公开(公告)号：US4774126A

公开(公告)日：1988-09-27

申请号：US75486

申请日：1987-07-20

Applicant: Denis P. Dorsey ,  Stephen Rizkowski

Inventor： Denis P. Dorsey ,  Stephen Rizkowski

IPC: H05K1/03 ,  H05K1/11 ,  H05K3/34 ,  H05K3/36 ,  B32B3/00 ,  B32B3/10

CPC classification number: H05K1/116 ,  H05K1/036 ,  H05K2201/0129 ,  H05K2201/0187 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/10371 ,  H05K3/3447 ,  H05K3/3468 ,  H05K3/366 ,  Y10S428/901 ,  Y10T428/24331 ,  Y10T428/24917 ,  Y10T428/269

Abstract: A low cost thermoplastic material having a low heat distortion (HDT) thermoplastic material forms the main structural component of a structural member. A relatively high cost high HDT thermoplastic material is attached to the low cost main structural component and is plated with a solderable metallic coating. The coating can be attached to other structures with relatively higher temperature molten solder with negligible distortion. The structural member may be, for example, an electrical shield to be soldered to a printed circuit board or a printed circuit board whose core is low HDT material and exterior is high HDT material.

Abstract translation: 具有低热变形（HDT）热塑性材料的低成本热塑性材料形成结构构件的主要结构部件。 相对高成本的高HDT热塑性材料附着在低成本主要结构部件上，并且镀有可焊接的金属涂层。 涂层可以以相对较高温度的熔融焊料连接到具有可忽略变形的其他结构。 结构构件可以是例如要焊接到印刷电路板的电屏蔽或者其芯是低HDT材料的外部是高HDT材料的印刷电路板。

公开(公告)号：US4403107A

公开(公告)日：1983-09-06

申请号：US216573

申请日：1980-12-15

Applicant: Norman E. Hoffman

Inventor： Norman E. Hoffman

IPC: H05K1/03 ,  H05K3/04 ,  H05K3/10 ,  H05K1/02 ,  B05D1/12 ,  B32B3/12 ,  B32B31/00

CPC classification number: H05K1/0373 ,  H05K3/041 ,  H05K2201/0116 ,  H05K2201/0209 ,  H05K2201/0254 ,  H05K2201/09045 ,  H05K2203/0108 ,  H05K2203/1545 ,  H05K3/107 ,  Y10S428/901 ,  Y10T156/1052 ,  Y10T29/4916 ,  Y10T428/24496 ,  Y10T428/249971 ,  Y10T428/24999

Abstract: A circuit board is fabricated comprising a metal layer laminated to an underlying dielectric substrate. Portions of the metal layer are separated and recessed into stable indented portions of the substrate by a stamping die, roller, or the like. The substrate is composed of a cellular material, for example, polysulfone impregnated with hollow glass spheres, whereby the indented portions of the substrate are compacted by impression of the die profile to receive separated portions of the metal layer therein.

Abstract translation: 制造电路板，其包括层压到下面的电介质基板上的金属层。 通过冲压模具，辊等将金属层的一部分分离并凹入到基板的稳定的凹入部分中。 衬底由细胞材料，例如浸渍有中空玻璃球的聚砜组成，由此通过模具轮廓的压印来压缩衬底的凹陷部分，以在其中接收金属层的分离部分。

公开(公告)号：US4211890A

公开(公告)日：1980-07-08

申请号：US906742

申请日：1978-05-17

Applicant: Ryoichi Sado ,  Koichi Nei

Inventor： Ryoichi Sado ,  Koichi Nei

IPC: H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K3/00 ,  H05K3/30 ,  H05K3/32 ,  H05K3/36 ,  H05K1/08

CPC classification number: H05K3/306 ,  H05K3/365 ,  H05K2201/0133 ,  H05K2201/09045 ,  H05K2201/10575 ,  H05K2201/10689 ,  H05K2201/2036 ,  H05K3/0064 ,  H05K3/325

Abstract: An electronic circuit board has protrusions of rubber-like material on the surface opposite to the surface on which the printed circuit is provided with terminal contact points located at positions in correspondence with the individual terminal contact points or with the individual groups of the terminal contact points, each of the groups being composed of the terminal contact points aligned in a row.

Abstract translation: 电子电路板在与印刷电路的表面相对的表面上具有橡胶状材料的突起，该表面设置有位于与各个端子接触点相对应的位置处的端子接触点或与端子接触点的各个组 每个组由连续排列的端子接触点构成。

公开(公告)号：US3998374A

公开(公告)日：1976-12-21

申请号：US596028

申请日：1975-07-11

Applicant: Benjamin Howell Cranston ,  Carl Frederick Hornig ,  Donald Arthur Machusak

Inventor： Benjamin Howell Cranston ,  Carl Frederick Hornig ,  Donald Arthur Machusak

IPC: H05K3/20 ,  H05K1/11 ,  H05K3/04 ,  H05K3/22 ,  H05K3/24 ,  H05K3/32 ,  H05K3/40 ,  B23K28/00

CPC classification number: H05K3/4015 ,  B32B37/00 ,  H05K3/04 ,  H05K3/225 ,  H05K3/328 ,  B32B2457/08 ,  H05K1/117 ,  H05K2201/09045 ,  H05K2201/1028 ,  H05K2203/0271 ,  H05K2203/173 ,  Y10T29/49155 ,  Y10T83/0591

Abstract: A method of forming a laminate is disclosed. The method comprises placing a metal film in juxtaposition to a surface to be joined thereto. A buffer medium having an explosive charge on at least one surface thereof is positioned proximate the film. The explosive charge is detonated to propel the film against the surface to shear a portion of the film, corresponding in shape to the surface, away from the buffer medium to bond the sheared portion to the surface.

