公开(公告)号：US07990470B2

公开(公告)日：2011-08-02

申请号：US12013916

申请日：2008-01-14

Applicant: Wen-Hwa Lin ,  Chen-Kuang Yeh ,  Xiang Huang ,  Wan-Cheng Xie ,  Shao-Guang Mo

Inventor： Wen-Hwa Lin ,  Chen-Kuang Yeh ,  Xiang Huang ,  Wan-Cheng Xie ,  Shao-Guang Mo

IPC: H04N5/225 ,  G03B17/00

CPC classification number: H04N5/2253 ,  H01L27/14618 ,  H01L2924/0002 ,  H04N5/2257 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/0064 ,  H05K3/303 ,  H05K2201/09045 ,  H05K2201/09054 ,  H05K2201/10121 ,  H05K2201/10727 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00

Abstract: An image sensor module includes a circuit board (20), an image sensor (10) and a supporting board (30). The circuit board has a plurality of circuits formed thereon. The image sensor is arranged on one side of the circuit board and is electrically connected to the circuit board. The circuit board defines at least one through opening (22) therein. The supporting board is arranged on an opposite side of the circuit board. A protrusion (31) extends outwardly from the supporting board through the at least one through opening of the circuit board. The image sensor is mounted on the protrusion.

Abstract translation: 图像传感器模块包括电路板（20），图像传感器（10）和支撑板（30）。 电路板上形成有多个电路。 图像传感器布置在电路板的一侧并电连接到电路板。 电路板在其中限定至少一个通孔（22）。 支撑板布置在电路板的相对侧。 突起（31）从支撑板向外延伸穿过电路板的至少一个通孔。 图像传感器安装在突起上。

公开(公告)号：US20110182073A1

公开(公告)日：2011-07-28

申请号：US13078601

申请日：2011-04-01

Applicant: Tomohiro SANPEI ,  Yumiko Hayashida ,  Masahiro Izumi ,  Kiyoshi Otani ,  Yutaka Honda ,  Shinji Nogi

Inventor： Tomohiro SANPEI ,  Yumiko Hayashida ,  Masahiro Izumi ,  Kiyoshi Otani ,  Yutaka Honda ,  Shinji Nogi

IPC: F21V29/00

CPC classification number: H05K1/0203 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/3025 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An illumination device includes a base board, an insulator, a conductor, a plurality of semiconductor light-emitting elements and a light-transmissive sealing member. The base board includes a surface and projection portions. The projection portion is formed to become gradually thicker from its end toward the surface of the base board. The insulator is formed on the surface. The conductor is formed on the insulator. The semiconductor light-emitting elements are mounted on the projection portions. The semiconductor light-emitting elements are electrically connected to the conductor via connection members. The sealing member covers the insulator, the projection portions, the semiconductor light-emitting elements and the connection members.

Abstract translation: 照明装置包括基板，绝缘体，导体，多个半导体发光元件和透光密封构件。 基板包括表面和突出部分。 突起部形成为从其端部朝向基板的表面逐渐变厚。 绝缘体形成在表面上。 导体形成在绝缘体上。 半导体发光元件安装在突出部分上。 半导体发光元件通过连接构件电连接到导体。 密封构件覆盖绝缘体，突出部分，半导体发光元件和连接构件。

公开(公告)号：US07903425B2

公开(公告)日：2011-03-08

申请号：US11475532

申请日：2006-06-27

Applicant: Daniel Justin Hebel ,  Clifford Allen Gaw ,  Brinda Kumar Ramaiya ,  James Stephen Rutledge

Inventor： Daniel Justin Hebel ,  Clifford Allen Gaw ,  Brinda Kumar Ramaiya ,  James Stephen Rutledge

IPC: H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

CPC classification number: H05K1/0204 ,  H05K2201/09054 ,  H05K2201/10416 ,  H05K2201/1056 ,  H05K2201/10689

Abstract: Heat from the core of a semiconductor chip package mounted on a printed circuit board assembled into a computer system is dissipated to both sides of the printed circuit board. A pair of integrated heat spreaders are disposed at opposite sides of the core, and two heat sinks are positioned at opposite sides of the package. Each of the heat sinks is positioned in thermal communication with one of the heat spreaders to dissipated heat from the core.

