Multilayer wiring structure and method of manufacturing the same
    107.
    发明授权
    Multilayer wiring structure and method of manufacturing the same 有权
    多层布线结构及其制造方法

    公开(公告)号:US07765686B2

    公开(公告)日:2010-08-03

    申请号:US11908731

    申请日:2006-03-02

    Abstract: A method of manufacturing a multilayer wiring structure is disclosed. The method comprises a step of forming a via post on a first metal wiring element, a step of printing an interlayer insulation film on the first metal wiring element, with use of a screen mask having a non-ejection area slightly larger than a head of the via post, such that the interlayer insulation film has an upper surface at the level lower than the head of the via post, while generally aligning the non-ejection area with the head of the via post, a step of curing the interlayer insulation film, and a step of forming a second metal wiring element in contact with the via post on the interlayer insulation film such that the first metal wiring element and the second metal wiring element are connected through the via post.

    Abstract translation: 公开了一种制造多层布线结构的方法。 该方法包括在第一金属布线元件上形成通孔的步骤,在第一金属布线元件上印刷层间绝缘膜的步骤,使用具有略大于 所述通孔使得所述层间绝缘膜具有比所述通孔的头部低的水平面的上表面,同时大致将所述非喷射区域与所述通孔的头部对准,所述层间绝缘膜的固化步骤 以及在所述层间绝缘膜上形成与所述通孔接触的第二金属配线元件的步骤,使得所述第一金属配线元件和所述第二金属配线元件通过所述通孔连接。

    Method for manufacturing coreless packaging substrate
    109.
    发明授权
    Method for manufacturing coreless packaging substrate 有权
    无芯封装基板的制造方法

    公开(公告)号:US07754598B2

    公开(公告)日:2010-07-13

    申请号:US12068256

    申请日:2008-02-05

    Abstract: Method for making a coreless packaging substrate are disclosed in the present invention. The coreless packaging substrate is made by first providing a metal adhesion layer having a melting point lower than that of the substrate, and removing a core board connected with the substrate therefrom through melting the metal adhesion layer. In addition, the disclosed packaging substrate further includes a circuit built-up structure of which has the electrical pads embedded under a surface. The disclosed packaging substrate can achieve the purposes of reducing the thickness, increasing circuit layout density, and facilitating the manufacturing of the substrate.

    Abstract translation: 制造无芯封装基板的方法在本发明中公开。 无芯封装基板通过首先提供熔点低于基板的金属粘附层,并且通过熔化金属粘合层来除去与基板相连的芯板。 此外,所公开的封装基板还包括电路组合结构,其中电垫嵌入在表面下。 所公开的封装基板可以实现减小厚度,增加电路布局密度以及促进基板的制造的目的。

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