公开(公告)号：US07294929B2

公开(公告)日：2007-11-13

申请号：US10750059

申请日：2003-12-30

Applicant: Hiroshi Miyazaki

Inventor： Hiroshi Miyazaki

IPC: H01L29/40

CPC classification number: H01L24/11 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05007 ,  H01L2224/05169 ,  H01L2224/05566 ,  H01L2224/05567 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05669 ,  H01L2224/13007 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2924/0001 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/19042 ,  H05K1/0271 ,  H05K1/111 ,  H05K3/3452 ,  H05K3/3457 ,  H05K3/4007 ,  H05K2201/0133 ,  H05K2201/09909 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2224/05552

Abstract: An interconnect structure a substrate, a contact pad disposed over a surface of the substrate, and an insulative mask disposed over the contact pad. The insulative mask can include an opening that is aligned over and exposes an inner portion of the contact pad. The inner portion of the contact pad includes a compliant layer and a conductive layer that is disposed over the compliant layer. The inner portion of the contact pad has sufficient flexibility to distribute mechanical stress applied to the contact pad and can mitigate damage to the interconnect structure.

Abstract translation: 互连结构，衬底，设置在衬底的表面上的接触焊盘以及设置在接触焊盘上的绝缘掩模。 绝缘掩模可以包括对准在接触垫的内部并且暴露接触垫的内部的开口。 接触焊盘的内部部分包括柔性层和布置在柔性层上的导电层。 接触焊盘的内部部分具有足够的灵活性，以分配施加到接触焊盘的机械应力并且可以减轻对互连结构的损坏。

公开(公告)号：US20070253170A1

公开(公告)日：2007-11-01

申请号：US11412380

申请日：2006-04-27

Applicant: Richard Slagle

Inventor： Richard Slagle

IPC: H05K7/20

CPC classification number: H05K1/0272 ,  G06F1/20 ,  H05K1/0203 ,  H05K2201/09045 ,  H05K2201/09909

Abstract: An electronic device includes a printed circuit board having a wall deposited directly on a board serving as a base for a printed circuit. As the board is constructed, the wall is deposited on the board for controlling airflow. The wall controls airflow across the board and around components mounted to the board. The wall may be utilized for controlling airflow in combination with a second printed circuit board positioned adjacent to the first printed circuit board. The wall may be utilized for controlling various types of airflow, including airflow from sources including fans and convection, and from geometries including horizontal and vertical mounting geometries. The silicon wall may be utilized for preventing heat airflow generated by heat radiated from one component from impinging upon another component.

Abstract translation: 电子设备包括印刷电路板，其具有直接沉积在用作印刷电路基底的板上的壁。 当板被构造时，壁被沉积在板上用于控制气流。 墙壁控制板上的气流和安装在板上的组件。 该壁可用于与邻近第一印刷电路板定位的第二印刷电路板组合地控制气流。 该壁可用于控制各种类型的气流，包括来自包括风扇和对流的源的气流以及包括水平和垂直安装几何形状的几何形状。 硅壁可用于防止由一个部件辐射的热量产生的热气流撞击另一个部件。

公开(公告)号：US20070235217A1

公开(公告)日：2007-10-11

申请号：US11392019

申请日：2006-03-29

Applicant: Derek Workman

Inventor： Derek Workman

IPC: H05K1/16

CPC classification number: H05K3/303 ,  H01L21/563 ,  H01L23/315 ,  H01L24/29 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/10165 ,  H01L2224/11334 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/8114 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K3/3436 ,  H05K2201/09909 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2201/2036 ,  H05K2203/013 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/05599

Abstract: An electronic package having a controlled standoff height between a surface mount electronic device and a substrate includes a plurality of polymeric standoffs adhered to at least one of the underside of the surface mount electronic device or an upper surface of the substrate. The polymeric standoffs prevent collapse of the surface mount electronic device during overmolding or encapsulation of the surface mount electronic device.