Abstract translation: 安装在组装到计算机系统中的印刷电路板上的半导体芯片封装的芯体的热量散发到印刷电路板的两侧。 一对集成的散热器设置在芯的相对侧，并且两个散热器位于封装的相对侧。 每个散热器定位成与一个散热器热连通以从芯部散热。

公开(公告)号：US07888600B2

公开(公告)日：2011-02-15

申请号：US11755016

申请日：2007-05-30

Applicant: Yuichi Ishida ,  Masaaki Ishiguro ,  Kazuaki Nakamura

Inventor： Yuichi Ishida ,  Masaaki Ishiguro ,  Kazuaki Nakamura

IPC: H05K1/00

CPC classification number: H05K1/0203 ,  H05K1/056 ,  H05K2201/09054 ,  H05K2201/0919 ,  H05K2203/302

Abstract: A circuit board includes a metal core having a plate shape, an insulation section covering a surface of the metal core, and a heat radiation section in which the metal core is exposed and which is provided at a circumference of the metal core.

Abstract translation: 电路板包括具有板形的金属芯，覆盖金属芯的表面的绝缘部分和暴露金属芯并且设置在金属芯的圆周处的散热部。

公开(公告)号：US20110012512A1

公开(公告)日：2011-01-20

申请号：US12618394

申请日：2009-11-13

Applicant: Garrett J. Young ,  Andrew Stangeland

Inventor： Garrett J. Young ,  Andrew Stangeland

IPC: H05B37/02 ,  H01J7/24

CPC classification number: F21V29/51 ,  F21K9/00 ,  F21K9/62 ,  F21V19/0025 ,  F21V29/402 ,  F21V29/56 ,  F21V29/58 ,  F21V29/60 ,  F21V29/677 ,  F21V29/83 ,  F21Y2113/13 ,  F21Y2115/10 ,  H05B33/0845 ,  H05B33/0857 ,  H05B37/0227 ,  H05K1/0204 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106

Abstract: Various system embodiments comprise a substrate of high thermal conductivity, a solid state light emitting device, an electric circuit, and an electric dielectric. The device has a die and a connection point to the die with a low thermal resistance. The connection point is in contact with the substrate. The electric circuit is electrically connected to the light emitting device, and separated from the substrate by the electrical dielectric. Various system embodiments comprise at least four color sources; and a controller configured to calculate a solution to form a target color using the color sources when the target is outside of a gamut formed by the color sources. The controller is configured to find an equivalent target color with reduced saturation.

Abstract translation: 各种系统实施例包括高导热性的基板，固态发光器件，电路和电介质。 该器件具有模具和与模具的连接点，具有低热阻。 连接点与基板接触。 电路电连接到发光器件，并通过电介质与衬底分离。 各种系统实施例包括至少四个颜色源; 以及控制器，其被配置为当所述目标在由所述颜色源形成的色域之外时，使用所述颜色源计算形成目标颜色的解。 控制器被配置为以饱和度降低来找到等效的目标颜色。

公开(公告)号：US07827679B1

公开(公告)日：2010-11-09

申请号：US11407812

申请日：2006-04-20

Applicant: Rati M. Patel ,  Roy English

Inventor： Rati M. Patel ,  Roy English

IPC: H05K3/36

CPC classification number: H05K1/0204 ,  H05K3/0061 ,  H05K3/064 ,  H05K2201/09054 ,  H05K2203/0369 ,  Y10T29/49126 ,  Y10T29/49155

