公开(公告)号：US07265533B2

公开(公告)日：2007-09-04

申请号：US10868374

申请日：2004-06-15

Applicant: Simon H. Lightbody ,  Michael E. Teachman ,  Colin N. Gunn ,  Benedikt T. Huber

Inventor： Simon H. Lightbody ,  Michael E. Teachman ,  Colin N. Gunn ,  Benedikt T. Huber

IPC: G01R31/28 ,  G01R31/26

CPC classification number: G01R15/142 ,  G01R15/16 ,  G01R15/181 ,  G01R21/06 ,  H05K1/0268 ,  H05K1/0393 ,  H05K1/165 ,  H05K2201/051

Abstract: Systems and methods for monitoring power in a conductor. A flex circuit may include multiple layers including a voltage sensing layer, a coil layer, and a ground layer. The coil layer includes traces that form a coil structure around a conductor when the flex circuit is wrapped around the conductor. The coil layer generates a voltage that may be integrated to determine a current in the conductor. When the flex circuit is wrapped around the conductor, the voltage sensing layer is closest to the conductor. The voltage sensing layer forms a capacitor with the conductor. Using an adjustable capacitive voltage divider, the voltage of the conductor may be determined from a voltage signal received from the voltage sensing layer.

Abstract translation: 用于监测导体功率的系统和方法。 柔性电路可以包括多个层，包括电压感测层，线圈层和接地层。 线圈层包括当柔性电路绕导体缠绕时在导体周围形成线圈结构的迹线。 线圈层产生可以被积分以确定导体中的电流的电压。 当柔性电路缠绕在导体上时，电压感测层最靠近导体。 电压感测层与导体形成电容器。 使用可调电容分压器，可以根据从电压感测层接收的电压信号来确定导体的电压。

公开(公告)号：US20050275397A1

公开(公告)日：2005-12-15

申请号：US10868374

申请日：2004-06-15

Applicant: Simon Lightbody ,  Michael Teachman ,  Colin Gunn ,  Benedikt Huber

Inventor： Simon Lightbody ,  Michael Teachman ,  Colin Gunn ,  Benedikt Huber

IPC: G01R15/14 ,  G01R15/16 ,  G01R15/18 ,  G01R19/00 ,  G01R21/06 ,  G01R21/10 ,  G01R21/133 ,  H01L31/00 ,  H05K1/00 ,  H05K1/02 ,  H05K1/16

CPC classification number: G01R15/142 ,  G01R15/16 ,  G01R15/181 ,  G01R21/06 ,  H05K1/0268 ,  H05K1/0393 ,  H05K1/165 ,  H05K2201/051

Abstract: Systems and methods for monitoring power in a conductor. A flex circuit may include multiple layers including a voltage sensing layer, a coil layer, and a ground layer. The coil layer includes traces that form a coil structure around a conductor when the flex circuit is wrapped around the conductor. The coil layer generates a voltage that may be integrated to determine a current in the conductor. When the flex circuit is wrapped around the conductor, the voltage sensing layer is closest to the conductor. The voltage sensing layer forms a capacitor with the conductor. Using an adjustable capacitive voltage divider, the voltage of the conductor may be determined from a voltage signal received from the voltage sensing layer.

Abstract translation: 用于监测导体功率的系统和方法。 柔性电路可以包括多个层，包括电压感测层，线圈层和接地层。 线圈层包括当柔性电路绕导体缠绕时在导体周围形成线圈结构的迹线。 线圈层产生可以被积分以确定导体中的电流的电压。 当柔性电路缠绕在导体上时，电压感测层最靠近导体。 电压感测层与导体形成电容器。 使用可调电容分压器，可以根据从电压感测层接收的电压信号来确定导体的电压。