Abstract translation: 具有在表面贴装电子器件和衬底之间具有受控的间隔高度的电子封装包括粘附到表面贴装电子器件的下侧中的至少一个或衬底的上表面的多个聚合物支座。 聚合物隔板防止表面贴装电子器件在表面贴装电子器件的过模制或封装期间的塌陷。

公开(公告)号：US20070218957A1

公开(公告)日：2007-09-20

申请号：US11597202

申请日：2005-05-20

Applicant: Kazuhiro Nishikawa ,  Yoshihiro Kai ,  Kazuto Nakamura

Inventor： Kazuhiro Nishikawa ,  Yoshihiro Kai ,  Kazuto Nakamura

IPC: H04M1/00

CPC classification number: G06F3/045 ,  H01H13/785 ,  H01H2201/036 ,  H01H2207/00 ,  H05K1/116 ,  H05K3/4046 ,  H05K3/4069 ,  H05K2201/09909 ,  H05K2201/10416

Abstract: There is provided a touch panel capable of obtaining a stable connection resistance without requiring fitting accuracy at the time of the connection to an external terminal, and a protective panel for a display window of an electronic device using the same. The analog type touch panel includes a touch side substrate 2 and a non-touch side substrate 3 each having resistive films 2a, 3a provided on opposed inner surfaces thereof. Through-holes 4a, 4b, 4c, 4d formed at the periphery of the non-touch side substrate 3. A connecting part 5 for electrically connecting electrodes of the resistive films 2a, 3a to an external terminal, in which a conductive paste is injected into the through-holes and a rivet 14 is inserted into each of the through-holes from the lower surface side so that a head of the rivet 14 forms flat connecting electrodes 15a, 15b for connection to the external terminal on the lower surface of the non-touch side substrate 3.

Abstract translation: 提供了一种能够获得稳定的连接电阻而不需要在与外部端子连接时的配合精度的触摸面板，以及使用该触摸面板的电子设备的显示窗口用保护面板。 模拟型触摸面板包括在其相对的内表面上设置有电阻膜2a，3a的触摸侧基板2和非接触侧基板3。 形成在非接触侧基板3的周围的通孔4a，4b，4c，4d。用于将电阻膜2a，3a的电极与外部端子电连接的连接部5 导电膏被注入到通孔中，并且铆钉14从下表面侧插入到每个通孔中，使得铆钉14的头部形成平坦的连接电极15a，15b，用于连接到 非接触侧基板3的下表面的外部端子。

公开(公告)号：US07245024B2

公开(公告)日：2007-07-17

申请号：US11040726

申请日：2005-01-21

Applicant: Frederick F. Kuhlman ,  Brentt C. Duff ,  Michael J. Pepples ,  Raymond B. Anton ,  Daniel R. Harshbarger

Inventor： Frederick F. Kuhlman ,  Brentt C. Duff ,  Michael J. Pepples ,  Raymond B. Anton ,  Daniel R. Harshbarger

IPC: H01L23/52 ,  H01L23/48 ,  H01L29/40 ,  H01L23/34

CPC classification number: H05K3/3452 ,  H05K1/181 ,  H05K3/3442 ,  H05K3/3489 ,  H05K2201/09772 ,  H05K2201/09909 ,  H05K2201/10022 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: An electronic assembly includes a substrate and at least one surface mounted electronic component. The substrate includes a first side and a second side opposite the first side. The first side of the substrate includes a plurality of conductive traces formed thereon. The plurality of conductive traces includes a first conductive trace and a second conductive trace. The electronic component is electrically coupled between the first and second conductive traces. A component body of the electronic component is subject to interaction with a flux, which is utilized during electrical coupling of the electronic component to the first and second conductive traces, to form a current leakage path. The substrate is configured to prevent the formation of the current leakage path.

Abstract translation: 电子组件包括基板和至少一个表面安装的电子部件。 基板包括与第一侧相对的第一侧和第二侧。 基板的第一面包括形成在其上的多个导电迹线。 多个导电迹线包括第一导电迹线和第二导电迹线。 电子部件电耦合在第一和第二导电迹线之间。 电子部件的组件主体经受与焊剂的相互作用，焊剂在电子部件与第一和第二导电迹线的电耦合期间被利用，以形成电流泄漏路径。 衬底被配置为防止形成电流泄漏路径。

公开(公告)号：US20070111597A1

公开(公告)日：2007-05-17

申请号：US11478691

申请日：2006-07-03

Applicant: Takahiro Kondou ,  Kiyoshi Sato ,  Mitsuru Kobayashi ,  Satoshi Moriyama

Inventor： Takahiro Kondou ,  Kiyoshi Sato ,  Mitsuru Kobayashi ,  Satoshi Moriyama

