公开(公告)号：US3290558A

公开(公告)日：1966-12-06

申请号：US34108264

申请日：1964-01-29

Applicant: CROUZET S A R L SOC

Inventor： JACQUES SAPY

IPC: H01L25/03 ,  H05K1/00 ,  H05K1/18 ,  H05K3/40

CPC classification number: H05K1/184 ,  H01L25/03 ,  H01L2924/0002 ,  H05K1/0289 ,  H05K1/183 ,  H05K3/4046 ,  H05K2201/09063 ,  H05K2201/09845 ,  H05K2201/10174 ,  Y10S257/926 ,  H01L2924/00

公开(公告)号：US20240313564A1

公开(公告)日：2024-09-19

申请号：US18676546

申请日：2024-05-29

Applicant: JAPAN TOBACCO INC.

Inventor： Takeshi AKAO

IPC: H02J7/00 ,  A24F40/30 ,  A24F40/40 ,  A24F40/50 ,  A24F40/51 ,  A24F40/53 ,  A24F40/60 ,  A24F40/90 ,  A24F40/95 ,  A61M15/00 ,  A61M15/06 ,  G05F3/18 ,  H01M10/42 ,  H01M10/48 ,  H02J7/04 ,  H05K1/14 ,  H05K1/18

CPC classification number: H02J7/0068 ,  A24F40/40 ,  A24F40/50 ,  A24F40/51 ,  A24F40/53 ,  A24F40/60 ,  A24F40/90 ,  A24F40/95 ,  A61M15/009 ,  G05F3/18 ,  H01M10/425 ,  H01M10/48 ,  H02J7/0042 ,  H02J7/0045 ,  H02J7/005 ,  H02J7/0063 ,  H02J7/007 ,  H02J7/007194 ,  H02J7/04 ,  H05K1/14 ,  H05K1/181 ,  A24F40/30 ,  A61M15/0003 ,  A61M15/06 ,  A61M2205/3653 ,  A61M2205/50 ,  A61M2205/8206 ,  A61M2205/8237 ,  A61M2205/8243 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10174

Abstract: A power supply unit for an aerosol inhaler includes: a power supply able to discharge a power to a load for generating an aerosol from an aerosol source; a connector able to be electrically connected to an external power supply; and a control device. The power supply unit further includes: a conductor which electrically connects the connector and the control device; a capacitor provided between the connector and the control device so as to be connected in parallel with the control device; a first circuit board on which the connector is provided; a second circuit board which is apart from the first circuit board and on which the capacitor and the control device are provided; and a conductive member which electrically connects the first circuit board and the second circuit board.

公开(公告)号：US12096560B2

公开(公告)日：2024-09-17

申请号：US17344370

申请日：2021-06-10

Applicant: NICHIA CORPORATION

Inventor： Kazuma Kozuru

IPC: H05K1/18 ,  H01R12/79 ,  H01S5/0239 ,  H05K1/02

CPC classification number: H05K1/18 ,  H01S5/0239 ,  H05K1/0296 ,  H01R12/79 ,  H05K2201/10174 ,  H05K2201/10189 ,  H05K2201/10196 ,  H05K2201/10522

Abstract: A substrate module includes: a substrate having top and bottom surfaces and comprising, at the top surface, a plurality of first wiring regions and a plurality of second wiring regions that are electrically connected to the plurality of first wiring regions; one or more power receiving devices disposed on the plurality of first wiring regions; a first connection component disposed on the plurality of second wiring regions, wherein the first connection component has opposite ends in a first direction; and a protected component disposed on the top surface of the substrate. In a top plan view, (i) the protected component is located between two straight lines passing through the respective opposite ends of the first connection component and extending in a second direction perpendicular to the first direction, and (ii) the protected component is located between the one or more power receiving devices and the first connection component.

公开(公告)号：US20240292541A1

公开(公告)日：2024-08-29

申请号：US18657977

申请日：2024-05-08

Applicant: Black & Decker Inc.