Abstract: A thermal management circuit board comprises a heat sink, at least one insulating layer and at least one electronic circuit. The heat sink comprises a heat conducting material having tooling holes disposed therethrough and raised portions disposed on at least one surface thereof. The raised portions of the heat sink provide mounting surfaces for heat producing electronic components on a plane above a chemically etched surface of the heat sink. The electronic circuit comprises a prepreg and a circuit material wherein the circuit material is laminated to the prepreg, has a photoresist laid thereupon with at least one circuit image printed thereupon. The photoresist is then developed and the circuit material is chemically etched to define a circuit trace of the electronic circuit. The insulating layer comprises a thermally and electrically resistant material and has apertures disposed therethrough corresponding in size and shape to the raised portions of the heat sink. The circuit trace has an upper surface for receiving surface mount electronic components thereupon and the electronic circuit also has apertures disposed therethrough corresponding in size and location to the raised portions of the heat sink. The insulating layer, the electronic circuit and the heat sink are laminated together with heat and pressure with the raised portions disposed through the apertures wherein the plane of the mounting surfaces of the heat sink is on the same plane as the upper surface of the circuit trace of the electronic circuit.

Abstract translation: 热管理电路板包括散热器，至少一个绝缘层和至少一个电子电路。 散热器包括导热材料，其具有穿过其设置的工具孔和设置在其至少一个表面上的凸起部分。 散热器的凸起部分提供用于在散热器的化学蚀刻表面上方的平面上产生电子部件的安装表面。 电子电路包括预浸料和电路材料，其中电路材料层压到预浸料上，具有在其上印刷至少一个电路图像的光致抗蚀剂。 然后显影光致抗蚀剂，并且电化学蚀刻电路材料以限定电子电路的电路迹线。 绝缘层包括耐热和电阻的材料，并且具有穿过其对应于尺寸和形状的孔到散热器的凸起部分。 电路迹线具有用于接收表面安装电子部件的上表面，并且电子电路还具有穿过其对应于尺寸和位置对应于散热器的凸起部分的孔。 绝缘层，电子电路和散热器通过热和压力层压在一起，凸起部分设置穿过孔，其中散热器的安装表面的平面位于与电路迹线的上表面相同的平面上 的电子电路。

公开(公告)号：US20100218985A1

公开(公告)日：2010-09-02

申请号：US12702616

申请日：2010-02-09

Applicant: Takuya KOUYA

Inventor： Takuya KOUYA

IPC: H05K1/18 ,  H05K1/11 ,  B05D5/12

CPC classification number: H05K1/0204 ,  H01L23/142 ,  H01L24/16 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/29339 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/157 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/30111 ,  H05K1/021 ,  H05K3/4682 ,  H05K2201/09054 ,  Y10T428/24917 ,  H01L2924/0715 ,  H01L2924/0665 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01004 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: An integrated circuit mounted board includes a printed wiring board and an integrated circuit bare chip mounted on the printed wiring board. The printed wiring board includes a metal base, an insulating member made of an insulating material and disposed on the metal base, and a wiring pattern disposed on the insulating member. The wiring pattern includes an electrode part to which the integrated circuit bare chip is electrically coupled. The insulating member includes an under region being opposite to the electrode part. The metal base includes a metal substrate and a metal portion protruding from the metal substrate. The metal portion is buried in the under region of the insulating member.

Abstract translation: 集成电路安装板包括安装在印刷线路板上的印刷线路板和集成电路裸芯片。 印刷布线板包括金属基底，由绝缘材料制成并设置在金属基底上的绝缘构件和布置在绝缘构件上的布线图案。 布线图案包括集成电路裸芯片电耦合到的电极部分。 绝缘构件包括与电极部相对的下部区域。 金属基底包括金属基底和从金属基底突出的金属部分。 金属部分埋在绝缘部件的下部区域。

公开(公告)号：US20100193830A1

公开(公告)日：2010-08-05

申请号：US12758040

申请日：2010-04-12

Applicant: Charles W.C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

Inventor： Charles W.C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

IPC: H01L33/48 ,  H01L33/64

CPC classification number: H01L21/486 ,  H01L23/3677 ,  H01L23/49575 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/19041 ,  H05K1/0204 ,  H05K3/0061 ,  H05K3/386 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2201/10969 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and first and second adhesives. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The heat spreader includes a post and a base. The post extends upwardly from the base through an opening in the first adhesive, and the base extends laterally from the post. The first adhesive extends between the base and the conductive trace and the second adhesive extends between the post and the conductive trace. The conductive trace provides signal routing between a pad and a terminal.

