公开(公告)号：US5404637A

公开(公告)日：1995-04-11

申请号：US54960

申请日：1993-04-30

Applicant: Shin Kawakami

Inventor： Shin Kawakami

IPC: H05K3/34 ,  H05K3/40 ,  H05K3/46 ,  H01R9/06

CPC classification number: H05K3/4046 ,  H01R12/523 ,  H05K3/3447 ,  H05K2201/0305 ,  H05K2201/0355 ,  H05K2201/0373 ,  H05K2201/09845 ,  H05K2201/10287 ,  H05K2203/063 ,  H05K3/3468 ,  H05K3/4038 ,  H05K3/4602 ,  Y10T29/49126 ,  Y10T29/49149

Abstract: A method of manufacturing a printed wiring board. A printed wiring board having a substrate and a circuit pattern formed thereon is provided. At least one through-hole is formed in the substrate. A plurality of fine wires are inserted into the through-hole, and a molten solder is filled into the through-hole by a capillary action due to small gaps formed between the fine wires. A multilayer printed wiring board may be provided comprising a plurality of wiring board layers each having a substrate and a respective circuit pattern formed thereon. The molten solder filled in the through-hole electrically connects at lest two of the respective circuit patterns. The plurality of fine wires may be disposed in a conductive hollow tubular body which is inserted along with the fine wires into the through-hole. Also, the plurality of fine wires may be arranged as a mesh sheet that is formed into a tubular body and inserted into the through-hole. If an electronic component is to be connected with the printed wiring board through the through-hole, the leads of the electronic component may comprise the plurality of fine wires.

Abstract translation: 一种制造印刷电路板的方法。 提供了具有基板和形成在其上的电路图案的印刷线路板。 在基板中形成至少一个通孔。 多根细线被插入到通孔中，并且由于在细线之间形成的间隙小的毛细作用，熔融的焊料被填充到通孔中。 可以提供多层印刷电路板，其包括多个布线基板层，各层具有基板和形成在其上的各自的电路图案。 填充在通孔中的熔融焊料在至少两个相应的电路图案中电连接。 多个细线可以设置在与细线一起插入通孔的导电中空管状体中。 此外，多根细线可以布置成形成为管状体并插入通孔中的网片。 如果通过通孔将电子部件与印刷电路板连接，则电子部件的引线可以包括多根细线。

公开(公告)号：US5322593A

公开(公告)日：1994-06-21

申请号：US979795

申请日：1992-11-20

Applicant: Shinichi Hasegawa ,  Sakae Yokokawa

Inventor： Shinichi Hasegawa ,  Sakae Yokokawa

IPC: H01L21/48 ,  H01L23/538 ,  H05K3/00 ,  H05K3/28 ,  H05K3/32 ,  H05K3/40 ,  H05K3/46 ,  B44C1/22 ,  B29C37/00 ,  C23F1/00

CPC classification number: H05K3/4614 ,  H01L21/4857 ,  H01L23/5383 ,  H01L23/5385 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2924/09701 ,  H01L2924/15312 ,  H01L2924/15787 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/0305 ,  H05K2203/0152 ,  H05K2203/1572 ,  H05K3/0023 ,  H05K3/0052 ,  H05K3/007 ,  H05K3/28 ,  H05K3/323 ,  H05K3/4038 ,  H05K3/4623 ,  H05K3/4644 ,  Y10T29/49126 ,  Y10T29/49144

Abstract: A layered structure comprising wiring layers and polyimide layers is formed on a ceramics board and a layered structure comprising wiring layers and polyimide layers is formed on an aluminum board. Both the structures are bonded together through adhesives to bring metal bumps formed on the former structure into electric contact with metal bumps formed on the surface of the latter structure and thereafter the aluminum board is removed.

