公开(公告)号：US20120083139A1

公开(公告)日：2012-04-05

申请号：US13213394

申请日：2011-08-19

Applicant: Jin-San Jung ,  Jung-Chan Cho ,  Hyun-Seok Choi

Inventor： Jin-San Jung ,  Jung-Chan Cho ,  Hyun-Seok Choi

IPC: H01R12/70 ,  H01L21/50

CPC classification number: H05K1/117 ,  H01L2924/0002 ,  H05K3/244 ,  H05K2201/09736 ,  H05K2201/09845 ,  H05K2201/10159 ,  H01L2924/00

Abstract: A memory module may include a module substrate having a side portion. The side portion may be adapted or configured to be inserted into a socket of a main board. A plurality of connection pads may be arranged along the side portion. The connection pads may have a step portion of a first height from a surface of the side portion and a contact portion of a second height that is greater than the first height from the surface of the side portion. At least one semiconductor package may be mounted on the module substrate and electrically connected to the connection pads.

Abstract translation: 存储器模块可以包括具有侧部的模块衬底。 侧部可以适于或构造成插入到主板的插座中。 可以沿着侧部布置多个连接垫。 连接垫可以具有从侧部表面的第一高度的台阶部分和具有比侧部表面的第一高度大的第二高度的接触部分。 至少一个半导体封装可以安装在模块基板上并电连接到连接焊盘。

公开(公告)号：US20120043127A1

公开(公告)日：2012-02-23

申请号：US12956724

申请日：2010-11-30

Applicant: Hsien-Chieh LIN ,  Tung-Yu Chang

Inventor： Hsien-Chieh LIN ,  Tung-Yu Chang

IPC: H05K1/11 ,  H05K3/10

CPC classification number: H05K1/0203 ,  H01L23/473 ,  H01L23/49822 ,  H01L23/5389 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/73267 ,  H01L2924/15153 ,  H05K1/0272 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2203/1469 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: The invention provides a printed circuit board and a method for fabricating the same. The printed circuit board includes a core substrate having a first surface and an opposite second surface. A first through hole and a second through hole are formed through a portion of the core substrate, respectively from the first surface and second surfaces, wherein the first and second through holes are laminated vertically and connect to each other. A first guide rail and a second guide rail are, respectively, formed through a portion of the core substrate and connected to the second through hole, so that a fluid flows sequentially from an outside of the printed circuit board through the first guide rail, the second through hole and the second guide rail, to the outside of the printed circuit board.

Abstract translation: 本发明提供一种印刷电路板及其制造方法。 印刷电路板包括具有第一表面和相对的第二表面的芯基板。 分别从第一表面和第二表面穿过芯基板的一部分形成第一通孔和第二通孔，其中第一和第二通孔垂直地层叠并且彼此连接。 第一导轨和第二导轨分别通过芯基板的一部分形成并连接到第二通孔，使得流体从印刷电路板的外部依次流过第一导轨， 第二通孔和第二导轨，连接到印刷电路板的外部。

公开(公告)号：US08097815B2

公开(公告)日：2012-01-17

申请号：US11665561

申请日：2005-12-02

Applicant: Masaki Watanabe

Inventor： Masaki Watanabe

IPC: H05K1/11

CPC classification number: H05K3/3452 ,  H01L2224/16225 ,  H05K1/114 ,  H05K3/0005 ,  H05K3/3436 ,  H05K3/3484 ,  H05K3/429 ,  H05K2201/09036 ,  H05K2201/09845 ,  H05K2201/099 ,  H05K2201/09909 ,  H05K2201/10734 ,  H05K2203/0588 ,  Y10T29/49144

Abstract: The invention provides a printed circuit board capable of mounting BGA or other IC package of narrow terminal interval by using through-holes of conventional size. On one principal surface of printed circuit board (1), soldering lands (2a), (2b), (2c), and (2d) for connecting solder balls are disposed in lattice. Central point (B) of through-hole (3) is set eccentric to the side of soldering land (2a) at the same potential as through-hole (3), remote from intersection (A) formed by diagonal line (200ab) linking soldering lands (2a) and (2b) and diagonal line (200cd) linking soldering lands (2c) and (2d).