Inventor： Joshua M. LEWIS ,  Michael D. GROVE

IPC: H05K1/18 ,  B25B21/02 ,  B25F5/02 ,  H01H9/54 ,  H01H13/14 ,  H01H13/52 ,  H01H21/24 ,  H02K7/14 ,  H02K11/33 ,  H02K23/18 ,  H02M7/48 ,  H02P6/14 ,  H02P6/16 ,  H05K1/02 ,  H05K1/11 ,  H05K7/20

CPC classification number: H05K1/181 ,  B25B21/02 ,  B25F5/02 ,  H01H9/54 ,  H01H13/14 ,  H01H13/52 ,  H01H21/24 ,  H02K7/145 ,  H02K11/33 ,  H02K23/18 ,  H02M7/48 ,  H02P6/14 ,  H02P6/16 ,  H05K1/0206 ,  H05K1/112 ,  H05K1/115 ,  H05K7/2039 ,  H01H2013/525 ,  H01H2231/048 ,  H05K2201/066 ,  H05K2201/10053 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10545

Abstract: An electronic module is provided including a circuit board a first conductive track, second conductive tracks, third conductive tracks mounted on a first surface of the circuit board; at least one first heat sink mounted on the first conductive track; second heat sinks mounted respectively on the second conductive tracks; motor terminals formed through the third conductive tracks; and power switches mounted on the second surface of the circuit board configured as an inverter circuit to supply power from a power supply to an electric motor. High-side power switches are located opposite the at least one first heat sink and in thermal communication therewith, and low-side power switches are located opposite the second heat sinks and in respective thermal communication therewith.

公开(公告)号：US20240138058A1

公开(公告)日：2024-04-25

申请号：US18278967

申请日：2022-02-25

Applicant: LG INNOTEK CO., LTD.

Inventor： Heun PARK ,  Kab Young KIM ,  Sang Young LEE

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/0283 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/111 ,  H05K1/115 ,  H05K1/189 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10037 ,  H05K2201/10098 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10174

Abstract: According to one embodiment of the present invention, an electronic substrate includes a base including a first surface and a second surface that is a surface opposite to the first surface, an electronic component disposed on the second surface of the base, and a line disposed on the second surface of the base and connected to the electronic component, wherein the base includes a frame region including a flexible material and a plurality of opening regions passing between the first surface and the second surface, and the electronic component and the line are disposed in the frame region.

公开(公告)号：US11916421B2

公开(公告)日：2024-02-27

申请号：US17149037

申请日：2021-01-14

Applicant: JAPAN TOBACCO INC.

Inventor： Takeshi Akao

IPC: H02J7/00 ,  A24F40/40 ,  A24F40/50 ,  A24F40/51 ,  A24F40/53 ,  A24F40/60 ,  A24F40/90 ,  A24F40/95 ,  A61M15/00 ,  G05F3/18 ,  H01M10/42 ,  H01M10/48 ,  H02J7/04 ,  H05K1/14 ,  H05K1/18 ,  A24F40/30 ,  A61M15/06

CPC classification number: H02J7/0068 ,  A24F40/40 ,  A24F40/50 ,  A24F40/51 ,  A24F40/53 ,  A24F40/60 ,  A24F40/90 ,  A24F40/95 ,  A61M15/009 ,  G05F3/18 ,  H01M10/425 ,  H01M10/48 ,  H02J7/0042 ,  H02J7/0045 ,  H02J7/005 ,  H02J7/0063 ,  H02J7/007 ,  H02J7/007194 ,  H02J7/04 ,  H05K1/14 ,  H05K1/181 ,  A24F40/30 ,  A61M15/0003 ,  A61M15/06 ,  A61M2205/3653 ,  A61M2205/50 ,  A61M2205/8206 ,  A61M2205/8237 ,  A61M2205/8243 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10174

Abstract: A power supply unit for an aerosol inhaler includes: a power supply able to discharge power to a load for generating an aerosol from an aerosol source; a first control device and a second control device which are configured to control at least one of charging and discharging of the power supply; a circuit board on which the first control device and the second control device are provided; a first capacitor which is provided on an input side of the first control device so as to be connected in parallel with the first control device; and a second capacitor which is provided on an input side of the second control device so as to be connected in parallel with the second control device, wherein a capacity of the first capacitor is different from a capacity of the second capacitor.