Abstract translation: 半导体芯片组件包括半导体器件，散热器，导电迹线以及第一和第二粘合剂。 半导体器件电连接到导电迹线并热连接到散热器。 散热器包括一个柱子和一个底座。 柱从基部穿过第一粘合剂中的开口向上延伸，并且基部从柱横向延伸。 第一粘合剂在基部和导电迹线之间延伸，并且第二粘合剂在柱和导电迹线之间延伸。 导电迹线提供焊盘和端子之间的信号路由。

公开(公告)号：US20100190297A1

公开(公告)日：2010-07-29

申请号：US12714494

申请日：2010-02-28

Applicant: Charles W.C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

Inventor： Charles W.C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

IPC: H01L21/50 ,  H01L21/60

CPC classification number: H01L21/486 ,  H01L21/4882 ,  H01L23/3677 ,  H01L24/45 ,  H01L24/48 ,  H01L33/483 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15153 ,  H01L2924/16152 ,  H01L2924/19041 ,  H05K1/0204 ,  H05K1/021 ,  H05K1/182 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/09745 ,  H05K2201/10106 ,  H01L2224/05599

Abstract: A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a substrate on the adhesive including aligning the post with an aperture in the substrate, then flowing the adhesive into and upward in a gap located in the aperture between the post and the substrate, solidifying the adhesive, then etching the post to form a cavity in the post, then mounting a semiconductor device on the post, wherein a heat spreader includes the post and the base and the semiconductor device extends into the cavity, electrically connecting the semiconductor device to the substrate and thermally connecting the semiconductor device to the heat spreader.

Abstract translation: 制造半导体芯片组件的方法包括提供柱和基座，将粘合剂安装在基座上，包括将柱插入粘合剂中的开口中，将基底安装在粘合剂上，包括使柱与基底中的孔对准， 然后将粘合剂在位于柱和基底之间的孔中的间隙中向上流动，固化粘合剂，然后蚀刻柱以在柱中形成空腔，然后将半导体器件安装在柱上，其中散热器 包括柱和基部，并且半导体器件延伸到空腔中，将半导体器件电连接到衬底并将半导体器件热连接到散热器。

公开(公告)号：US20100163921A1

公开(公告)日：2010-07-01

申请号：US12721551

申请日：2010-03-10

Applicant: Charles W.C. Lin ,  Chia-Chung Wang

Inventor： Charles W.C. Lin ,  Chia-Chung Wang

IPC: H01L33/00

CPC classification number: H05K1/0204 ,  F21K9/00 ,  H01L21/486 ,  H01L23/3677 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/0061 ,  H05K3/386 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The heat spreader is aluminum and includes a post and a base. The post extends upwardly from the base into an opening in the adhesive, and the base extends laterally from the post. The adhesive extends between the post and the conductive trace and between the base and the conductive trace. The conductive trace includes a silver coating and a copper core and provides signal routing between a pad and a terminal.

Abstract translation: 半导体芯片组件包括半导体器件，散热器，导电迹线和粘合剂。 半导体器件电连接到导电迹线并热连接到散热器。 散热器是铝，包括一个柱子和一个基座。 柱从基部向上延伸到粘合剂中的开口中，并且基部从柱横向延伸。 粘合剂在柱和导电迹线之间以及基部和导电迹线之间延伸。 导电迹线包括银涂层和铜芯，并且在焊盘和端子之间提供信号路由。