IPC: H01R9/05

CPC classification number: H01R24/44 ,  H01R9/0515 ,  H01R13/6658 ,  H01R2103/00 ,  H05K3/3405 ,  H05K3/3484 ,  H05K2201/09745 ,  H05K2201/099 ,  H05K2201/09909 ,  H05K2201/10287 ,  H05K2201/10356 ,  H05K2203/0191 ,  H05K2203/0195 ,  H05K2203/043 ,  H05K2203/0545

Abstract: A cable connector includes a contact assembly including an electrical insulating block part which is configured to incorporate plural signal contacts; and a relay wiring substrate mounted to a back of the contact assembly. The relay wiring substrate includes, on a surface, a contact connecting pad electrically connected to one of the signal contacts, a wiring connecting pad, and a wiring pattern connecting the contact connecting pad and the wiring connecting pad. The relay wiring substrate further includes a ground layer inside the relay wiring substrate. The cable connector further includes a cable connected to the relay wiring substrate by electrically connecting an end of a wiring with the wiring connecting pad. The relay wiring substrate further includes a ground pattern for matching impedance inside the relay wiring substrate.

Abstract translation: 电缆连接器包括接触组件，其包括电绝缘块部分，其被配置成结合多个信号触头; 以及安装到所述接触组件的背面的中继布线基板。 所述中继布线基板在表面上包括电连接到所述信号触点之一的接触连接焊盘，布线连接焊盘和连接所述接触连接焊盘和所述布线连接焊盘的布线图案。 继电器配线基板还包括在中继布线基板内的接地层。 电缆连接器还包括通过将布线的端部与布线连接垫电连接而连接到中继布线基板的电缆。 继电器布线基板还包括用于匹配中继布线基板内的阻抗的接地图案。

公开(公告)号：US07214617B2

公开(公告)日：2007-05-08

申请号：US10803027

申请日：2004-03-18

Applicant: Toshimitsu Hirai

Inventor： Toshimitsu Hirai

IPC: H01L21/44

CPC classification number: H01L21/76877 ,  H01L21/288 ,  H01L21/76802 ,  H01L21/76814 ,  H01L21/76826 ,  H01L21/76829 ,  H01L27/1292 ,  H01L27/3244 ,  H01L51/0005 ,  H05K3/125 ,  H05K3/1258 ,  H05K2201/09909 ,  H05K2203/013 ,  H05K2203/1173

Abstract: A method of forming a thin film pattern by placing a functional liquid on a substrate, includes a bank formation step of forming banks in accordance with the thin film pattern on the substrate, a residue processing step of removing residue between the banks, and a material placement step of placing the functional liquid between the banks removed the residue.

Abstract translation: 通过将功能性液体放置在基板上而形成薄膜图案的方法包括：堤形成步骤，根据基板上的薄膜图案形成堤，残留处理步骤，除去堤之间的残留物;以及材料 将功能液体放置在两组之间的放置步骤移除残留物。

公开(公告)号：US20070097625A1

公开(公告)日：2007-05-03

申请号：US11265367

申请日：2005-11-01

Applicant: Yong-Dong Chen ,  Guang Yu ,  Shin-Hsuu Wung ,  Chun-Chi Chen ,  Hsieh-Kun Lee

Inventor： Yong-Dong Chen ,  Guang Yu ,  Shin-Hsuu Wung ,  Chun-Chi Chen ,  Hsieh-Kun Lee

IPC: H05K7/20

CPC classification number: H05K7/205 ,  H05K1/0203 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/0209 ,  H05K2201/09909

Abstract: An electronic assembly includes a printed circuit aboard, a CPU, an electronic component and a thermal pad attached to the printed circuit board. The CPU and the electronic component are located on a first face of the printed circuit board. The electronic component is located near the CPU. The thermal pad is attached to a second face opposite to the first face of the printed circuit board and located just below the electronic component.

