公开(公告)号：US07872873B2

公开(公告)日：2011-01-18

申请号：US12124081

申请日：2008-05-20

Applicant: Siew S. Hiew ,  Nan Nan ,  Abraham C. Ma

Inventor： Siew S. Hiew ,  Nan Nan ,  Abraham C. Ma

IPC: H05K7/14

CPC classification number: G06F1/1632 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/14 ,  H01R24/62 ,  H01R2107/00 ,  H05K3/284 ,  H05K3/326 ,  H05K3/4015 ,  H05K3/4046 ,  H05K2201/0311 ,  H05K2201/09472 ,  H05K2203/1316 ,  Y10T29/4913 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2924/00

Abstract: A dual-personality extended USB (EUSB) system supports both USB and EUSB memory cards using an extended 9-pin EUSB socket. Each EUSB memory card includes a PCBA having four standard USB metal contact pads disposed on an upper side of a PCB, and several extended purpose contact springs that extend through openings defined in the PCB. Passive components are mounted on a lower surface of the PCB using SMT methods, and IC dies are mounted using COB methods, and then the components and IC dies are covered by a plastic molded housing. The extended 9-pin EUSB socket includes standard USB contacts and extended use contacts that communicate with the PCBA through the standard USB metal contacts and the contact springs. The PCBA includes dual-personality electronics for USB and EUSB communications.

Abstract translation: 双重个性扩展USB（EUSB）系统支持使用扩展的9针EUSB插座的USB和EUSB存储卡。 每个EUSB存储卡包括PCBA，PCBA具有设置在PCB上侧的四个标准USB金属接触垫，以及延伸通过PCB中限定的开口的多个扩展型接触弹簧。 无源元件使用SMT方法安装在PCB的下表面上，IC芯片使用COB方法安装，然后元件和IC芯片被塑料模制外壳覆盖。 扩展的9针EUSB插座包括通过标准USB金属触点和接触弹簧与PCBA通信的标准USB触点和扩展使用触点。 PCBA包括用于USB和EUSB通信的双人格电子设备。

公开(公告)号：US20110003492A1

公开(公告)日：2011-01-06

申请号：US12824456

申请日：2010-06-28

Applicant: Yoshihiro IHARA

Inventor： Yoshihiro IHARA

IPC: H01R12/30

CPC classification number: H01L24/90 ,  G01R1/07307 ,  H01L24/13 ,  H01L24/16 ,  H01L24/72 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K1/141 ,  H05K3/325 ,  H05K3/4015 ,  H05K2201/0311 ,  H05K2201/10378 ,  Y10T29/49204 ,  Y10T29/49222

Abstract: A board includes a board body; a first conductor provided at a first surface of the board body; and an electrically conductive connection terminal having a spring property. The connection terminal includes a first end part fixed to the first conductor; a second end part to be connected to a first object of connection to be placed opposite the first surface of the board body; and a projection part provided on the first end part so as to project toward the first conductor.

Abstract translation: 董事会包括董事会成员; 设置在所述电路板主体的第一表面的第一导体; 以及具有弹簧特性的导电连接端子。 连接端子包括固定到第一导体的第一端部; 要连接到第一物体的第二端部，以与板体的第一表面相对放置; 以及设置在所述第一端部上以朝向所述第一导体突出的突出部。

公开(公告)号：US20100263922A1

公开(公告)日：2010-10-21

申请号：US12426106

申请日：2009-04-17

Applicant: Laurent Sustek ,  Stephane Di Vito

Inventor： Laurent Sustek ,  Stephane Di Vito

IPC: H05K1/18 ,  H05K3/30

CPC classification number: H05K3/3442 ,  G06K19/07745 ,  H01L2224/48091 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/10727 ,  Y02P70/613 ,  Y10T29/4913 ,  H01L2924/00014

Abstract: A device includes a carrier and an integrated circuit chip having a first side supported by the carrier and a second side having contacts. The carrier has multiple carrier contacts supported by the carrier and separated from the integrated circuit chip. Multiple leads are coupled between the contacts on the integrated circuit chip and the multiple carrier contacts. A resin encapsulates the integrated circuit chip leaving the multiple carrier contacts at least partially uncovered for attaching to a card or board.

Abstract translation: 一种器件包括载体和集成电路芯片，其具有由载体支撑的第一侧和具有触点的第二侧。 载体具有由载体支撑并且与集成电路芯片分离的多个载体接触。 多个引线耦合在集成电路芯片上的触点和多个载体触点之间。 树脂将集成电路芯片封装起来，使得多个载体接触件至少部分地不被覆盖以附接到卡或板上。

公开(公告)号：US20100213649A1

公开(公告)日：2010-08-26

申请号：US12472750

申请日：2009-05-27

Applicant: Hong Wen Lee ,  Yi Ming Chang

Inventor： Hong Wen Lee ,  Yi Ming Chang

IPC: F16F3/04 ,  H05K13/00

CPC classification number: F16F15/06 ,  G06F1/183 ,  H05K1/0215 ,  H05K2201/0311 ,  H05K2201/09072 ,  H05K2201/1031 ,  Y02P70/611 ,  Y10T29/49002

Abstract: A shock absorber and an assembling method of an electronic device using the same are provided. The shock absorber includes a first connecting portion, a second connecting portion and a number of elastic arms. The two connecting portions respectively connect to a housing and a circuit board of the electronic device. Two ends of each elastic arm are respectively connected to the two connecting portions to buffer the relative movement between the housing and the circuit board. The method includes the following steps. First, the shock absorber including the first connecting portion, the second connecting portion and the elastic arms is provided. Then the second connecting portion is connected to a surface of the circuit board surrounding a through hole of the circuit board. After connecting the second connecting portion, the housing is connected to the first connecting portion.

