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公开(公告)号：US20180222152A1
公开(公告)日：2018-08-09
申请号：US15742994
申请日：2016-07-14
Applicant: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
Inventor： Hiroaki Umeda , Masanori Miyamoto , Kazuhiro Matsuda , Ken Yukawa , Shirou Yamauchi
CPC classification number: B32B15/08 , B32B15/088 , B32B15/20 , C08G73/12 , C08K3/36 , C08L27/12 , C08L79/08 , C08L79/085 , C09D127/18 , H05K1/0326 , H05K1/0373 , H05K3/022 , H05K2201/0209 , H05K2201/0212 , C08L63/00
Abstract: Resin-clad copper foil improves transmission characteristics by using a bismaleimide resin having a low dielectric constant and a low dielectric loss tangent. The foil can be manufactured without irradiation with ultraviolet rays. A resin composition is laminated on copper foil. The resin composition includes a bismaleimide resin represented by general formula (I), a curing agent, and a filler, the blending amount of the filler is 10 to 200 parts by mass based on 100 parts by mass of a resin component. The resin composition has a complex viscosity at 80° C. of 1×103 Pa·s to 5×105 Pa·s. In general formula (I), X represents an aliphatic, alicyclic or aromatic hydrocarbon group having 10 to 30 carbon atoms in the main chain, Y represents an aliphatic, alicyclic, or aromatic hydrocarbon group, and a represents a number in a range of 1 to 20.
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公开(公告)号：US09512329B2
公开(公告)日：2016-12-06
申请号：US14119342
申请日：2012-05-23
Applicant: Takeshi Nobukuni , Yoshihiro Kato , Meguru Ito , Tomoki Hamajima
Inventor： Takeshi Nobukuni , Yoshihiro Kato , Meguru Ito , Tomoki Hamajima
IPC: B32B15/092 , B32B27/04 , B32B27/20 , B32B27/26 , B32B27/38 , C08L63/00 , C08G59/24 , C08G59/32 , C08G59/38 , C08G59/40 , C08K3/22 , C08K3/26 , C08K3/28 , C08K3/34 , C08K3/36 , C08K3/38 , C08K5/5415 , C09D163/00 , C08J5/24 , H05K1/03
CPC classification number: C09D163/00 , C08G59/245 , C08G59/38 , C08G59/4014 , C08J5/24 , C08J2363/00 , C08J2479/04 , C08J2483/04 , C08L63/00 , H05K1/0353 , H05K1/0373 , H05K2201/012 , H05K2201/0209 , H05K2201/0212 , Y10T428/31529 , Y10T442/2008 , Y10T442/2951 , C08L79/04 , C08L83/04
Abstract: A resin composition contains a cyanate ester compound, a maleimide compound, an epoxy resin, a silicone rubber powder, and an inorganic filler. The cyanate ester compound contains a compound represented by the following formula. The silicone rubber powder is contained in an amount of 40 to 150 parts by mass based on 100 parts by mass in total of the cyanate ester compound, the maleimide compound, and the epoxy resin. The inorganic filler is contained in an amount of 100 to 340 parts by mass based on 100 parts by mass in total of the cyanate ester compound, the maleimide compound, and the epoxy resin. A total content of the silicone rubber powder and the inorganic filler is 140 to 380 parts by mass based on 100 parts by mass in total of the cyanate ester compound, the maleimide compound, and the epoxy resin.