Abstract translation: 在陶瓷板上形成包括布线层和聚酰亚胺层的分层结构，并且在铝板上形成包括布线层和聚酰亚胺层的层状结构。 这两种结构通过粘合剂粘合在一起，使得在前一结构体上形成的金属凸块与形成在后一结构表面上的金属凸块电接触，此后除去铝板。

公开(公告)号：US5282565A

公开(公告)日：1994-02-01

申请号：US998152

申请日：1992-12-29

Applicant: Cynthia M. Melton

Inventor： Cynthia M. Melton

IPC: H01L21/60 ,  H05K3/06 ,  H05K3/34

CPC classification number: H01L24/16 ,  H01L24/81 ,  H05K3/3436 ,  H05K3/3484 ,  H01L2224/13099 ,  H01L2224/13116 ,  H01L2224/13147 ,  H01L2224/16237 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K2201/0305 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/042 ,  H05K2203/0545 ,  H05K3/067 ,  H05K3/3452 ,  Y02P70/613

Abstract: A solder bump interconnection (34) bonding a metal bump (30) affixed to an integrated circuit component (10) to a terminal pad (18) of a printed circuit board (12) is formed using a consumable path (24) and a solder deposit (28) applied to the path spaced part from the terminal pad. In addition to the terminal pad, the printed circuit board includes a solder-nonwettable surface (21). The consumable path extends from the terminal pad on the solder-nonwettable surface and is formed oa solder-soluble metal. The solder deposit is heated, preferably by a laser beam, to form molten solder that is drawn along the pathdissolving the path as it proceeds. At the terminalmolten solder wets the pad and the metal bump and solidifies to complete the inerconnection.

Abstract translation: 将固定到集成电路部件（10）的金属凸块（30）与印刷电路板（12）的端子焊盘（18）接合的焊料凸块互连（34）使用消耗路径（24）和焊料 沉积（28）施加到与端子垫的路径间隔部分。 除了端子焊盘之外，印刷电路板还包括焊料不可润湿的表面（21）。 消耗路径从焊料不可润湿表面上的端子焊盘延伸并形成为可焊性可溶的金属。 焊料沉积物优选通过激光束被加热，以形成熔融焊料，该熔融焊料沿着路径在其进行时溶解。 在末端熔融焊料时，焊垫和金属凸块润湿，并固化以完成非连接。

公开(公告)号：US5229550A

公开(公告)日：1993-07-20

申请号：US847122

申请日：1992-03-31

Applicant: Perminder S. Bindra ,  Dennis A. Canfield ,  Voya Rista Markovich ,  Jeffrey McKeveny ,  Robert E. Ruane ,  Edwin L. Thomas

Inventor： Perminder S. Bindra ,  Dennis A. Canfield ,  Voya Rista Markovich ,  Jeffrey McKeveny ,  Robert E. Ruane ,  Edwin L. Thomas

IPC: H05K3/00 ,  H05K3/28 ,  H05K3/36 ,  H05K3/40 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46

CPC classification number: H05K3/462 ,  H05K3/445 ,  H05K1/0272 ,  H05K2201/0305 ,  H05K2201/0373 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/09572 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/0307 ,  H05K2203/054 ,  H05K3/0023 ,  H05K3/28 ,  H05K3/36 ,  H05K3/4038 ,  H05K3/4069 ,  H05K3/4076 ,  H05K3/423 ,  H05K3/428

Abstract: A structure and method are disclosed for making high density circuit board. Using photosensitive or other dielectric materials over a circuitized power core, vias and lands are opened up, filled with joining metal and aligned with the next level, eliminating a major registration problem in building up a high density composite and reducing the number of steps in the manufacturing process.