Abstract translation: 电子组件包括印刷电路板，CPU，电子部件和附接到印刷电路板的散热垫。 CPU和电子部件位于印刷电路板的第一面上。 电子元件位于CPU附近。 散热焊盘安装在与印刷电路板的第一面相对的第二面上，并位于电子部件正下方。

公开(公告)号：US20070055336A1

公开(公告)日：2007-03-08

申请号：US11523965

申请日：2006-09-19

Applicant: Robert Greenberg ,  Matthew McMahon ,  James Little ,  Kelly McClure ,  Brian Mech ,  Neil Talbot ,  Jordan Neysmith

Inventor： Robert Greenberg ,  Matthew McMahon ,  James Little ,  Kelly McClure ,  Brian Mech ,  Neil Talbot ,  Jordan Neysmith

IPC: A61N1/04

CPC classification number: A61N1/36046 ,  A61N1/0543 ,  A61N1/37223 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/118 ,  H05K3/0014 ,  H05K3/28 ,  H05K2201/0133 ,  H05K2201/09018 ,  H05K2201/09145 ,  H05K2201/09909 ,  H05K2201/2009 ,  H05K2203/1105 ,  H05K2203/1476 ,  H05K2203/302 ,  Y10T29/49158

Abstract: Polymer materials are useful as electrode array bodies for neural stimulation. They are particularly useful for retinal stimulation to create artificial vision, cochlear stimulation to create artificial hearing, and cortical stimulation, and many related purposes. The pressure applied against the retina, or other neural tissue, by an electrode array is critical. Too little pressure causes increased electrical resistance, along with electric field dispersion. Too much pressure may block blood flow. Common flexible circuit fabrication techniques generally require that a flexible circuit electrode array be made flat. Since neural tissue is almost never flat, a flat array will necessarily apply uneven pressure. Further, the edges of a flexible circuit polymer array may be sharp and cut the delicate neural tissue. By applying the right amount of heat to a completed array, a curve can be induced. With a thermoplastic polymer it may be further advantageous to repeatedly heat the flexible circuit in multiple molds, each with a decreasing radius. Further, it is advantageous to add material along the edges. It is further advantageous to provide a fold or twist in the flexible circuit array. Additional material may be added inside and outside the fold to promote a good seal with tissue.

Abstract translation: 聚合物材料可用作神经刺激的电极阵列体。 它们特别有用于视网膜刺激以产生人造视觉，耳蜗刺激以产生人造听觉和皮质刺激以及许多相关目的。 通过电极阵列对视网膜或其他神经组织施加的压力是至关重要的。 太小的压力会导致电阻增加以及电场分散。 太大的压力可能会阻止血液流动。 通常的柔性电路制造技术通常需要使柔性电路电极阵列平坦。 由于神经组织几乎从不平坦，平面阵列必然会施加不均匀的压力。 此外，柔性电路聚合物阵列的边缘可以是尖锐的并切割精细的神经组织。 通过将适量的热应用于完整的阵列，可以引起曲线。 对于热塑性聚合物，可以进一步有利的是在多个模具中反复加热柔性电路，每个模具具有减小的半径。 此外，沿着边缘添加材料是有利的。 在柔性电路阵列中提供折叠或扭曲是更有利的。 可以在折叠内部和外部添加附加材料以促进与组织的良好密封。

公开(公告)号：US07186922B2

公开(公告)日：2007-03-06

申请号：US10833948

申请日：2004-04-28

Applicant: Maksim Kuzmenka

Inventor： Maksim Kuzmenka

IPC: H05K1/03

CPC classification number: H05K1/024 ,  H05K3/28 ,  H05K2201/09727 ,  H05K2201/09909 ,  H05K2201/10159 ,  H05K2201/10689

Abstract: To provide a circuit board with improved electrical features with respect to a synchronization of signals, a circuit board comprises a dielectric substrate and a trace extending along a surface of the dielectric substrate, the trace having a first and second portion, the trace being covered by a first medium at the first portion, wherein the first medium is formed by an encapsulation element of a dielectric material so that the effective dielectric constant of the first medium is different from the effective dielectric constant of a medium extending over the trace at the second portion. Thus, a propagation speed difference can be created, when a signal travels along the first portion of the trace with respect to a signal propagation speed of a signal traveling along the second portion of the trace.

Abstract translation: 为了向电路板提供关于信号同步的改进的电气特征，电路板包括电介质基底和沿电介质基底的表面延伸的迹线，迹线具有第一和第二部分，迹线被 在第一部分处的第一介质，其中第一介质由电介质材料的封装元件形成，使得第一介质的有效介电常数不同于在第二部分的迹线上延伸的介质的有效介电常数 。 因此，当信号相对于沿迹线的第二部分行进的信号的信号传播速度沿迹线的第一部分行进时，可以产生传播速度差。