Abstract translation: 公开了一种形成层压体的方法。 该方法包括将金属膜并置到与其连接的表面上。 在其至少一个表面上具有爆炸电荷的缓冲介质位于膜附近。 爆炸装置被引爆以将膜推向表面以将膜的一部分形状相对于表面剪切，远离缓冲介质以将剪切部分粘合到表面。

公开(公告)号：US3497859A

公开(公告)日：1970-02-24

申请号：US3497859D

申请日：1968-05-28

Applicant: STACKPOLE CARBON CO

Inventor： BANG MOGENS W

IPC: H01C1/084 ,  H01C1/14 ,  H01C17/00 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34 ,  H01C7/00 ,  H01C1/02

CPC classification number: H05K3/308 ,  H01C1/084 ,  H01C1/14 ,  H01C17/006 ,  H05K1/184 ,  H05K3/3447 ,  H05K2201/09045 ,  H05K2201/10022 ,  H05K2201/10568 ,  H05K2201/10651 ,  H05K2201/10878 ,  H05K2201/2036

公开(公告)号：US3149266A

公开(公告)日：1964-09-15

申请号：US6820460

申请日：1960-11-09

Applicant: NCR CO

Inventor： LIPTON ALVIN H

IPC: H05K1/00 ,  H05K3/10

CPC classification number: H05K3/107 ,  H05K1/0287 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09236 ,  H05K2201/10166 ,  H05K2201/10651

公开(公告)号：US2984697A

公开(公告)日：1961-05-16

申请号：US70162557

申请日：1957-12-09

Applicant: PLASTIC PREC PARTS CO

Inventor： BONTECUE FREDERIC C ,  BARTELHEIM LELAND A

IPC: H05K1/00 ,  H05K3/04 ,  H05K3/12 ,  H05K3/18 ,  H05K3/38

CPC classification number: H05K3/182 ,  H05K1/0284 ,  H05K3/04 ,  H05K3/1258 ,  H05K3/387 ,  H05K2201/0355 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2203/0143

公开(公告)号：US2716268A

公开(公告)日：1955-08-30

申请号：US31505052

申请日：1952-10-16

Applicant: ERIE RESISTOR CORP

Inventor： STEIGERWALT OLIVER I

IPC: H05K3/04 ,  H05K3/10 ,  H05K3/38

CPC classification number: H05K3/045 ,  H05K3/107 ,  H05K3/386 ,  H05K2201/09045 ,  H05K2203/0108 ,  H05K2203/025 ,  Y10T29/49158 ,  Y10T156/1041

公开(公告)号：US11865872B2

公开(公告)日：2024-01-09

申请号：US17086730

申请日：2020-11-02

Applicant: TDK Corporation

Inventor： Vibhu Vivek ,  Rakesh Sethi ,  Ishita Jain ,  John Sze

IPC: B60C19/00 ,  B29D30/06 ,  B60C19/08 ,  H05K1/11 ,  H01R12/67 ,  H05K3/12 ,  B60C15/00 ,  H02N2/18 ,  B29D30/00

CPC classification number: B60C19/088 ,  B29D30/0061 ,  B60C15/00 ,  B60C19/00 ,  B60C19/082 ,  B60C19/086 ,  H01R12/67 ,  H02N2/186 ,  H05K1/118 ,  H05K3/12 ,  B60C2019/004 ,  H01R2201/26 ,  H05K2201/09045

Abstract: Electrical connector assemblies mountable on a tire of a wheel of a vehicle are described. An electrical connector assembly may include one or more electrical conductors, a respective electrical conductor extending from an inside surface of the tire to an outside surface of the tire. Tire assemblies including at least partially embedded electrical connector assemblies and wheel assemblies including such tire assemblies are also described.

公开(公告)号：US20230286333A1

公开(公告)日：2023-09-14

申请号：US18199478

申请日：2023-05-19

Applicant: TDK Corporation

Inventor： Vibhu Vivek ,  Rakesh Sethi ,  Ishita Jain ,  John Sze

IPC: B60C19/08 ,  H05K1/11 ,  H01R12/67 ,  H05K3/12 ,  B60C15/00 ,  H02N2/18 ,  B60C19/00 ,  B29D30/00

CPC classification number: B60C19/088 ,  H05K1/118 ,  H01R12/67 ,  H05K3/12 ,  B60C15/00 ,  B60C19/086 ,  H02N2/186 ,  B60C19/082 ,  B60C19/00 ,  B29D30/0061 ,  B60C2019/004 ,  H05K2201/09045 ,  H01R2201/26

Abstract: Electrical connector assemblies mountable on a tire of a wheel of a vehicle are described. An electrical connector assembly may include one or more electrical conductors, a respective electrical conductor extending from an inside surface of the tire to an outside surface of the tire. Tire assemblies including at least partially embedded electrical connector assemblies and wheel assemblies including such tire assemblies are also described.