公开(公告)号：US20110303452A1

公开(公告)日：2011-12-15

申请号：US13137504

申请日：2011-08-22

Applicant: Han Kim ,  Jae-Joon Lee ,  Mi-Ja Han ,  Dae-Hyun Park

Inventor： Han Kim ,  Jae-Joon Lee ,  Mi-Ja Han ,  Dae-Hyun Park

IPC: H05K1/11

CPC classification number: H05K1/0236 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/116 ,  H05K1/165 ,  H05K2201/09309 ,  H05K2201/09454 ,  H05K2201/09663 ,  H01L2224/0401

Abstract: An electromagnetic bandgap structure, including: a first metal layer; a first dielectric layer, stacked in the first metal layer; a metal plate, stacked in the first dielectric layer; a via, having one end part which is connected to the first metal layer; a second dielectric layer, stacked in the metal plate and the first dielectric layer; and a second metal layer, stacked in the second dielectric layer, whereas the other end part of the via is connected to a via land which is placed in a hole formed in the metal plate, and the via land is connected to the metal plate through a metal line.

Abstract translation: 一种电磁带隙结构，包括：第一金属层; 第一介电层，堆叠在第一金属层中; 金属板，堆叠在第一介电层中; 通孔，其具有连接到所述第一金属层的一个端部; 第二电介质层，堆叠在所述金属板和所述第一介电层中; 以及第二金属层，层叠在第二电介质层中，而通孔的另一端部连接到放置在形成在金属板中的孔中的通孔焊盘，并且通路焊盘通过 金属线。

公开(公告)号：US08035991B2

公开(公告)日：2011-10-11

申请号：US12010872

申请日：2008-01-30

Applicant: Han Kim ,  Jae-Joon Lee ,  Mi-Ja Han ,  Dae-Hyun Park

Inventor： Han Kim ,  Jae-Joon Lee ,  Mi-Ja Han ,  Dae-Hyun Park

IPC: H05K9/00

CPC classification number: H05K1/0236 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/116 ,  H05K1/165 ,  H05K2201/09309 ,  H05K2201/09454 ,  H05K2201/09663 ,  H01L2224/0401

Abstract: Disclosed are an electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit. The electromagnetic bandgap structure in which a first metal layer, a first dielectric layer, a second dielectric layer and a second metal layer are stacked can include a first metal plate, formed between the first dielectric layer and the second dielectric layer; a second metal plate, formed on a same planar surface as the first metal plate, accommodated into a hole which is formed in the first metal plate and electrically connected to the first metal plate through a metal line; and a via, connecting the second metal plate to any one of the first metal layer and the second metal layer. With the present invention, the electromagnetic bandgap structure can be not only miniaturized but also have a low bandgap frequency.

Abstract translation: 公开了一种能够解决模拟电路和数字电路之间的混合信号问题的电磁带隙结构和印刷电路板。 层叠有第一金属层，第一电介质层，第二电介质层和第二金属层的电磁带隙结构可以包括形成在第一电介质层和第二电介质层之间的第一金属板; 形成在与第一金属板相同的平面上的第二金属板，容纳在形成在第一金属板中并通过金属线电连接到第一金属板的孔中; 以及将第二金属板连接到第一金属层和第二金属层中的任一个的通孔。 利用本发明，电磁带隙结构不仅可以小型化，而且具有低带隙频率。

公开(公告)号：US07921550B2

公开(公告)日：2011-04-12

申请号：US12345474

申请日：2008-12-29

Applicant: Cheng-Po Yu

Inventor： Cheng-Po Yu

IPC: H05K3/00

CPC classification number: H05K1/116 ,  H01L21/6835 ,  H01L2221/68359 ,  H05K3/20 ,  H05K3/4644 ,  H05K3/4658 ,  H05K2201/09454 ,  H05K2201/09563 ,  H05K2201/096 ,  Y10T29/49124

Abstract: A process for forming a circuit structure includes providing a first composite-layer structure at first. A second composite-layer structure is then provided. The first composite-layer structure, a second dielectric layer and the second composite-layer structure are pressed so that a second circuit pattern and an independent via pad are embedded in the second dielectric layer, and the second dielectric layer is connected to the first dielectric layer. A first carrier substrate and a second carrier substrate are removed to expose a first circuit pattern and the second circuit pattern. At least one first opening that passes through the second dielectric layer and exposes the independent via pad is formed, and the first opening is filled with a conductive material to form a second conductive via that connects the independent via pad and a second via pad.