Abstract translation: 提供了具有优异的耐热性，阻燃性和成型性，并且能够特别提供具有低热膨胀系数的树脂固化产物的树脂组合物。 根据本发明的树脂组合物含有氰酸酯化合物（A），马来酰亚胺化合物（B），环氧树脂（C），硅橡胶粉末（D）和无机填料（E）。 氰酸酯化合物（A）含有下式（I）表示的化合物。 相对于氰酸酯化合物（A），马来酰亚胺化合物（B）和环氧树脂（C）总计100质量份，硅橡胶粉末（D）的含量为40〜150质量份， 。 相对于氰酸酯化合物（A），马来酰亚胺化合物（B）和环氧树脂（C）的总计100质量份，无机填料（E）的含量为100〜340质量份。 相对于氰酸酯化合物（A），马来酰亚胺化合物（B）和马来酰亚胺化合物（B）的总量为100质量份，硅橡胶粉末（D）和无机填料（E）的总含量为140〜380质量份 环氧树脂（C）。 （其中R表示氢原子或甲基，n表示1以上的整数）
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公开(公告)号：US20160174364A1
公开(公告)日：2016-06-16
申请号：US14970479
申请日：2015-12-15
Applicant: Amphenol Corporation
Inventor： Arthur E. Harkness, JR. , Eva M. Kenny-McDermott , Paul W. Farineau , Raymond A. Lavallee , Michael Fancher
CPC classification number: H05K3/4632 , H05K1/0242 , H05K1/0326 , H05K1/034 , H05K1/0346 , H05K1/0366 , H05K1/0373 , H05K1/09 , H05K1/111 , H05K1/115 , H05K1/116 , H05K3/0073 , H05K3/202 , H05K3/22 , H05K3/38 , H05K3/382 , H05K3/383 , H05K3/384 , H05K3/385 , H05K3/388 , H05K3/389 , H05K3/4658 , H05K3/4685 , H05K2201/0145 , H05K2201/015 , H05K2201/0154 , H05K2201/0158 , H05K2201/0209 , H05K2201/0212 , H05K2203/1194
Abstract: High-speed interconnects for printed circuit boards and methods for forming the high-speed interconnects are described. A high-speed interconnect may comprise a region of a conductive film having a reduced surface roughness and one or more regions that have been treated for improved bonding with an adjacent insulating layer. Regions of reduced roughness may be used to carry high data rate signals within PCBs. Regions treated for bonding may include a roughened surface, adhesion-promoting chemical treatment, and/or material deposited to improve wettability of the surface and/or adhesion to a cured insulator.
Abstract translation: 描述了用于印刷电路板的高速互连以及用于形成高速互连的方法。 高速互连可以包括具有减小的表面粗糙度的导电膜的区域和已经被处理以改善与相邻绝缘层的接合的一个或多个区域。 粗糙度降低的区域可用于在PCB内携带高数据速率信号。 用于粘合处理的区域可以包括粗糙表面，促进粘附的化学处理和/或沉积以提高表面的润湿性和/或对固化的绝缘体的粘附的材料。
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104.发明申请公开(公告)号：US20160079174A1
公开(公告)日：2016-03-17
申请号：US14719764
申请日：2015-05-22
Applicant: Ravi Nalla , Omar Bchir , Houssam Jomaa
Inventor： Ravi Nalla , Omar Bchir , Houssam Jomaa
IPC: H01L23/532 , C08J5/18
CPC classification number: H01L23/53238 , C08J5/18 , C08J2363/00 , H01L24/26 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H05K1/0298 , H05K3/181 , H05K3/381 , H05K3/4661 , H05K2201/0209 , H05K2201/0212 , H05K2203/0773 , H05K2203/0796 , Y10T156/1052 , Y10T428/249921 , Y10T428/254 , Y10T428/268 , H01L2924/00
Abstract: In some embodiments, an improved mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers is presented. In this regard, a substrate build-up film is introduced having epoxy material and a plurality of epoxy microspheres, wherein an interior of the microspheres is not fully cured. Other embodiments are also disclosed and claimed.
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公开(公告)号：US09258891B2
公开(公告)日：2016-02-09
申请号：US14128555
申请日：2013-03-19
Applicant: ASAHI KASEI E-MATERIALS CORPORATION
Inventor： Masaaki Endo , Takamitsu Utsumi , Shoji Otani
CPC classification number: H05K1/0366 , B32B7/06 , B32B15/08 , B32B15/20 , B32B27/20 , B32B27/285 , B32B27/32 , B32B2264/0257 , B32B2307/306 , B32B2307/538 , B32B2457/08 , C08J5/24 , C08J2371/12 , H05K1/0373 , H05K2201/0137 , H05K2201/0212 , Y10T428/24355
Abstract: Provided is a prepreg suffering little resin particle fall-off and little resin peeling during prepreg production and during handling in order to have excellent dielectric properties for PPE and favorable adhesiveness. A PPE-containing prepreg constituted of a base material and a curable resin composition including PPE particles, wherein the prepreg is characterized in that (1) PPE extracted from the prepreg using a mixed solvent of toluene and methanol in a mass ratio of 95:5 includes PPE particles (A) insoluble in the mixed solvent, (2) the amount of PPE contained in the PPE particles (A) is 70 mass % or higher, and (3) the number-average molecular weight of the PPE contained in the PPE particles (A) is 8,000-40,000.
