OPTIMIZATION OF LITHOGRAPHIC PROCESS BASED ON BANDWIDTH AND SPECKLE

    公开(公告)号:US20240045341A1

    公开(公告)日:2024-02-08

    申请号:US18266246

    申请日:2021-12-09

    CPC classification number: G03F7/70575 G03F7/70583 G03F7/70025 G03F7/2004

    Abstract: A method for improving a lithographic process of imaging a portion of a design layout onto a substrate using a lithographic apparatus. The method includes computing a multi-variable cost function that is a function of: (i) a plurality of design variables that affect characteristics of the lithographic process and (ii) a radiation bandwidth of a radiation source of the lithographic apparatus; and reconfiguring one or more of the characteristics (e.g., EPE, image contrast, resist, etc.) of the lithographic process by adjusting one or more of the design variables (e.g., source, mask layout, bandwidth, etc.) until a termination condition is satisfied. The termination condition includes a speckle characteristic (e.g., a speckle contrast) maintained within a speckle specification associated with the radiation source and also maintaining an image contrast associated with the lithographic process within a desired range. The speckle characteristic being a function of the radiation bandwidth.

Patent Agency Ranking