Abstract translation: 一种形成电路结构的工艺包括首先提供第一复合层结构。 然后提供第二复合层结构。 第一复合层结构，第二介电层和第二复合层结构被按压，使得第二电路图案和独立通孔焊盘嵌入第二电介质层中，并且第二电介质层连接到第一电介质层 层。 去除第一载体衬底和第二载体衬底以暴露第一电路图案和第二电路图案。 形成穿过第二电介质层并暴露独立通孔焊盘的至少一个第一开口，并且用导电材料填充第一开口以形成连接独立通孔焊盘和第二通孔焊盘的第二导电通孔。

公开(公告)号：US20110037532A1

公开(公告)日：2011-02-17

申请号：US12913741

申请日：2010-10-27

Applicant: Lance Dion Lascari

Inventor： Lance Dion Lascari

IPC: H03H7/01

CPC classification number: H01P1/047 ,  H05K1/0222 ,  H05K3/429 ,  H05K2201/09309 ,  H05K2201/09454 ,  H05K2201/09618 ,  H05K2201/09718

Abstract: A microstripline transmission line arrangement carries a signal having a fundamental frequency. The arrangement includes a first microstripline transmission line, a second microstripline transmission line, and a coaxial electrically conductive conduit interconnecting the first transmission line and the second transmission line. The conduit includes a signal conductor and an electrically grounded shield substantially surrounding the signal conductor. The conductor and the shield are positioned relative to each other to thereby comprise a means for lowpass filtering the signal. A cutoff frequency of the lowpass filtering is less than a third harmonic of the fundamental frequency.

Abstract translation: 微带线传输线路布置具有基频的信号。 该装置包括第一微带线传输线，第二微带线传输线和互连第一传输线和第二传输线的同轴导电导管。 导管包括信号导体和基本上围绕信号导体的电接地屏蔽。 导体和屏蔽件相对于彼此定位，从而包括用于对信号进行低通滤波的装置。 低通滤波的截止频率小于基频的三次谐波。

公开(公告)号：US07847654B2

公开(公告)日：2010-12-07

申请号：US12180815

申请日：2008-07-28

Applicant: Lance Dion Lascari

Inventor： Lance Dion Lascari

IPC: H03H7/38

CPC classification number: H01P1/047 ,  H05K1/0222 ,  H05K3/429 ,  H05K2201/09309 ,  H05K2201/09454 ,  H05K2201/09618 ,  H05K2201/09718

Abstract: A microstripline transmission line arrangement carries a signal having a fundamental frequency. The arrangement includes a first microstripline transmission line, a second microstripline transmission line, and a coaxial electrically conductive conduit interconnecting the first transmission line and the second transmission line. The conduit includes a signal conductor and an electrically grounded shield substantially surrounding the signal conductor. The conductor and the shield are positioned relative to each other to thereby comprise a means for lowpass filtering the signal. A cutoff frequency of the lowpass filtering is less than a third harmonic of the fundamental frequency.

Abstract translation: 微带线传输线路布置具有基频的信号。 该装置包括第一微带线传输线，第二微带线传输线和互连第一传输线和第二传输线的同轴导电导管。 导管包括信号导体和基本上围绕信号导体的电接地屏蔽。 导体和屏蔽件相对于彼此定位，从而包括用于对信号进行低通滤波的装置。 低通滤波的截止频率小于基频的三次谐波。

公开(公告)号：US07843702B2

公开(公告)日：2010-11-30

申请号：US12437042

申请日：2009-05-07

Applicant: Don Chul Choi ,  Jae Cheol Ju ,  Dong Hwan Lee ,  Sang Soo Park ,  Hee Soo Yoon