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Patent Agency Ranking
公开(公告)号：US09040843B2
公开(公告)日：2015-05-26
申请号：US13617012
申请日：2012-09-14
Applicant: Yukihiko Toyoda , Yoichiro Kawamura , Tomoyuki Ikeda
Inventor： Yukihiko Toyoda , Yoichiro Kawamura , Tomoyuki Ikeda
CPC classification number: H05K1/115 , H01L21/486 , H01L23/49827 , H01L2924/0002 , H01L2924/15311 , H01L2924/3011 , H05K1/0271 , H05K1/113 , H05K1/116 , H05K3/28 , H05K3/4602 , H05K3/4644 , H05K3/4661 , H05K3/4688 , H05K2201/0133 , H05K2201/0209 , H05K2201/0212 , H05K2201/068 , H05K2201/09454 , H05K2201/09536 , H05K2201/09563 , H05K2201/096 , H05K2201/09627 , H05K2201/09745 , H01L2924/00
Abstract: A multilayered printed circuit board including a substrate, a multilayered structure formed on the substrate and including multiple conductor circuits and multiple interlaminar resin insulating layers, and a stack-via structure having multiple via-holes and formed in the multilayered structure such that the via-holes are piled through the interlaminar resin insulating layers in the multilayered structure. The interlaminar resin insulating layers include an outermost interlaminar resin insulating layer forming an outermost layer of the interlaminar resin insulating layers and having a coefficient of linear expansion which is equal to or smaller than coefficients of linear expansion of the interlaminar resin insulating layers other than the outermost interlaminar resin insulating layer.
Abstract translation: 一种多层印刷电路板，包括基板，形成在基板上的多层结构，包括多个导体电路和多个层间树脂绝缘层，以及具有多个通孔的叠层通孔结构，形成在多层结构中， 通过多层结构中的层间树脂绝缘层堆积孔。 层间树脂绝缘层包括形成层间树脂绝缘层的最外层的最外层间树脂绝缘层，其线膨胀系数等于或小于除最外层之外的层间树脂绝缘层的线性膨胀系数 层间树脂绝缘层。
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107.发明授权Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers 有权通过部分固化的环氧树脂填料，铜金属化对电介质的机械附着力公开(公告)号：US09040842B2
公开(公告)日：2015-05-26
申请号：US13867851
申请日：2013-04-22
Applicant: Intel Corporation
Inventor： Ravi Nalla , Omar Bchir , Houssam Jomaa
CPC classification number: H01L23/53238 , C08J5/18 , C08J2363/00 , H01L24/26 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H05K1/0298 , H05K3/181 , H05K3/381 , H05K3/4661 , H05K2201/0209 , H05K2201/0212 , H05K2203/0773 , H05K2203/0796 , Y10T156/1052 , Y10T428/249921 , Y10T428/254 , Y10T428/268 , H01L2924/00
Abstract: In some embodiments, an improved mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers is presented. In this regard, a substrate build-up film is introduced having epoxy material and a plurality of epoxy microspheres, wherein an interior of the microspheres is not fully cured. Other embodiments are also disclosed and claimed.
Abstract translation: 在一些实施方案中，提出了铜金属化与具有部分固化的环氧树脂填料的电介质的改进的机械粘附。 在这方面，引入具有环氧树脂材料和多个环氧微球的衬底累积膜，其中微球的内部未完全固化。 还公开并要求保护其他实施例。
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公开(公告)号：US08883894B2
公开(公告)日：2014-11-11
申请号：US14002552
申请日：2012-02-22
Applicant: Yoshihide Sekito
Inventor： Yoshihide Sekito
IPC: C08K5/5313 , H05K1/02 , C08G18/67 , C08G18/75 , H05K3/28 , C08G18/66 , C08G18/08 , C08K3/08 , C08K7/16 , C08K3/02
CPC classification number: H05K1/0271 , C08G18/0823 , C08G18/6659 , C08G18/672 , C08G18/758 , C08J5/18 , C08K7/16 , C08K2003/026 , C08K2003/0812 , C08K2201/003 , H05K3/287 , H05K2201/0209 , H05K2201/0212 , H05K2201/0215 , H05K2201/0266 , C08G18/44
Abstract: The present invention provides an insulating film including: a (A) binder polymer; (B) spherical organic beads; and (C) fine particles containing at least one element selected from the group consisting of phosphorus, aluminum, and magnesium, both the (B) spherical organic bead and the (C) fine particles being dispersed in a predetermined state in the insulating film.