Abstract translation: 提供了一种使用其的电子设备的减震器和组装方法。 减震器包括第一连接部分，第二连接部分和多个弹性臂。 两个连接部分分别连接到电子设备的壳体和电路板。 每个弹性臂的两端分别连接到两个连接部分，以缓冲壳体和电路板之间的相对移动。 该方法包括以下步骤。 首先，提供包括第一连接部分，第二连接部分和弹性臂的减震器。 然后，第二连接部分连接到电路板的围绕电路板的通孔的表面。 在连接第二连接部分之后，壳体连接到第一连接部分。

公开(公告)号：US07773388B2

公开(公告)日：2010-08-10

申请号：US11566912

申请日：2006-12-05

Applicant: Takashi Kariya ,  Toshiki Furutani ,  Takeshi Kawanishi

Inventor： Takashi Kariya ,  Toshiki Furutani ,  Takeshi Kawanishi

IPC: H01R9/00

CPC classification number: H05K3/326 ,  H01L23/49811 ,  H01L24/72 ,  H01L24/81 ,  H01L24/90 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K3/28 ,  H05K3/341 ,  H05K3/4092 ,  H05K2201/0311 ,  H05K2201/0314 ,  H05K2201/0397 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599

Abstract: The present invention is to provide a printed wiring board in which malconnection or disconnection caused by a difference between coefficients of thermal expansion of a semiconductor chip and a printed wiring board can be decreased even when a highly-integrated semiconductor apparatus is mounted thereon and an electronic device using the same. An electronic device (4) according to the present invention includes a printed wiring board (1) with a component mounting pin (18) and a surface-mounting type semiconductor apparatus (2) with an electrode pad (3), wherein the component mounting pin (18) has elasticity and is urged against the electrode pad (3) to maintain electric connection.

Abstract translation: 本发明是提供一种印刷电路板，其中即使在高度集成的半导体装置安装在其上时也能够降低由半导体芯片和印刷电路板的热膨胀系数之间的差异引起的故障连接或断开，并且电子 设备使用相同。 根据本发明的电子设备（4）包括具有元件安装销（18）的印刷电路板（1）和具有电极焊盘（3）的表面安装型半导体设备（2），其中元件安装 销（18）具有弹性并且被推靠在电极焊盘（3）上以保持电连接。

公开(公告)号：US07752738B2

公开(公告)日：2010-07-13

申请号：US11039949

申请日：2005-01-24

Applicant: Thomas H. DiStefano

Inventor： Thomas H. DiStefano

IPC: H01H11/00 ,  H01H65/00

CPC classification number: H05K3/4092 ,  H01L23/49811 ,  H01L24/72 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H05K2201/0311 ,  Y10T29/49105 ,  Y10T29/49135 ,  Y10T29/4914 ,  Y10T29/49155 ,  Y10T29/49218

Abstract: Systems and methods are provided for fabricating compliant spring contacts for use in, for example, IC packaging and interconnection between multi-layers in stacked IC packages and electronic components. Internal stresses generated within an formed film are released to cause the film to buckle and/or bow away from a supporting terminal. A thin stressed metal film layer is selectively broken away from the substrate of the supporting terminal allowing the stressed metal film to take on a bowed and/or spring-like shaped through minute deformation based on a release of the internal stresses. The resultant thin compliant spring contact can deform a small amount as the spring contact is then pressed against a compatible mating contact surface in an overlying layer.

Abstract translation: 提供了用于制造柔性弹簧触点的系统和方法，用于例如IC封装以及堆叠IC封装和电子部件中的多层之间的互连。 在成形薄膜内产生的内部应力被释放以使薄膜从支撑端子弯曲和/或翘曲。 薄的应力金属膜层从支撑端子的基板选择性地断开，允许应力金属膜基于内部应力的释放通过微小的变形而呈现弓形和/或弹簧形状。 随着弹簧接触件被压靠在上层中的相容配合接触表面上，所得到的柔性柔顺弹性接触件可以变形少量。

公开(公告)号：US20100032189A1

公开(公告)日：2010-02-11

申请号：US12527069

申请日：2008-02-08

Applicant: Masahide Muto ,  Yoshiyuki Uchinono ,  Hiroyuki Yoshida ,  Takashi Shindo ,  Masahiro Sato ,  Yutaka Nishira ,  Norimasa Kaji

Inventor： Masahide Muto ,  Yoshiyuki Uchinono ,  Hiroyuki Yoshida ,  Takashi Shindo ,  Masahiro Sato ,  Yutaka Nishira ,  Norimasa Kaji

