸的散热器， 其中所述散热器包括保持在所述二极管的所述基座上的热交换部分，并且所述散热器的热交换部分包括用于使所述二极管定向的装置，所述二极管基本上垂直于所述散热器的热交换部分突出， 二极管的基极被布置在定向装置上，使得二极管相对于耗散器的参考取向和参考平面定向。

公开(公告)号：US20070109748A1

公开(公告)日：2007-05-17

申请号：US10595149

申请日：2004-08-24

Applicant: Ralf Neise

Inventor： Ralf Neise

IPC: H05K7/20

CPC classification number: H05K3/202 ,  F02D11/10 ,  F02D2400/22 ,  H01R9/226 ,  H02K5/225 ,  H02K11/33 ,  H05K1/0286 ,  H05K2201/0382 ,  H05K2201/091 ,  H05K2201/0999 ,  H05K2201/2072

Abstract: The invention relates to an adjusting device (1) which is characterized in that electrical contact is made by means of substantially exposed conductor tracks (12, 14) which are linked with a housing (9) of the adjusting device (1) merely in a positive fit. The conductor tracks (12, 14) are introduced by introducing a continuous perforation comb (13) and severing the webs (22) connecting the individual conductor tracks (12, 14) in an additional step. The inventive adjusting device is advantageous in that while having structurally identical housing components (9), it allows to replace the conductor tracks (12, 14) only or embody them differently, depending on how many contacts are required. It is therefore possible to adapt the conductor tracks to corresponding connector types or different position detecting devices without having to replace the entire board or housing (9) while ensuring an extremely reliable contacting.

Abstract translation: 本发明涉及一种调节装置（1），其特征在于，通过基本上暴露的导体轨道（12,14）制成电接触，该导体轨道仅与调节装置（1）的壳体（9）连接， 积极适合 通过引入连续的穿孔梳（13）并且在另外的步骤中切断连接各个导体轨道（12,14）的腹板（22）来引入导体轨道（12,14）。 本发明的调节装置的优点在于，在具有结构上相同的壳体部件（9）的同时，它允许仅根据需要多少接触件来替换导体轨道（12,14）或不同地体现它们。 因此，可以使导体轨迹适应相应的连接器类型或不同的位置检测装置，而不必更换整个板或壳体（9），同时确保非常可靠的接触。

公开(公告)号：US20070098996A1

公开(公告)日：2007-05-03

申请号：US11564582

申请日：2006-11-29

Applicant: Matthew Frey ,  Khanh Nguyen

Inventor： Matthew Frey ,  Khanh Nguyen

IPC: B32B27/00 ,  B29D7/00

CPC classification number: H05K3/108 ,  B82Y30/00 ,  C23C18/1603 ,  C23C18/1608 ,  C23C18/165 ,  C23C18/1806 ,  C23C18/1834 ,  C23C18/1889 ,  C23C18/208 ,  C23C18/31 ,  C23C18/405 ,  H01L21/288 ,  H05K3/184 ,  H05K2201/0382 ,  H05K2203/0195 ,  H05K2203/072 ,  H05K2203/124 ,  Y10T428/12 ,  Y10T428/12514 ,  Y10T428/261 ,  Y10T428/31544

Abstract: A method of selectively and electrolessly depositing a metal onto a substrate having a metallic microstructured surface is disclosed. The method includes forming a self-assembled monolayer on the metallic microstructured surface, exposing the self-assembled monolayer to an electroless plating solution including a soluble form of a deposit metal, and depositing electrolessly the deposit metal selectively on the metallic microstructured surface. Article formed from this method are also disclosed.

Abstract translation: 公开了一种选择性地和无电沉积金属到具有金属微结构化表面的基底上的方法。 该方法包括在金属微结构化表面上形成自组装单层，将自组装单层暴露于包括可溶形式的沉积金属的化学镀溶液中，并将沉积金属选择性地沉积在金属微结构化表面上。 还公开了由该方法形成的制品。

公开(公告)号：US20070023202A1

公开(公告)日：2007-02-01

申请号：US11494744

申请日：2006-07-28

Applicant: Kiyoshi Shibata ,  Ryosuke Usui ,  Yasunori Inoue

Inventor： Kiyoshi Shibata ,  Ryosuke Usui ,  Yasunori Inoue

IPC: H05K1/00

CPC classification number: H05K3/445 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/01078 ,  H05K1/056 ,  H05K3/0047 ,  H05K3/44 ,  H05K2201/0382 ,  H05K2201/09054 ,  H05K2201/09609 ,  H05K2201/0969 ,  H05K2203/0323 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49165

Abstract: A circuit board and a circuit apparatus using the same which can prevent displacement and film exfoliation ascribable to thermal expansion, and suppress a drop in reliability at increasing temperatures. The circuit board of the circuit apparatus includes a metal substrate having pierced holes as a core member. Protrusions are formed on the top ends of the pierced holes, and depressions are formed in the bottom ends of the pierced holes. Wiring pattern layers are formed on both sides of this metal substrate via respective insulating layers. In order to establish electrical connection between the wiring pattern layers, a conductor layer which connects the wiring pattern layers is formed through the metal substrate via the pierced holes. The conductor layer thereby establishes electrical conduction between the wiring pattern layers. Furthermore, a semiconductor chip is directly connected to the surface side of the circuit board via solder balls.

Abstract translation: 一种电路板和使用该电路板的电路装置，其可以防止由于热膨胀而引起的位移和膜剥落，并且抑制在升高的温度下的可靠性降低。 电路装置的电路板包括具有穿孔作为芯构件的金属基板。 在穿孔的顶端形成突起，在穿孔的底端形成凹部。 接线图案层通过各自的绝缘层形成在该金属基板的两侧上。 为了建立布线图案层之间的电连接，通过穿孔穿过金属基板形成连接布线图案层的导体层。 导体层由此在布线图案层之间建立导电。 此外，半导体芯片通过焊球直接连接到电路板的表面侧。