Abstract translation: 本发明提供一种能够通过使用常规尺寸的通孔来安装窄端子间隔的BGA或其它IC封装的印刷电路板。 在印刷电路板（1）的一个主表面上，格栅地布置用于连接焊球的焊接区（2a），（2b），（2c）和（2d）。 通孔（3）的中心点（B）以与通孔（3）相同的电位偏心于焊接区域（2a）的一侧，远离由对角线（200ab）形成的交叉点（A）连接 连接焊接台（2c）和（2d）的焊盘（2a）和（2b）和对角线（200cd）。

公开(公告)号：US20120009973A1

公开(公告)日：2012-01-12

申请号：US12834062

申请日：2010-07-12

Applicant: Randolph Cary Demuynck ,  David Ryan Story

Inventor： Randolph Cary Demuynck ,  David Ryan Story

IPC: H04M1/00 ,  H05K7/00 ,  H05K3/30 ,  H05K1/11

CPC classification number: H05K1/183 ,  H05K1/0284 ,  H05K3/328 ,  H05K2201/09036 ,  H05K2201/09845 ,  H05K2201/10189 ,  Y10T29/4913

Abstract: An electronic device has a housing and circuitry disposed within the housing. The circuitry is mounted to, for example, a top surface of a Printed Wiring Board (PWB) disposed within the housing. The PWB has a dual-height cavity that is formed as a recess in the top surface. The dual-height cavity is sized to receive one or more electronic components. Electrical contacts disposed within the dual-height cavity electrically connect the electronic component to electronic circuits mounted to the top surface of the PWB.

Abstract translation: 电子设备具有设置在壳体内的外壳和电路。 电路安装到例如布置在壳体内的印刷布线板（PWB）的顶表面。 PWB具有形成为顶表面中的凹部的双高度腔。 双高度腔体的尺寸适于接收一个或多个电子部件。 设置在双高度腔内的电触点将电子部件电连接到安装到PWB顶表面的电子电路。

公开(公告)号：US20110313252A1

公开(公告)日：2011-12-22

申请号：US13118667

申请日：2011-05-31

Applicant: WEI-TENG LIN

Inventor： WEI-TENG LIN

IPC: A61B1/06 ,  H05K7/00

CPC classification number: A61B1/0008 ,  A61B1/00105 ,  A61B1/05 ,  A61B1/051 ,  H05K1/0284 ,  H05K3/0014 ,  H05K3/182 ,  H05K3/381 ,  H05K2201/09118 ,  H05K2201/09845 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2203/107

Abstract: The present invention discloses a micro sensing apparatus comprising a sensing device, a cylindrical plastic body and a plurality of circuits. The sensing device has a bottom surface. The cylindrical plastic body is axially coupled to the sensing device and includes a connecting portion and a carrying portion, and the connecting portion has a first end surface coupled to the bottom surface, and the carrying portion is integrally formed and coupled to the connecting portion, and the carrying portion includes a plurality of electronic devices installed thereon and a plurality of circuits formed on the carrying portion. With the integrally formed connecting portion and carrying portion, the problem of requiring an adapting mechanism of a conventional sensing device to couple a printed circuit board can be solved. The cylindrical plastic body is axially coupled to the sensing device to reduce the overall external diameter of the micro sensing apparatus.