IPC: H05K7/20 ,  H01L33/00 ,  H05K1/16

CPC classification number: H05K3/301 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K3/326 ,  H05K3/3442 ,  H05K2201/0311 ,  H05K2201/10106 ,  H05K2201/1031 ,  H05K2201/10636 ,  H05K2201/10962 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00014

Abstract: An LED package includes: a molded interconnect device that has an LED chip mounted thereon, and is mounted on a mounting board electrically connected to the LED chip; and a plurality of elastic bodies mounted on the mounting board while interposing solder therebetween. The plurality of elastic bodies hold a position of the molded interconnect device with respect to the mounting board by elastic forces given to an inner surface side of the molded interconnect device from a plurality of outer side surfaces thereof opposite to each other.

Abstract translation: LED封装包括：模制互连装置，其上安装有LED芯片，并且安装在电连接到LED芯片的安装板上; 以及安装在安装基板上的多个弹性体，同时插入焊料。 多个弹性体通过相对于多个彼此相对的多个外侧面的模制互连装置的内表面侧的弹性力而相对于安装板保持模制互连装置的位置。

公开(公告)号：US07628617B2

公开(公告)日：2009-12-08

申请号：US11525755

申请日：2006-09-22

Applicant: Dirk D. Brown ,  John D. Williams ,  William B. Long

Inventor： Dirk D. Brown ,  John D. Williams ,  William B. Long

IPC: H01R12/00

CPC classification number: H01R13/2407 ,  H05K3/326 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0311 ,  H05K2201/0397 ,  H05K2201/10719 ,  H05K2201/10924 ,  H05K2201/10946

Abstract: An elastic contact array circuitized substrate includes a circuitized substrate provided with circuit traces, and an array of three dimensional contact elements joined to the circuitized substrate and electrically coupled to the circuit traces. In one configuration, the array of three dimensional contacts are formed in a spring sheet material having anisotropic grains whose long direction is selected with respect to the longitudinal direction of elastic contact arms, in accordance with desired properties. In another configuration of the invention, the circuit traces are formed integrally within the spring sheet material.

Abstract translation: 弹性接触阵列电路化衬底包括设置有电路迹线的电路化衬底和连接到电路化衬底并电耦合到电路迹线的三维接触元件的阵列。 在一种结构中，根据所需的性质，三维触点阵列形成为具有相对于弹性接触臂的纵向方向选择长方向的各向异性颗粒的弹簧片材料。 在本发明的另一种结构中，电路迹线一体形成在弹簧片材料内。

公开(公告)号：US07595988B2

公开(公告)日：2009-09-29

申请号：US11935496

申请日：2007-11-06

Applicant: James S. Wilson ,  Michael A. Moore

Inventor： James S. Wilson ,  Michael A. Moore

IPC: H05K7/20 ,  F28F7/00

CPC classification number: H01L23/433 ,  H01L23/3677 ,  H01L23/49816 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/0311 ,  H05K2201/10734 ,  H05K2203/083 ,  H01L2924/00

Abstract: According to an embodiment of the present invention, a thermal management system for an electronic assembly includes an electronic component coupled to a substrate, the substrate coupled to a coldplate, a spring member disposed between and engaging both an underside of the electronic component and the coldplate, and a heat transfer element disposed within a chamber formed by the spring member.

Abstract translation: 根据本发明的实施例，用于电子组件的热管理系统包括耦合到基板的电子部件，耦合到冷板的基板，设置在电子部件和冷板之间的弹簧件 以及设置在由弹簧构件形成的室内的传热元件。

公开(公告)号：US20090196002A1

公开(公告)日：2009-08-06

申请号：US12362149

申请日：2009-01-29

Applicant: Kenji FUKUZONO

Inventor： Kenji FUKUZONO

IPC: H05K1/18 ,  H05K1/11

CPC classification number: H05K1/0271 ,  H05K3/0058 ,  H05K3/301 ,  H05K3/325 ,  H05K3/3436 ,  H05K2201/0311 ,  H05K2201/10659 ,  H05K2201/10734 ,  H05K2201/2009 ,  H05K2201/2018

Abstract: A printed wiring board unit includes an electronic circuit component, a printed wiring board, a plurality of first conductive terminals disposed between the electronic circuit component and the printed wiring board, at least one of the first conductive terminals arranged along a quadrangular outline, and a plurality of second conductive terminals disposed between the electronic circuit component and the printed wiring board, the second conductive terminals arranged at a corner of the quadrangular outline, and the second conductive terminals contacting at least one of the printed wiring board and the electronic circuit component in a relatively displaceable manner.

Abstract translation: 印刷电路板单元包括电子电路部件，印刷线路板，布置在电子电路部件和印刷线路板之间的多个第一导电端子，沿着四边形轮廓布置的至少一个第一导电端子，以及 设置在电子电路部件和印刷线路板之间的多个第二导电端子，布置在四边形轮廓的角部的第二导电端子和与印刷线路板和电子电路部件中的至少一个接触的第二导电端子 相对位移的方式。