Inventor： Don Chul Choi ,  Jae Cheol Ju ,  Dong Hwan Lee ,  Sang Soo Park ,  Hee Soo Yoon

IPC: H05K1/18

CPC classification number: H05K1/023 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24226 ,  H01L2224/82039 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/04941 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H05K1/0233 ,  H05K1/112 ,  H05K1/16 ,  H05K1/162 ,  H05K3/4611 ,  H05K2201/09309 ,  H05K2201/09454 ,  H05K2201/09718 ,  H05K2201/10022 ,  H05K2201/1003 ,  H01L2924/00

Abstract: Disclosed herein is a printed circuit board having an RF module power stage circuit embedded therein. Specifically, this invention relates to a printed circuit board having an RF module power stage circuit embedded therein, in which a terminal pad for a resistor, a bead, or an inductor is defined or formed on a power supply plane of a multilayered wired board to connect the resistor, the bead, or the inductor to the power supply plane, and the resistor, the bead, or the inductor is connected in parallel with a decoupling capacitor by using a via hole or by embedding the resistor, the bead or the inductor perpendicular to the power supply plane, thus decreasing the size of the RF module and improving the performance thereof.

Abstract translation: 这里公开了具有嵌入其中的RF模块功率级电路的印刷电路板。 具体地说，本发明涉及一种具有嵌入其中的RF模块功率级电路的印刷电路板，其中在多层有线电路板的电源平面上限定或形成用于电阻器，焊道或电感器的端子焊盘， 将电阻器，焊道或电感器连接到电源平面，并且电阻器，焊道或电感器通过使用通孔或通过嵌入电阻器，焊道或电感器而与去耦电容器并联连接 垂直于电源平面，从而减小RF模块的尺寸并提高其性能。

公开(公告)号：US20100294546A1

公开(公告)日：2010-11-25

申请号：US12470676

申请日：2009-05-22

Applicant: Sean Nickel ,  James Wahl

Inventor： Sean Nickel ,  James Wahl

IPC: H05K1/02 ,  H05K3/36

CPC classification number: H05K3/403 ,  H01R12/53 ,  H01R12/58 ,  H05K3/3405 ,  H05K3/4614 ,  H05K2201/09163 ,  H05K2201/09181 ,  H05K2201/0919 ,  H05K2201/09454 ,  H05K2201/10287 ,  H05K2201/1034 ,  Y10T29/49126

Abstract: A printed circuit board includes a first layer including a groove formed therein. The groove extends between opposing face surfaces. A second layer is coupled with one face surface of the first layer. The second layer includes a through hole in communication with the groove of the first layer. A third layer is coupled to other face surface of the first layer opposite the second layer. Portions of the second and third layers cooperate with the groove and forming a cavity with an opening at the edge of the board. The cavity is accessible through the through hole of the second layer. A printed circuit board includes multiple layers which are coupled together. A wire is electronically coupled to the printed circuit board by being inserted into the cavity with solder applied via the through hole. An alternative embodiment utilizes two layers to define the board and cavity.

Abstract translation: 印刷电路板包括其中形成有凹槽的第一层。 凹槽在相对的表面之间延伸。 第二层与第一层的一个面表面结合。 第二层包括与第一层的凹槽连通的通孔。 第三层耦合到与第二层相对的第一层的另一面表面。 第二和第三层的一部分与凹槽配合并在板的边缘处形成具有开口的空腔。 空腔可通过第二层的通孔进入。 印刷电路板包括多个耦合在一起的层。 通过经由通孔施加的焊料将引线插入到空腔中，将电线电连接到印刷电路板。 替代实施例利用两层来限定板和空腔。

公开(公告)号：US20100282503A1

公开(公告)日：2010-11-11

申请号：US12675678

申请日：2007-08-31

Applicant: Taras Kushta

Inventor： Taras Kushta

IPC: H05K1/11

CPC classification number: H05K1/0251 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/0245 ,  H05K1/116 ,  H05K3/429 ,  H05K2201/09236 ,  H05K2201/09454 ,  H05K2201/09618 ,  H05K2201/09636 ,  H05K2201/09718 ,  H05K2201/09781

Abstract: A multi-layer substrate includes a planar transmission line structure and a signal via, which are connected by a multi-tier transition. The multi-tier transition includes a signal via pad configured to serve for a full-value connection of the signal via and the planar transmission line; and a dummy pad connected to the signal via, formed in an area of a clearance hole in a conductor layer disposed between a signal terminal of the signal via and the planar transmission line, and isolated from the conductor layer.

