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    ANISOTROPIC CONDUCTIVE FILM AND METHOD OF PRODUCING THE SAME
    91.
    发明申请
    ANISOTROPIC CONDUCTIVE FILM AND METHOD OF PRODUCING THE SAME 审中-公开
    各向异性导电膜及其制造方法

    公开(公告)号：US20150319867A1

    公开(公告)日：2015-11-05

    申请号：US14420982

    申请日：2013-08-28

    Applicant: DEXERIALS CORPORATION

    Inventor： Kouichi SATO

    IPC: H05K3/32 ,  H05K3/40 ,  H05K3/30 ,  H05K1/11 ,  H05K1/18

    CPC classification number: H05K3/323 ,  C09D123/0853 ,  C09J123/0853 ,  H05K1/11 ,  H05K1/181 ,  H05K3/303 ,  H05K3/4007 ,  H05K2201/0221 ,  H05K2201/10166 ,  H05K2203/04 ,  H05K2203/066 ,  Y10T29/49146 ,  Y10T428/254

    Abstract: An anisotropic conductive film including conductive particles arranged uniformly in a single layer and capable of supporting fine-pitch connection is produced by: drying a coating film of a particle dispersion in which conductive particles are dispersed in a dilute solution of a thermoplastic resin that forms a coating after drying, whereby a conductive particle-containing layer is formed in which the coated conductive particles coated with the dried coating of the dilute solution of the thermoplastic resin and arranged in a single layer stick to the dried coating film; and laminating an insulating resin layer onto the conductive particle-containing layer.

    Abstract translation: 包含均匀地排列在单层中并且能够支持细间距连接的导电颗粒的各向异性导电膜通过以下方式制备：将导电颗粒分散在颗粒分散体中的涂膜干燥到形成热塑性树脂的热塑性树脂的稀溶液中 干燥后进行涂布，由此形成导电粒子层，其中涂覆有热塑性树脂的稀溶液的干燥涂层并涂布在干燥涂膜上的单层涂布的涂覆的导电颗粒; 并将绝缘树脂层层压到含导电粒子的层上。

    A POWER MODULE
    92.
    发明申请
    A POWER MODULE 有权
    电源模块

    公开(公告)号：US20150313019A1

    公开(公告)日：2015-10-29

    申请号：US14650940

    申请日：2012-12-11

    Applicant: TELEFONAKTIEBOLAGET L M ERICSSON (PUBL)

    Inventor： Martin DERMARK

    IPC: H05K1/18 ,  H02M1/00

    CPC classification number: H05K1/18 ,  H02M1/00 ,  H05K1/141 ,  H05K2201/10166 ,  H05K2201/1034 ,  H05K2201/10757

    Abstract: A power module (100) arranged to receive an input voltage and to deliver an output voltage, comprising a supporting layer (110) with first and second main surfaces (111, 109) and a rim (122) surrounding the main surfaces. The power module (100) also comprises at least one component (112, 113, 114, 115) on or in the supporting layer (110) which protrudes a first perpendicular distance (d1) from one of the main surfaces. The power module (100) additionally comprises connectors (116-119; 120-123) for attaching the power module (100) to an external component (10). The one or more connectors (116-119; 120-123) protrude a second distance (d2) from said rim (122) in a perpendicular direction from one of the main surfaces (111, 109), so that the at least one component is at a predefined distance (d4, d5) from the external component (10) when the power module is attached to the external component (10).

    Abstract translation: 电源模块（100），被布置成接收输入电压并输送输出电压，所述功率模块包括具有围绕所述主表面的第一和第二主表面（111,109）和边缘（122）的支撑层（110）。 功率模块（100）还包括在支撑层（110）上或支撑层（110）中的从其中一个主表面突出第一垂直距离（d1）的至少一个部件（112,113,114,115）。 功率模块（100）还包括用于将功率模块（100）附接到外部组件（10）的连接器（116-119; 120-123）。 所述一个或多个连接器（116-119; 120-123）从所述主表面（111,109）之一沿垂直方向从所述边缘（122）突出第二距离（d2），使得所述至少一个部件 当电源模块附接到外部组件（10）时，距离外部组件（10）处于预定距离（d4，d5）。

    Substrate formed on carrier having retaining features and resultant electronic device
    98.
    发明授权
    Substrate formed on carrier having retaining features and resultant electronic device 有权
    衬底形成在具有保持特征和结果的电子器件的载体上

    公开(公告)号：US09060419B2

    公开(公告)日：2015-06-16

    申请号：US12394518

    申请日：2009-02-27

    Applicant: Timothy J. Tredwell ,  Roger S. Kerr

    Inventor： Timothy J. Tredwell ,  Roger S. Kerr

    IPC: H05K3/30 ,  H05K3/00 ,  H05K1/03 ,  H05K1/05

    CPC classification number: H05K3/007 ,  H05K1/0393 ,  H05K1/05 ,  H05K3/0052 ,  H05K3/303 ,  H05K2201/10166 ,  H05K2201/10598 ,  H05K2203/016 ,  H05K2203/0228 ,  Y10T29/4913

    Abstract: A method for forming an electronic device on a flexible substrate conditions at least one surface of a carrier to form at least one retaining feature on the surface for retaining a flexible substrate. The flexible substrate is provided by deposition or lamination f one or more layers of substrate material onto the carrier. A portion of the substrate is processed to form the electronic device on the processed portion of the substrate. At least the processed portion of the substrate is released from the carrier to provide the flexible substrate having electronic device formed thereon. An electronic device is formed on a flexible substrate in accordance with the method.

    Abstract translation: 在柔性基板上形成电子器件的方法条件是载体的至少一个表面在表面上形成用于保持柔性基底的至少一个保持特征。 通过将一层或多层衬底材料沉积或层压到载体上来提供柔性基底。 处理衬底的一部分以在衬底的经处理部分上形成电子器件。 至少将基板的处理部分从载体上释放，以提供其上形成有电子器件的柔性基板。 根据该方法在柔性基板上形成电子器件。

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