公开(公告)号：US09390862B2

公开(公告)日：2016-07-12

申请号：US14275469

申请日：2014-05-12

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Byeong Cheol Moon ,  Jae Hoon Lee ,  Myeong Gi Kim ,  Jin Woo Hahn ,  Soo Hwan Son

IPC: H01G4/40 ,  H01G4/30 ,  H01G4/12 ,  H01G4/012 ,  H05K1/18 ,  H01F27/28 ,  H01F27/29 ,  H01F27/24 ,  H05K1/11 ,  H01G2/06 ,  H01G4/248 ,  H01F27/40

CPC classification number: H01G4/40 ,  H01F27/292 ,  H01F27/40 ,  H01G2/065 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232 ,  H01G4/248 ,  H01G4/30 ,  H05K1/111 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/1003 ,  Y02P70/611

Abstract: A composite electronic component may include: a composite body having a capacitor and an inductor coupled to each other therein; an input terminal disposed on a first end surface of the composite body; output terminals including a first output terminal disposed on a second end surface of the composite body and a second output terminal disposed on a lower surface of the capacitor of the composite body; and a ground terminal disposed on the lower surface of the capacitor of the composite body. The capacitor may be coupled to a side surface of the inductor.

Abstract translation: 复合电子部件可以包括：具有彼此耦合的电容器和电感器的复合体; 输入端子，设置在复合体的第一端面上; 输出端子，包括设置在复合体的第二端面上的第一输出端子和设置在复合体的电容器的下表面上的第二输出端子; 以及设置在复合体的电容器的下表面上的接地端子。 电容器可以耦合到电感器的侧表面。

公开(公告)号：US09338891B2

公开(公告)日：2016-05-10

申请号：US14713064

申请日：2015-05-15

Applicant: IBIDEN CO., LTD.

Inventor： Toyotaka Shimabe ,  Ryuichiro Tominaga

IPC: H05K1/18 ,  H05K1/03 ,  H05K1/11 ,  H05K1/02

CPC classification number: H05K1/183 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/50 ,  H01L2224/16227 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/3511 ,  H05K1/0298 ,  H05K1/0313 ,  H05K1/115 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/0145 ,  H05K2201/09854 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10219 ,  H05K2201/10636 ,  H05K2203/1469 ,  Y02P70/611 ,  H01L2924/00

Abstract: A printed wiring board includes a core substrate having a cavity, multiple electronic components accommodated in the cavity, and a build-up layer formed on the substrate and including an insulating interlayer such that the interlayer is covering the cavity. The components include a first component, second component and third component, the core substrate has a first projection structure partitioning the first and second components in the cavity and a second projection structure partitioning the second and third components in the cavity, and the cavity and the first and second structures are formed in the substrate such that T1

Abstract translation: 印刷电路板包括具有空腔的芯基板，容纳在空腔中的多个电子元件，以及形成在基板上并包括绝缘夹层的堆积层，使得中间层覆盖空腔。 所述部件包括第一部件，第二部件和第三部件，所述芯基板具有分隔所述空腔中的所述第一和第二部件的第一突起结构以及将所述腔体中的第二和第三部件分隔开的第二突起结构， 在基板上形成第一和第二结构，使得T1

公开(公告)号：US20160126008A1

公开(公告)日：2016-05-05

申请号：US14991111

申请日：2016-01-08

Applicant: Ferric Inc.

Inventor： Noah Andrew Sturcken

IPC: H01F27/28 ,  H01F41/04 ,  H01F27/24 ,  H01F41/02

CPC classification number: H05K1/181 ,  H01F27/24 ,  H01F27/2804 ,  H01F41/02 ,  H01F41/041 ,  H05K1/0233 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/115 ,  H05K1/165 ,  H05K2201/086 ,  H05K2201/0929 ,  H05K2201/1003 ,  Y02P70/611 ,  Y10T29/4913

Abstract: An inductor is integrated into a multilevel wiring network of a semiconductor integrated circuit. The inductor includes a planar magnetic core and a conductive winding. The conductive winding turns around in generally spiral manner on the outside of the planar magnetic core. The conductive winding is piecewise constructed of wire segments and of VIAs. The wire segments pertain to at least two wiring planes and the VIAs are interconnecting the at least two wiring planes. Methods for such integration, and for fabricating laminated planar magnetic cores are also presented.

公开(公告)号：US09287034B2

公开(公告)日：2016-03-15

申请号：US13729106

申请日：2012-12-28

Applicant: IBIDEN CO., LTD.