Abstract translation: 本发明公开了一种包括感测装置，圆柱形塑料体和多个电路的微型感测装置。 感测装置具有底面。 圆柱形塑料体轴向耦合到感测装置并且包括连接部分和承载部分，并且连接部分具有联接到底表面的第一端面，并且承载部分一体形成并联接到连接部分， 并且承载部分包括安装在其上的多个电子装置和形成在承载部分上的多个电路。 通过一体形成的连接部分和承载部分，可以解决需要常规感测装置的适配机构来耦合印刷电路板的问题。 圆柱形塑料体轴向耦合到感测装置以减小微型感测装置的整体外径。

公开(公告)号：US08072764B2

公开(公告)日：2011-12-06

申请号：US12400692

申请日：2009-03-09

Applicant: Kyle H. Yeates ,  James Bilanski ,  Dennis Pyper

Inventor： Kyle H. Yeates ,  James Bilanski ,  Dennis Pyper

IPC: H05K1/00 ,  H05K1/18 ,  H05K7/00

CPC classification number: H05K1/117 ,  H05K3/323 ,  H05K2201/09036 ,  H05K2201/09709 ,  H05K2201/09845 ,  H05K2203/1572 ,  Y10T29/49155

Abstract: Multi-part substrate arrangements that yield low profile configurations are disclosed. One aspect pertains to portable electronic devices are able to have low profiles through use of multi-part substrate arrangements. Another aspect pertains to methods for assembling two or more separate substrates into a multi-part substrate. By use of multi-part substrate arrangements according to the invention, portable electronic devices are able to be thinner and more compact.

Abstract translation: 公开了产生低轮廓构造的多部分衬底布置。 一个方面涉及便携式电子设备能够通过使用多部分衬底布置而具有低轮廓。 另一方面涉及将两个或更多个分离的基底组装成多部分基底的方法。 通过使用根据本发明的多部分衬底布置，便携式电子设备能够更薄和更紧凑。

公开(公告)号：US08067696B2

公开(公告)日：2011-11-29

申请号：US12389521

申请日：2009-02-20

Applicant: Chung-Jen Tsai ,  Chia-Cheng Chen ,  Hung-Yi Chang ,  Tung-Yao Kuo ,  Cheng-Hsien Lin

Inventor： Chung-Jen Tsai ,  Chia-Cheng Chen ,  Hung-Yi Chang ,  Tung-Yao Kuo ,  Cheng-Hsien Lin

IPC: H05K1/00

CPC classification number: H05K1/0271 ,  H05K3/243 ,  H05K2201/09136 ,  H05K2201/09736 ,  H05K2201/09781 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/2009

Abstract: A printed circuit board includes an insulating layer, a copper layer formed on the insulating layer and a reinforcing layer formed on the copper layer at opposite sides of the given portion. The copper layer includes a plurality of electrical traces at a given portion thereof. A thickness of the reinforcing layer increases in a direction away from the given portion. A method for manufacturing the printed circuit board is also provided in this disclosure.

Abstract translation: 印刷电路板包括绝缘层，形成在绝缘层上的铜层和在给定部分的相对侧的铜层上形成的增强层。 铜层在其给定部分包括多个电迹线。 加强层的厚度在远离给定部分的方向上增加。 在本公开中还提供了制造印刷电路板的方法。

公开(公告)号：US08050040B2

公开(公告)日：2011-11-01

申请号：US11078226

申请日：2005-03-09

Applicant: Che-Hung Huang ,  Cheng-Fu Chang

Inventor： Che-Hung Huang ,  Cheng-Fu Chang

IPC: H05K1/00

CPC classification number: H01R13/633 ,  H01R12/79 ,  H01R13/025 ,  H05K1/0281 ,  H05K1/118 ,  H05K3/0058 ,  H05K2201/09845 ,  H05K2201/2009

Abstract: A flexible printed circuit (FPC) board includes a flexible substrate, an electric terminal portion, and a reinforcing structure. The electric terminal portion is disposed on a bottom surface of the flexible substrate and is suitable to be inserted into an electrical connector to electrically connect therewith. The reinforcing structure is disposed on a top surface of the flexible substrate and located just above the electric terminal portion. The reinforcing portion includes a stiffener plate bonded to the top surface of the flexible substrate and a pad bonded to a top surface of the stiffener plate. The pad is shorter than the stiffener plate.