Abstract translation: 公开了一种用于制造高密度电路板的结构和方法。 在电路化电源核心上使用光敏或其他电介质材料，通孔和焊盘被打开，填充有接合金属并与下一级对齐，从而消除了建立高密度复合材料的主要配准问题，并减少了 制造工艺。

公开(公告)号：US5147519A

公开(公告)日：1992-09-15

申请号：US559250

申请日：1990-07-27

Applicant: Ronald Legge

Inventor： Ronald Legge

IPC: C23C14/00 ,  C23C14/04 ,  C23C14/58 ,  H05K1/00 ,  H05K3/20

CPC classification number: C23C14/042 ,  C23C14/0005 ,  C23C14/58 ,  C23C14/5873 ,  H05K3/20 ,  H05K1/0393 ,  H05K2201/0133 ,  H05K2201/0162 ,  H05K2201/0305 ,  H05K2201/0326 ,  H05K2203/0152 ,  H05K2203/0376

Abstract: A predetermined conductor pattern is formed on a sacrificial substrate. The substrate and conductors are covered with an elastomeric material, which is generally an uncured liquid. The elastomer is cured to form a solid. Then the sacrificial substrate is dissolved away leaving the conductor pattern embedded in the elastomeric material.

Abstract translation: 在牺牲基板上形成预定的导体图案。 衬底和导体被弹性体材料覆盖，弹性材料通常是未固化的液体。 将弹性体固化以形成固体。 然后将牺牲衬底溶解离开，导体图案嵌入弹性体材料中。

公开(公告)号：US5107078A

公开(公告)日：1992-04-21

申请号：US569397

申请日：1990-08-17

Applicant: Francois Marion ,  Michel Ravetto

Inventor： Francois Marion ,  Michel Ravetto

IPC: H05K1/11 ,  H01H37/76 ,  H01L21/82 ,  H01L23/538 ,  H05K1/00 ,  H05K3/34

CPC classification number: H05K3/3436 ,  H01L23/5382 ,  H01L24/98 ,  H05K1/0293 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K2201/0305 ,  H05K2201/09427 ,  H05K2201/10181 ,  H05K2201/10363 ,  H05K2203/043 ,  H05K2203/0465 ,  H05K2203/048 ,  H05K2203/0545 ,  H05K3/3484 ,  Y02P70/613

Abstract: An electric connection of disconnection element is described as well as the corresponding connection or disconnection method and integrated circuits using such elements.The disconnection element consists of a disk or ingot joining two conductive tracks whose extremities are laid on wettable surfaces. Melting of the disk frees surface tension forces which separate its material into two balls centered on the wettable surfaces.The connection element is formed of two separate disks and, from the wettable surface pads, these disks are disposed opposite each other so that their material, once melted, unites to form a single droplet.A process is also disclosed for using these connection and disconnection elements for repairing defective integrated circuits.

Abstract translation: 描述断开元件的电连接以及使用这些元件的相应的连接或断开方法以及集成电路。 断开元件由连接两个导电轨道的圆盘或锭组成，其四肢铺设在可润湿的表面上。 盘的熔化释放表面张力，将其材料分离成两个以可润湿表面为中心的球。 连接元件由两个分离的盘形成，并且从可湿性表面垫片中，这些盘彼此相对设置，使得它们的材料一旦熔化就结合形成单个液滴。 还公开了使用这些连接和断开元件来修复有缺陷的集成电路的过程。

公开(公告)号：US5084691A

公开(公告)日：1992-01-28

申请号：US590732

申请日：1990-10-01

Applicant: Theodore V. Lester ,  Jerry D. Meyerhoff ,  Loren E. Saar

Inventor： Theodore V. Lester ,  Jerry D. Meyerhoff ,  Loren E. Saar

IPC: H01H61/00 ,  H01H85/046 ,  H01H85/36 ,  H05K1/00 ,  H05K1/02 ,  H05K1/14

CPC classification number: H01H85/046 ,  H01H61/00 ,  H05K1/0293 ,  H01H2085/466 ,  H01H85/36 ,  H05K1/0212 ,  H05K1/141 ,  H05K2201/0305 ,  H05K2201/10181

