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    Method of forming vertical traces on printed circuit board
    104.
    发明授权
    Method of forming vertical traces on printed circuit board 失效
    在印刷电路板上形成垂直走线的方法

    公开(公告)号：US4543715A

    公开(公告)日：1985-10-01

    申请号：US470885

    申请日：1983-02-28

    Applicant: Ralph E. Iadarola ,  Warren F. Strassle ,  Gene W. Russo

    Inventor： Ralph E. Iadarola ,  Warren F. Strassle ,  Gene W. Russo

    IPC: H05K3/00 ,  H05K3/40 ,  H05K3/42 ,  H01K3/10

    CPC classification number: H05K3/403 ,  H05K3/429 ,  H05K2201/09181 ,  H05K2201/09645 ,  H05K3/0047 ,  Y10T29/49165

    Abstract: A multilayer printed circuit board (10) is provided with vertical circuit traces (51-54) which are readily accessible by mechanical means, by first creating vias at the locations of the vertical circuit traces (51-54). An opening (59) is then bored in a manner that the perimeter of the opening (59) intercepts the vias. The remaining plating material on the vias forms the vertical circuit traces (51-54), which are thereby established along the perimeter of the opening (59).This technique utilizes procedures which are readily adaptable to present multilayer printed circuit board manufacturing techniques and which effect a low cost and reliable connection. Furthermore, the vertical circuit traces (51-54) are readily accessible for mechanical broaching and can be formed in a relatively high-density configuration.

    Abstract translation: 多层印刷电路板（10）设置有垂直电路迹线（51-54），其可以通过机械装置容易地接近，首先在垂直电路迹线（51-54）的位置处产生通孔。 然后以开口（59）的周边截取通孔的方式使开口（59）钻孔。 通孔上的剩余电镀材料形成垂直电路迹线（51-54），由此沿着开口（59）的周边建立。 该技术利用易于适应于呈现多层印刷电路板制造技术并且实现低成本和可靠连接的方法。 此外，垂直电路迹线（51-54）对于机械拉削是容易接近的，并且可以以相对高密度的结构形成。

    Method of fabricating an electronic circuit including an aperture through the substrate thereof
    105.
    发明授权
    Method of fabricating an electronic circuit including an aperture through the substrate thereof 失效
    一种电子电路的制造方法，该电子电路包括通过其基板的孔

    公开(公告)号：US4520561A

    公开(公告)日：1985-06-04

    申请号：US562244

    申请日：1983-12-16

    Applicant: Richard Brown

    Inventor： Richard Brown

    IPC: H05K3/36 ,  H01L23/13 ,  H05K1/03 ,  H05K1/14 ,  H05K3/40 ,  H05K3/34

    CPC classification number: H05K1/142 ,  H01L23/13 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K2201/09181 ,  H05K3/403 ,  Y10T29/49126 ,  Y10T29/49144

    Abstract: An electronic circuit including a substrate with an aperture therethrough is manufactured by cutting one or more slots in an edge of a slab of substrate, metalizing the slotted edge of the substrate and metalizing a mating edge of a mating substrate, securing together the metalized edges of the slotted substrate and mating substrate to create an aperture through the substrate from an upper surface to a lower surface thereof and creating a printed circuit pattern on one of the upper and lower surfaces of the combined substrate and metalizing the other surface of the combined substrate including a connection to the metalized edges.

    Abstract translation: 包括具有穿过其中的孔的基板的电子电路通过切割基板平板的边缘中的一个或多个槽而进行制造，使基板的开槽边缘金属化并金属化配合基板的配合边缘，将金属化边缘固定在一起 开槽衬底和匹配衬底以从上表面到下表面产生通过衬底的孔，并在组合衬底的上表面和下表面之一上形成印刷电路图案，并使组合衬底的另一表面金属化，包括 与金属化边缘的连接。

    Planar-faced electrode for ink jet printer and method of manufacture
    106.
    发明授权
    Planar-faced electrode for ink jet printer and method of manufacture 失效
    用于喷墨打印机的平面电极及其制造方法

    公开(公告)号：US4223321A

    公开(公告)日：1980-09-16

    申请号：US34710

    申请日：1979-04-30

    Applicant: E. J. Doyle Kenworthy

    Inventor： E. J. Doyle Kenworthy

    IPC: B41J2/085 ,  B41J2/09 ,  G06K15/10 ,  H05K1/09 ,  H05K3/04 ,  H05K3/34 ,  H05K3/40 ,  G01D15/18

    CPC classification number: B41J2/085 ,  H05K3/403 ,  H05K1/095 ,  H05K2201/09181 ,  H05K2201/10984 ,  H05K3/045 ,  H05K3/3442 ,  H05K3/4069 ,  Y10T29/49155

    Abstract: A planar charge plate having individual charge electrodes uniformly spaced along one face thereof is provided by cutting grooves into the edge of a blank nonconductive charge plate support structure. The surfaces of the structure, including grooves and lands, are metallized and printed circuit leads are formed leading from the grooves. The grooves are filled with an electrically conductive material such as solder, and then the front face of the structure is lapped to remove excess solder and metal plating from the lands to form the completed planar-faced structure.

    Abstract translation: 具有沿其一个面均匀间隔开的各个电荷电极的平面电荷板通过切割凹槽进入空白非导电充电板支撑结构的边缘来提供。 结构的表面，包括凹槽和焊盘，被金属化，印刷电路引线从槽形成。 凹槽中填充有诸如焊料的导电材料，然后研磨该结构的前表面以从多个焊盘上除去多余的焊料和金属电镀以形成完整的平面面结构。

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