公开(公告)号：US20040154824A1

公开(公告)日：2004-08-12

申请号：US10724507

申请日：2003-11-25

Applicant: HESSE & KNIPPS GmbH

Inventor： Hans Hesse

IPC: H01B007/08

CPC classification number: H05K1/028 ,  H01R35/025 ,  H05K2201/051

Abstract: An assembly for electrically connecting a part rotatable about an axis with a relatively stationary part has an elongated multiconductor flat ribbon having a pair of ends and wound in a spiral around the axis. One of the ends is secured to the rotatable part and the other of the ends is secured to the stationary part. The flat ribbon is comprised of a flat elongated tape and a plurality of parallel conductive traces on the tape extending between the ends. The traces are flat strips with a width dimension parallel to the width dimension of the tape. The tape is nonconductive so that the traces are electrically isolated from one another.

Abstract translation: 用于将可围绕轴线旋转的部件与相对静止的部件电连接的组件具有带有一对端部的细长多导体扁平带状物，并围绕轴线卷绕成螺旋状。 其中一个端部被固定到可旋转部分，另一个端部固定到固定部分。 扁平带由扁平细长带和在端部之间延伸的带上的多个平行导电迹线组成。 迹线是具有平行于带的宽度尺寸的宽度尺寸的扁平条带。 磁带是非导电的，使得迹线彼此电隔离。

公开(公告)号：US5452182A

公开(公告)日：1995-09-19

申请号：US865786

申请日：1992-04-07

Applicant: Charles W. Eichelberger ,  William P. Kornrumpf ,  Robert J. Wojnarowski

Inventor： Charles W. Eichelberger ,  William P. Kornrumpf ,  Robert J. Wojnarowski

IPC: H01L23/52 ,  H01L21/00 ,  H01L21/68 ,  H01L23/538 ,  H01L25/04 ,  H01L25/065 ,  H01L25/18 ,  H05K1/02 ,  H05K1/05 ,  H05K1/14 ,  H05K1/18 ,  H05K3/00 ,  H05K1/11

CPC classification number: H05K1/189 ,  H01L21/67144 ,  H01L21/6835 ,  H01L23/5387 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0655 ,  H01L2221/68313 ,  H01L2224/24227 ,  H01L2224/7665 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15787 ,  H05K1/05 ,  H05K2201/051 ,  H05K2201/09745 ,  H05K2201/2009 ,  H05K2203/0264 ,  H05K3/0058

Abstract: A flexible high density interconnect structure is provided by extending the high density interconnect structure beyond the solid substrate containing the chips interconnected thereby. During fabrication, the flexible portion of the high density interconnect structure is supported by a temporary interconnect support to facilitate fabrication of the structure in accordance with existing fabrication techniques. Subsequently, that temporary support structure may be removed or may remain in place if it sufficiently flexible to impart the desired degree of flexibility to that portion of the high density interconnect structure. Methods of fabrication are also disclosed.

Abstract translation: 通过将高密度互连结构延伸超过含有由此相互连接的芯片的固体基板而提供灵活的高密度互连结构。 在制造期间，高密度互连结构的柔性部分由临时互连支撑支撑，以便于根据现有制造技术制造结构。 随后，如果临时支撑结构足够柔软以赋予该高密度互连结构部分所需的柔性程度，那么该临时支撑结构可被移除或保持在适当位置。 还公开了制造方法。

公开(公告)号：US4792879A

公开(公告)日：1988-12-20

申请号：US89042

申请日：1987-08-24

Applicant: Otto Bauknecht ,  Norbert Lichte ,  Karl-Heinz Warken

Inventor： Otto Bauknecht ,  Norbert Lichte ,  Karl-Heinz Warken

IPC: H01H36/00 ,  H03K17/94 ,  H03K17/945 ,  H03K17/95 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/28 ,  H05K9/00

CPC classification number: H05K9/005 ,  H03K17/945 ,  H05K1/189 ,  H05K1/0218 ,  H05K2201/042 ,  H05K2201/051 ,  H05K2201/056 ,  H05K2201/0715 ,  H05K2201/10106 ,  H05K2201/2009 ,  H05K2203/1311 ,  H05K3/0058 ,  H05K3/284

Abstract: A proximity switch or contactless switch circuit comprises within a casing a flexible insulating carrier provided along a component side with a multiplicity of electronic components connected by conductive strips to form the contactless or proximity switch circuit. An extension of the carrier or the opposite side of the carrier are provided with continuous conductive coatings so that when the carrier is folded or rolled within the casing, a portion of the carrier strip provided with the coating or layer forms an additional shield.