Abstract: A controllable fuse (10; 40; 50; 60; 80) has a pair of isolated conductor pads (26, 27), a solder connection (32; 41; 51) connected to the pads and providing a circuit connection therebetween, and at least one heater (14; 70, 75) to produce heat in response to an electrical signal. When sufficient heat is provided, the solder connection will desolder and disconnect the circuit connection between the conductor pads (26, 27). Major features are that the conductor pads and the heater are provided on a planar surface(s) (19, 25) as planar films and that redundancy for the fuse can be implemented by providing more than one heater (70, 75). A preferred manufacturing method for the fuse is disclosed which utilizes a solder retaining structure. Several fuse configurations are illustrated.

Abstract translation: 可控制的熔丝（10; 40; 50; 60; 80）具有一对隔离的导体焊盘（26,27），连接到焊盘并提供它们之间的电路连接的焊接连接（32; 41; 51） 至少一个加热器（14; 70,75），以响应于电信号产生热量。 当提供足够的热量时，焊接连接将脱焊并断开导体焊盘（26,27）之间的电路连接。 主要特征是导体焊盘和加热器作为平面膜设置在平坦表面（19,25）上，并且可以通过提供多于一个的加热器（70,75）来实现熔断器的冗余。 公开了一种利用焊料保持结构的熔断器的优选制造方法。 说明了几种保险丝配置。

公开(公告)号：US4925522A

公开(公告)日：1990-05-15

申请号：US396257

申请日：1989-08-21

Applicant: Frank J. Avellino ,  Richard A. Case ,  David T. Swanson

Inventor： Frank J. Avellino ,  Richard A. Case ,  David T. Swanson

IPC: H05K1/00 ,  H05K1/11 ,  H05K3/06 ,  H05K3/32 ,  H05K3/40

CPC classification number: H05K3/328 ,  H05K3/062 ,  H05K3/4015 ,  H05K1/0393 ,  H05K1/118 ,  H05K2201/0305 ,  H05K2203/1115

Abstract: A method of making printed circuit boards having gold dot contacts formed on the terminal pads is disclosed. A first layer of copper is overlayed with a pattern of tin or solder which acts as a resist. The gold dot contacts are resistance welded to the terminal pads. The copper underlayment and its pattern of tin or solder carrying the gold dots is then bonded to an electrically insulating substrate, which can be flexible, to form a composite board which is then etched to form a printed circuit board having gold dot contacts thereon. Other materials than tin or solder can be employed so long as there is a difference in etchability between it and the copper foil.

Abstract translation: 公开了一种在端子焊盘上形成具有金点触点的印刷电路板的方法。 第一层铜层叠着作为抗蚀剂的锡或焊料图案。 金点触点电阻焊接到端子焊盘。 然后将铜垫层及其带有金点的锡或焊料的图案接合到可以是柔性的电绝缘基板上，以形成复合板，然后将该复合板进行蚀刻以形成其上具有金点接触的印刷电路板。 可以使用除锡或焊料以外的其它材料，只要其与铜箔之间的蚀刻性差异即可。

公开(公告)号：US4803450A

公开(公告)日：1989-02-07

申请号：US134268

申请日：1987-12-14

Applicant: James F. Burgess ,  Homer H. Glascock, II ,  Harold F. Webster ,  Constantine A. Neugebauer ,  James A. Loughran

Inventor： James F. Burgess ,  Homer H. Glascock, II ,  Harold F. Webster ,  Constantine A. Neugebauer ,  James A. Loughran

IPC: H01P3/08 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K3/38 ,  H05K3/40 ,  H05K3/46 ,  B23K31/02 ,  B32B9/06 ,  H05K3/36

CPC classification number: H01P3/088 ,  H05K3/462 ,  H05K3/4629 ,  H05K1/0237 ,  H05K1/0272 ,  H05K1/0306 ,  H05K1/09 ,  H05K2201/0305 ,  H05K2201/0379 ,  H05K2201/096 ,  H05K3/38 ,  H05K3/4038 ,  H05K3/4623 ,  H05K3/4641 ,  Y10S428/901 ,  Y10T29/49126