Abstract translation: 多层基板包括通过多层转换连接的平面传输线结构和信号通孔。 多层转换包括经配置以用于信号通孔和平面传输线的全值连接的信号通孔; 以及连接到信号通孔的虚拟焊盘，形成在设置在信号通孔的信号端子和平面传输线之间并与导体层隔离的导体层中的间隙孔的区域中。

公开(公告)号：US20100126010A1

公开(公告)日：2010-05-27

申请号：US12694450

申请日：2010-01-27

Applicant: Angelo M. Puzella ,  Joseph M. Crowder ,  Patricia S. Dupuis ,  Michael C. Fallica ,  John B. Francis ,  Joseph A. Licciardello

Inventor： Angelo M. Puzella ,  Joseph M. Crowder ,  Patricia S. Dupuis ,  Michael C. Fallica ,  John B. Francis ,  Joseph A. Licciardello

IPC: H05K3/10 ,  H03H7/38

CPC classification number: H01Q21/0087 ,  H03H7/38 ,  H05K1/0251 ,  H05K1/116 ,  H05K3/429 ,  H05K3/4623 ,  H05K2201/09145 ,  H05K2201/09454 ,  H05K2201/09536 ,  H05K2201/09718 ,  H05K2201/09727 ,  H05K2201/209 ,  H05K2203/061 ,  Y10T29/49165

Abstract: A multilayer circuit board assembly includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the circuit board assembly. The RF interconnects can include one or more RF matching pads which provide a mechanism for matching impedance characteristics of RF stubs to provide the RF interconnects having desired insertion loss and impedance characteristics over a desired RF operating frequency band. The RF matching pads allow the manufacture of circuit boards having RF interconnects without the need to perform any back drill and back fill operation to remove stub portions of the RF interconnects in the multilayer circuit board assembly.

Abstract translation: 多层电路板组件包括构成电路板组件的不同电路板上的不同电路层之间的一个或多个射频（RF）互连。 RF互连可以包括一个或多个RF匹配焊盘，其提供用于匹配RF短截线的阻抗特性的机制，以在期望的RF工作频带上提供具有期望的插入损耗和阻抗特性的RF互连。 RF匹配焊盘允许制造具有RF互连的电路板，而不需要执行任何后钻和反向填充操作以去除多层电路板组件中的RF互连的短截线部分。

公开(公告)号：US20100108369A1

公开(公告)日：2010-05-06

申请号：US12262979

申请日：2008-10-31

Applicant: Alexander Tom

Inventor： Alexander Tom

IPC: H05K1/11 ,  H05K1/16 ,  H01R43/00 ,  G06F17/50

CPC classification number: H05K1/162 ,  H03H7/0115 ,  H05K1/0251 ,  H05K1/116 ,  H05K3/429 ,  H05K2201/09454 ,  H05K2201/09627 ,  H05K2201/09672 ,  H05K2201/097 ,  H05K2201/09718 ,  H05K2201/09727 ,  Y10T29/4921

Abstract: Printed circuit board capacitors include a first electrode comprising a via extending at least partially through a multi-layer printed circuit board and a plurality of conductive pads in electrical contact with the via and extending radially outward from the via, and a second electrode electrically isolated from the first electrode and comprising a plurality of ground-plane layers of the printed circuit board. The plurality of ground-plane layers include electrically conductive material overlapping the plurality of conductive pads.

Abstract translation: 印刷电路板电容器包括第一电极，其包括至少部分延伸穿过多层印刷电路板的通孔和与通孔电接触并从通孔径向向外延伸的多个导电焊盘，以及与通孔电绝缘的第二电极 所述第一电极并且包括所述印刷电路板的多个接地层。 多个接地层包括与多个导电焊盘重叠的导电材料。