Abstract translation: 接近开关或非接触开关电​​路在壳体内包括柔性绝缘载体，该柔性绝缘载体沿着部件侧设置有多个通过导电条连接的电子部件以形成非接触或接近开关电路。 载体或载体的相对侧的延伸部设置有连续的导电涂层，使得当载体在壳体内折叠或卷绕时，提供有涂层或层的载体条的一部分形成附加的屏蔽。

公开(公告)号：US4755783A

公开(公告)日：1988-07-05

申请号：US932586

申请日：1986-11-18

Applicant: Cathy Fleischer ,  William Harper ,  Joseph E. Johnston ,  Scott Simpson ,  Richard T. Traskos

Inventor： Cathy Fleischer ,  William Harper ,  Joseph E. Johnston ,  Scott Simpson ,  Richard T. Traskos

IPC: H01F17/00 ,  H05K1/00 ,  H05K1/16 ,  H01F15/04 ,  H01F27/28

CPC classification number: H05K1/028 ,  H01F17/0006 ,  H01F2027/2861 ,  H05K1/165 ,  H05K2201/051

Abstract: Inductive devices, i.e., transformers, coils, inductors, etc. are produced from a rolled flexible circuit. The flexible circuit is comprised of a dielectric substrate having a circuit pattern thereon. The circuit pattern is configured such that, upon rolling, one or more coils is formed thereby defining an inductor, transformer, etc. Additionally, these inductive devices may be easily shielded using a ground plane in the flexible circuit. The rolled flexible circuit may be secured in several ways including an adhesive or by using a thermoplastic bonding layer which acts to heat seal the circuit together. The inductive devices of the present invention may be wrapped or rolled about a permeable core which improves inductance. Inductor devices manufactured in accordance with the present invention have the advantages of being small, surface mountable, inexpensive to manufacture and being capable of insertion onto printed wiring boards using automated insertion equipment. The small size of the inductor devices permit the present invention to take up only small areas on the circuit board thereby conserving valuable "real estate" on the printed wiring board.

Abstract translation: 感应器件，即变压器，线圈，电感器等是从轧制的柔性电路产生的。 柔性电路由其上具有电路图案的电介质基片构成。 电路图案被配置为使得在滚动时形成一个或多个线圈，从而限定电感器，变压器等。另外，这些感应装置可以容易地使用柔性电路中的接地平面屏蔽。 卷绕的柔性电路可以以多种方式固定，包括粘合剂或通过使用用于将电路热密封在一起的热塑性粘合层。 本发明的感应装置可围绕可改善电感的可渗透芯包裹或卷绕。 根据本发明制造的电感器装置具有小的，可表面安装的，制造成本低廉并且能够使用自动插入设备插入到印刷线路板上的优点。 电感器件的小尺寸允许本发明仅占用电路板上的小面积，从而节省印刷线路板上的有价值的“不动产”。

公开(公告)号：US4412272A

公开(公告)日：1983-10-25

申请号：US297548

申请日：1981-08-31

Applicant: Larry D. Wedertz ,  Oakley G. Ross

Inventor： Larry D. Wedertz ,  Oakley G. Ross

IPC: H05K1/18 ,  H05K3/28 ,  H05K3/34 ,  H05K7/20

CPC classification number: H05K1/189 ,  H05K3/284 ,  H05K2201/0116 ,  H05K2201/051 ,  H05K2201/10651 ,  H05K2203/1311 ,  H05K2203/1322 ,  H05K3/3447

Abstract: A flexible printed circuit card assembly includes an insulating sheet positioned over the foil of a flexible printed circuit card and adapted to accommodate the passage of electronic component leads therethrough for soldering to the printed circuit card. A layer of protective insulating foam, having a backing thereon, is positioned over the components and the assembly is rolled into a spiral configuration with leads extending from at least one end.