Abstract: Multilayer circuit boards composed primarily of silicon and containing buried ground planes and buried conducting runs are fabricated in one embodiment by positioning conductive patterns (12) on the surfaces of silicon substrates and melting a solder component of the conductive patterns (12) and allowing it to flow together with solder from the conductive patterns (12) on a stacked, adjacent silicon substrate (10). When the solder cools, a single conductive pathway (18) exists between adjacent silicon substrates (10) and bonds the adjacent substrates. If the substrates are coated with SiO.sub.2 (20), a multilayer structure with buried microwave strip lines (22) is formed in the bonding process. Alternatively, highly resistive silicon substrates (26) are used as a dielectric for microwave strip lines (24) on a top surface thereof and a conductive sheet (28) on the bottom surface thereof acts as a ground plane for microwave energy propagating along strip line (24).

Abstract translation: 在一个实施例中，通过将导电图案（12）定位在硅衬底的表面上并熔化导电图案（12）的焊料组件，并使其成为 与来自堆叠的相邻硅衬底（10）上的导电图案（12）的焊料一起流动。 当焊料冷却时，在相邻硅衬底（10）之间存在单个导电通路（18），并且将相邻衬底粘合。 如果衬底被涂覆有SiO 2（20），则在接合过程中形成具有埋入的微波带状线（22）的多层结构。 或者，高电阻硅衬底（26）用作其顶表面上的微波带线（24）的电介质，并且其底表面上的导电片（28）用作沿着带状线传播的微波能量的接地面 （24）。

公开(公告)号：US4794489A

公开(公告)日：1988-12-27

申请号：US99352

申请日：1987-09-21

Applicant: Vernon L. Brown

Inventor： Vernon L. Brown

IPC: H01M2/10 ,  H04B1/38 ,  H04M1/02 ,  H05K1/02 ,  H05K1/14 ,  H05K3/00 ,  H05K3/34 ,  H05K3/40 ,  H05K3/44 ,  H05K9/00

CPC classification number: H04M1/0262 ,  H01M2/1022 ,  H04B1/3883 ,  H05K1/0215 ,  H05K3/341 ,  H05K3/4084 ,  H05K1/0237 ,  H05K1/144 ,  H05K2201/0305 ,  H05K2201/0355 ,  H05K2201/0382 ,  H05K2201/09054 ,  H05K2201/09554 ,  H05K2201/10969 ,  H05K3/0061 ,  H05K3/4038 ,  H05K3/44 ,  Y02P70/613

Abstract: A unique housing (104) of a portable radio transceiver (100) is described that takes advantage of the heat sinking, electrical shielding and structural characteristics of a battery. The unique electronic circuitry housing (104) includes a battery as a structural element thereof. In one illustrated housing (104), a stick battery (210) is attached to the side of a transmitter printed circuit panel (213). A logic printed circuit panel (212) and a receiver printed circuit panel (214) are positioned above and below the transmitter printed circuit panel (213), respectively, and are held together by interlocking side rails (206,207). The electronic circuitry housing of the present invention may be advantageously utilized in a variety of applications where electronic circuitry is operated from a battery.

Abstract translation: 描述了利用电池的散热，电屏蔽和结构特征的便携式无线电收发器（100）的独特外壳（104）。 独特的电子电路壳体（104）包括作为其结构元件的电池。 在一个示出的壳体（104）中，粘贴电池（210）附接到发射器印刷电路板（213）的侧面。 逻辑印刷电路板（212）和接收器印刷电路板（214）分别位于发射机印刷电路板（213）的上方和下方，并通过互锁的侧轨（206,207）保持在一起。 本发明的电子电路外壳可有利地用于电池从电池操作的各种应用中。