Abstract:
In an electronic component, a laminate is obtained by laminating a plurality of ceramic layers, and includes an upper surface and a bottom surface which are at ends of the laminate in the z-axis direction, end surfaces facing each other, and side surfaces facing each other. First capacitor conductors, second capacitor conductors, and the ceramic layers are laminated. One of the first capacitor conductors and one of the second capacitor conductors face each other via one of the ceramic layers. A first external electrode and a second external electrode are located on one of the end surfaces and one of the side surfaces, respectively, and are connected to the first capacitor conductors. A third external electrode and a fourth external electrode are located on the other one of the end surfaces and the other one of the side surfaces, respectively, and are connected to the second capacitor conductors.
Abstract:
Disclosed herein is a device for reducing noise generated by an electrical component, the device including a stiffening component secured to an electrical component, wherein the stiffening component provides rigidity to the electrical component, thereby reducing the mechanical resonance of the electrical component during operation. The electrical component has at least one end face and a flange portion that includes a flange face that extends about a perimeter of the end face. The flange face is substantially parallel to the end face, wherein the stiffening component is secured to the flange face of the electrical component such that it does not extend into a plane of the end face. Further, the stiffening component can include a stiffening portion and a securing portion, wherein the stiffening portion is secured to the flange face of the electrical component by the securing portion. Further, the electrical component can be a power semiconductor device.
Abstract:
In an optical semiconductor device module constructed by an optical semiconductor device having a light emitting portion on its top surface, a mounting substrate adapted to mount the optical semiconductor device thereon, at least one wiring pattern layer formed on a front surface of the mounting substrate, and at least one power supplying portion in contact with the wiring pattern layer, at least one of the power supplying portion and the wiring pattern layer is uneven.
Abstract:
Method and apparatus for attenuating resonances in a flex circuit which interconnects a stationary element and a moveable element, such as a connector and a head stack assembly (HSA) in a data storage device. An intermediary portion of the flex circuit forms a dynamic loop between the stationary element and the moveable element. A damper member is attached to the flex circuit so as to continuously extend adjacent the stationary element and along less than an overall extent of the dynamic loop. The damper member attenuates resonances excited in the flex circuit during movement of the moveable element.
Abstract:
A layout structure and a method for reducing audible noise generated by a flexible printed circuit are provided. The layout structure includes a flexible printed circuit and a piezoelectric element. The flexible printed circuit is disposed with respect to an axis. When an alternating voltage/current is applied across the piezoelectric element, the piezoelectric element expands and contracts alternately. The piezoelectric element is located on the flexible printed circuit, and an angle between the axis and a side of the piezoelectric element is less than 90 degrees.
Abstract:
In an optical semiconductor device module constructed by an optical semiconductor device having a light emitting portion on its top surface, a mounting substrate adapted to mount the optical semiconductor device thereon, at least one wiring pattern layer formed on a front surface of the mounting substrate, and at least one power supplying portion in contact with the wiring pattern layer, at least one of the power supplying portion and the wiring pattern layer is uneven.
Abstract:
In an optical semiconductor device module constructed by an optical semiconductor device having a light emitting portion on its top surface, a mounting substrate adapted to mount the optical semiconductor device thereon, and at least one conductive leaf spring adapted to fix the optical semiconductor device to the mounting substrate and supply power to the optical semiconductor device, the leaf spring is formed by a plurality of rectangularly-shaped terminals, and natural frequencies of at least two of the rectangularly-shaped terminals are different from each other.
Abstract:
An electronic device includes a housing, a circuit board, a plurality of flexible holders, and a plurality of microphones. The housing includes a plurality of wall portions, a plurality of storage spaces encircled by the wall portions, and a plurality of acoustic openings connected to the storage spaces. The flexible holders are disposed in the storage spaces. Each of the flexible holders comprises a plurality of surfaces and at least one rib provided on the surfaces. The microphones are mounted on the circuit board and disposed in the flexible holders.
Abstract:
An exemplary printed circuit board assembly includes a printed circuit board, four supporting members, four shock-absorption members, and four fixing members. The printed circuit board defines a plurality of cutouts therein. Each supporting member defines a positioning hole therein. The shock-absorption members are snapped in the cutouts, and each has a first surface contacting the corresponding supporting member, a second surface parallel to the first surface, and a through hole extending through the first and second surfaces. The first and second surfaces are disposed at opposite sides of the printed circuit board. Each fixing member comprises a first portion pressed on the second surface of the corresponding shock-absorption member, and a second portion extending through the through hole and engaging in the positioning hole.
Abstract:
According to one embodiment, a disk device includes a disk, a drive section which is configured to support and rotate the disk, a head, and a head actuator assembly. The head actuator assembly includes a board unit including a base portion on which an electronic component is mounted, a main flexible printed circuit board which is configured to extend from the base portion and have a connecting end portion attached to the carriage, and a reinforcing plate including a bent portion fixed to the main flexible printed circuit board, and a vibration damper which is configured to include a sheet-shaped viscoelastic material stuck on the bent portion and a sheet-shaped reinforcing material, more rigid than the viscoelastic material and stuck on the viscoelastic material in superposed relation, and suppress vibration of the reinforcing plate.