Abstract translation: 柔性印刷电路卡组件包括位于柔性印刷电路卡的箔上的绝缘片，并适于容纳电子元件引线通过其中以焊接到印刷电路卡。 一层保护性绝缘泡沫，其上具有背衬，位于部件上方，并且组件被卷成具有从至少一端延伸的引线的螺旋形构造。

公开(公告)号：US3046134A

公开(公告)日：1962-07-24

申请号：US77987458

申请日：1958-12-12

Applicant: EASTMAN KODAK CO

Inventor： DANN JOHN R ,  CHECHAK JONAS J

IPC: C08G63/06 ,  C08G63/688 ,  C08G69/42 ,  C08G73/02 ,  C08G75/00 ,  C08G75/02 ,  C08G75/04 ,  G03C1/043

CPC classification number: G03C1/043 ,  C08G63/06 ,  C08G63/6882 ,  C08G69/42 ,  C08G73/0253 ,  C08G75/00 ,  C08G75/02 ,  C08G75/045 ,  C08G75/12 ,  H05K2201/051

公开(公告)号：US11950474B2

公开(公告)日：2024-04-02

申请号：US18143182

申请日：2023-05-04

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei Yamazaki ,  Kensuke Yoshizumi

IPC: H05K1/18 ,  G04G9/00 ,  H10K59/121 ,  H10K59/131 ,  H10K77/10 ,  H01L27/12 ,  H05K1/02 ,  H05K1/14 ,  H10K59/12 ,  H10K102/00

CPC classification number: H10K59/131 ,  G04G9/0088 ,  H10K59/1213 ,  H10K77/111 ,  H01L27/1244 ,  H05K1/0277 ,  H05K1/028 ,  H05K1/0283 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/05 ,  H05K2201/051 ,  H05K2201/052 ,  H05K2201/053 ,  H05K2201/055 ,  H10K59/1201 ,  H10K2102/311 ,  Y02E10/549

Abstract: One embodiment of the present invention provides a highly reliable display device. In particular, a display device to which a signal or a power supply potential can be supplied stably is provided. Further, a bendable display device to which a signal or a power supply potential can be supplied stably is provided. The display device includes, over a flexible substrate, a display portion, a plurality of connection terminals to which a signal from an outside can be input, and a plurality of wirings. One of the plurality of wirings electrically connects one of the plurality of connection terminals to the display portion. The one of the plurality of wirings includes a first portion including a plurality of separate lines and a second portion in which the plurality of lines converge.

公开(公告)号：US20230269869A1

公开(公告)日：2023-08-24

申请号：US18170976

申请日：2023-02-17

Applicant: PanelSemi Corporation

Inventor： YI-HUA WU

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/028 ,  H05K1/189 ,  H05K2201/051 ,  H05K2201/10128

Abstract: A resilient substrate structure, which can be rolled up around an axis, includes a substrate, a working patterned layer and a resilient structure. The substrate has a first surface and a second surface. The substrate is defined with a first edge and a second edge in a direction parallel to the axis. The working patterned layer is arranged on the substrate. The resilient structure is arranged on the second surface. The resilient structure includes a composite layer and a supporting layer, which keep attaching to each other. The composite layer has curve-able segments, each of which is parallel to the axis and connects to the first and second edges. The resilient structure is transformed to contain multiple wavy segments when the resilient substrate structure is at the retraction state. An electronic device including the resilient substrate structure and electronic elements is also disclosed.