Abstract translation: 本发明提供一种绝缘膜，包括：（A）粘合剂聚合物; （B）球形有机珠粒; 和（C）含有选自磷，铝和镁中的至少一种元素的细颗粒，（B）球形有机珠和（C）微粒均以预定状态分散在绝缘膜中。
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公开(公告)号：US20140227924A1
公开(公告)日：2014-08-14
申请号：US14119342
申请日：2012-05-23
Applicant: Takeshi Nobukuni , Yoshihiro Kato , Meguru Ito , Tomoki Hamajima
Inventor： Takeshi Nobukuni , Yoshihiro Kato , Meguru Ito , Tomoki Hamajima
IPC: C09D163/00 , H05K1/03
CPC classification number: C09D163/00 , C08G59/245 , C08G59/38 , C08G59/4014 , C08J5/24 , C08J2363/00 , C08J2479/04 , C08J2483/04 , C08L63/00 , H05K1/0353 , H05K1/0373 , H05K2201/012 , H05K2201/0209 , H05K2201/0212 , Y10T428/31529 , Y10T442/2008 , Y10T442/2951 , C08L79/04 , C08L83/04
Abstract: A resin composition contains a cyanate ester compound, a maleimide compound, an epoxy resin, a silicone rubber powder, and an inorganic filler. The cyanate ester compound contains a compound represented by the following formula. The silicone rubber powder is contained in an amount of 40 to 150 parts by mass based on 100 parts by mass in total of the cyanate ester compound, the maleimide compound, and the epoxy resin. The inorganic filler is contained in an amount of 100 to 340 parts by mass based on 100 parts by mass in total of the cyanate ester compound, the maleimide compound, and the epoxy resin. A total content of the silicone rubber powder and the inorganic filler is 140 to 380 parts by mass based on 100 parts by mass in total of the cyanate ester compound, the maleimide compound, and the epoxy resin.
Abstract translation: 树脂组合物含有氰酸酯化合物，马来酰亚胺化合物，环氧树脂，硅橡胶粉末和无机填料。 氰酸酯化合物含有下式表示的化合物。 相对于氰酸酯化合物，马来酰亚胺化合物和环氧树脂的总计100质量份，硅橡胶粉末的含量为40〜150质量份。 相对于氰酸酯化合物，马来酰亚胺化合物和环氧树脂的总计100质量份，无机填料的含量为100〜340质量份。 相对于氰酸酯化合物，马来酰亚胺化合物和环氧树脂的总计100质量份，硅橡胶粉末和无机填料的总含量为140〜380质量份。
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110.发明申请公开(公告)号：US20130299226A1
公开(公告)日：2013-11-14
申请号：US13867851
申请日：2013-04-22
Applicant: Ravi Nalla , Omar Bchir , Houssam Jomaa
Inventor： Ravi Nalla , Omar Bchir , Houssam Jomaa
CPC classification number: H01L23/53238 , C08J5/18 , C08J2363/00 , H01L24/26 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H05K1/0298 , H05K3/181 , H05K3/381 , H05K3/4661 , H05K2201/0209 , H05K2201/0212 , H05K2203/0773 , H05K2203/0796 , Y10T156/1052 , Y10T428/249921 , Y10T428/254 , Y10T428/268 , H01L2924/00
Abstract: In some embodiments, an improved mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers is presented. In this regard, a substrate build-up film is introduced having epoxy material and a plurality of epoxy microspheres, wherein an interior of the microspheres is not fully cured. Other embodiments are also disclosed and claimed.
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