Abstract translation: 柔性印刷电路板（FPC）包括柔性基板，电端子部分和加强结构。 电气端子部分设置在柔性基板的底表面上，并且适于插入电连接器以与其电连接。 加强结构设置在柔性基板的顶表面上并且位于电端子部分正上方。 加强部分包括结合到柔性基底的顶表面的加强板和粘结到加强板顶表面的垫。 垫片比加强板板短。

公开(公告)号：US08049110B2

公开(公告)日：2011-11-01

申请号：US12286626

申请日：2008-10-01

Applicant: Vincent C. Korthuis

Inventor： Vincent C. Korthuis

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K3/4685 ,  G02F1/167 ,  G02F2001/1672 ,  H05K3/005 ,  H05K3/107 ,  H05K3/205 ,  H05K3/4644 ,  H05K2201/09736 ,  H05K2201/09845 ,  H05K2203/0108 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155

Abstract: A method of manufacturing a microelectronic device including imprinting a layer on a substrate with an imprinted pattern, the imprinted pattern defining a first anchor impression within the layer that includes a first base region positioned adjacent the layer and a first distal region positioned opposite the first base region, the first distal region defining a cross sectional area greater than a cross sectional area of the first base region, and the imprinted pattern defining a second anchor impression within the layer that includes a second base region positioned adjacent the layer and a second distal region positioned opposite the second base region, the second distal region defining a cross sectional area greater than a cross sectional area of the second base region and greater than a cross sectional area of the first distal region.

Abstract translation: 一种制造微电子器件的方法，包括用印迹图案在基片上刻印一层，该刻印图案限定该层内的第一锚定印模，该第一锚定印模包括邻近该层定位的第一基底区域和与第一基底相对定位的第一远侧区域 区域，所述第一远侧区域限定大于所述第一基底区域的横截面面积的横截面积，并且所述印刷图案限定所述层内的第二锚定印模，所述第二锚定印模包括邻近所述层定位的第二基底区域和第二远侧区域 与所述第二基部区域相对定位，所述第二远侧区域限定大于所述第二基底区域的横截面面积的横截面面积，并且大于所述第一远侧区域的横截面面积。

公开(公告)号：US20110242782A1

公开(公告)日：2011-10-06

申请号：US13079844

申请日：2011-04-05

Applicant: CHUNG-CHENG WANG

Inventor： CHUNG-CHENG WANG

IPC: H05K7/02 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/115 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/3011 ,  H05K1/185 ,  H05K2201/09845 ,  H05K2203/049 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Substrate for electrical devices is disclosed. An embodiment for the substrate comprised of an insulator and a conductive element(s), wherein the conductive element embedded in the insulator, said conductive element also enables to be comprised of an upper portion(s) and a lower portion(s) which are unitary and stack; wherein the surfaces of said conductive element contacted with said insulator enables to be increased, then said conductive layer can be held by said insulator more securely, in this manner, it enables to be prevented said conductive element from peeling off said insulator, and then the reliability of said substrate in accordance with the present invention enables to be enhanced; meanwhile, said substrate can further include a chip which is embedded therein, in order that said substrate being capable of affording a thinner electrical device thickness and enhanced reliability.

Abstract translation: 公开了用于电气设备的基板。 一种用于由绝缘体和导电元件构成的衬底的实施例，其中嵌入在绝缘体中的导电元件也能够由上部和下部组成，上部和下部 单一和堆叠 其中与所述绝缘体接触的所述导电元件的表面能够增加，则所述导电层可以被所述绝缘体更牢固地保持，以这种方式，能够防止所述导电元件从所述绝缘体上剥离，然后 能够提高根据本发明的所述基板的可靠性; 同时，所述衬底还可以包括嵌入其中的芯片，以便所述衬底能够提供更薄的电子器件厚度和增强的可靠性。