公开(公告)号：US20240040689A1

公开(公告)日：2024-02-01

申请号：US18224265

申请日：2023-07-20

Applicant: Infineon Technologies AG

Inventor： Ramdas Rangnath Ugale ,  Daniel Schleißer

IPC: H05K1/02 ,  H01L23/40 ,  H05K7/20 ,  H05K3/32 ,  H05K1/18

CPC classification number: H05K1/0265 ,  H01L23/4006 ,  H05K7/209 ,  H05K3/325 ,  H05K1/18 ,  H01L2023/4031 ,  H01L2023/405 ,  H01L2023/4068 ,  H01L2023/4062 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10522 ,  H05K2201/10545 ,  H05K2201/10272 ,  H05K2201/10409

Abstract: A semiconductor module includes: a printed circuit board having a first side and an opposite second side; a plurality of power semiconductor packages arranged over and electrically coupled to the first side of the printed circuit board, a first side of the power semiconductor packages facing the first side of the printed circuit board and an opposite second side being configured to be coupled to a heatsink; and at least one bus bar arranged over and electrically coupled to the first side of the printed circuit board. The bus bar is configured to carry a supply current and/or a ground current of at least some of the power semiconductor packages.

公开(公告)号：US20230366921A1

公开(公告)日：2023-11-16

申请号：US18247021

申请日：2021-09-13

Applicant: Endress+Hauser SE+Co. KG

Inventor： Bernd Strütt ,  Christian Strittmatter ,  Christoph Hippin

IPC: G01R31/28 ,  H05K1/02

CPC classification number: G01R31/2801 ,  H05K1/0268 ,  H05K2201/10174

Abstract: The present disclosure relates to an electronic unit including at least one component and a printed circuit board, wherein the at least one component has at least one terminal, wherein the printed circuit board has at least one first contact surface and at least one second contact surface, wherein the at least one first contact surface and the at least one second contact surface are spaced apart from one another, wherein the at least one terminal is joined to the at least two contact surfaces by at least one solder joint. The present disclosure further relates to a method for testing at least one state of an electronic unit.

公开(公告)号：US20230309276A1

公开(公告)日：2023-09-28

申请号：US18189692

申请日：2023-03-24

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Yibo Wang ,  Wengang Luo ,  Yunfei Qiao

IPC: H05K7/20

CPC classification number: H05K7/209 ,  H05K7/20409 ,  H05K2201/10166 ,  H05K2201/10174

Abstract: A power module includes a housing, a circuit component, and a package. The housing includes a main housing, a heat sink, and a fastening layer. A first outer surface of the main housing is provided with a groove. The fastening layer is disposed on a bottom surface of the groove. The heat sink is located on a side opposite to an orientation of the groove. The circuit component includes a heat dissipation surface and a pin. The heat dissipation surface is fastened to the fastening layer through welding. The pin extends out of the first outer surface in a direction away from the fastening layer. The package is configured to cover the circuit component, and to at least partially expose a distal end of the pin.

公开(公告)号：US20190223318A1

公开(公告)日：2019-07-18

申请号：US16235224

申请日：2018-12-28

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Akio INOUE ,  Hideyuki FUKUDA

IPC: H05K7/20 ,  F21S41/14 ,  H05K1/18 ,  H05K1/02 ,  F21V29/508 ,  F21V29/76 ,  H05K5/00

CPC classification number: H05K7/209 ,  F21S41/14 ,  F21V29/508 ,  F21V29/76 ,  H05K1/0203 ,  H05K1/181 ,  H05K5/0008 ,  H05K2201/066 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10409 ,  H05K2201/10522

Abstract: A power supply device includes a covering member, at least one high-height component, and at least one low-height component lower than the high-height component. The covering member includes a reference surface, at least one concave portion recessed from the reference surface toward a side opposite to a side of a circuit board in a Z direction, and at least one convex portion projecting from the reference surface toward the side of the circuit board in the Z direction. The at least one high-height component includes at least one high-height thermally connecting component, a tip end portion of which is thermally connected to a bottom surface of the concave portion, and the at least one low-height component includes at least one low-height thermally connecting component, a tip end portion of which is thermally connected to a tip end surface of the convex portion.