Inventor： Yasuhiko Mano ,  Kazuhiro Yoshikawa ,  Takashi Kariya

IPC: H05K1/18 ,  H01F27/28 ,  H01F17/00 ,  H05K1/16 ,  H05K3/46

CPC classification number: H01F27/2804 ,  H01F17/0013 ,  H01F2017/002 ,  H01F2017/0066 ,  H05K1/162 ,  H05K1/165 ,  H05K1/18 ,  H05K1/185 ,  H05K3/4602 ,  H05K3/4682 ,  H05K2201/086 ,  H05K2201/1003 ,  H05K2203/0191 ,  H05K2203/1469

Abstract: A printed wiring board has a core base having an opening portion, an inductor component accommodated in the opening portion, and a filler resin filling gap between the component and a side wall of the opening portion. The component has a support layer, a first conductive pattern on the support, an interlayer insulation layer on the support and first pattern, a second conductive pattern on the insulation layer, and a via conductor in the insulation layer and connecting the first and second patterns, the insulation layer includes a magnetic layer and a resin layer covering the magnetic layer, the magnetic layer includes magnetic material and resin material and has a first hole, the insulation layer has a second hole penetrating through the resin layer such that the second hole passes through the first hole and extends to the first pattern, and the via conductor is formed in the second hole.

Abstract translation: 印刷电路板具有：具有开口部的芯基部，容纳在开口部的电感器部，以及所述部件与所述开口部的侧壁之间的填充树脂填充间隙。 所述部件具有支撑层，支撑体上的第一导电图案，支撑件上的层间绝缘层和第一图案，绝缘层上的第二导电图案，以及绝缘层中的通孔导体，并连接第一和第二图案 所述绝缘层包括磁性层和覆盖所述磁性层的树脂层，所述磁性层包括磁性材料和树脂材料，并且具有第一孔，所述绝缘层具有穿过所述树脂层的第二孔，使得所述第二孔通过 通过第一孔延伸到第一图案，并且通孔导体形成在第二孔中。

公开(公告)号：US20160050760A1

公开(公告)日：2016-02-18

申请号：US14781964

申请日：2014-03-27

Applicant: ROHM CO., LTD.

Inventor： Hiroshi TAMAGAWA ,  Koichi NIINO ,  Eiji NUKAGA ,  Keishi WATANABE

IPC: H05K1/18 ,  H01C1/14 ,  H01G4/228 ,  H05K1/11 ,  H05K5/02

CPC classification number: H05K1/181 ,  H01C1/012 ,  H01C1/14 ,  H01G2/065 ,  H01G4/228 ,  H01G4/40 ,  H05K1/11 ,  H05K3/3442 ,  H05K5/02 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003

Abstract: The composite chip component includes: plurality of chip elements which are disposed so as to be mutually spaced apart upon a common substrate, and which have mutually different functions; and a pair of electrodes which, in each of the chip elements, are formed on the surface of the substrate. As a result, it is possible to reduce the bond area (footprint) for the mounting substrate, and therefore, it is possible to provide a composite chip component capable of achieving efficiency of mounting operation.

Abstract translation: 复合芯片部件包括：多个芯片元件，其设置成在公共基板上相互间隔开，并且具有相互不同的功能; 以及在每个芯片元件中形成在基板的表面上的一对电极。 结果，可以减少安装基板的接合面积（占地面积），因此，可以提供能够实现安装操作效率的复合芯片部件。

公开(公告)号：US09265158B2

公开(公告)日：2016-02-16

申请号：US13360201

申请日：2012-01-27

Applicant: Yasuhiko Mano ,  Shinobu Kato ,  Takashi Kariya

Inventor： Yasuhiko Mano ,  Shinobu Kato ,  Takashi Kariya

IPC: H05K3/46 ,  H05K1/18 ,  H01F17/00 ,  H05K3/00

CPC classification number: H05K3/4602 ,  H01F17/0033 ,  H01F2017/004 ,  H01L2224/16227 ,  H01L2924/15311 ,  H01L2924/3511 ,  H05K1/185 ,  H05K3/0032 ,  H05K2201/1003 ,  H05K2203/1469 ,  H05K2203/1572 ,  Y10T29/4913

Abstract: A printed wiring board includes a core substrate having a cavity and having first and second surfaces, an inductor component accommodated in the cavity, a filler resin filling a gap formed between the substrate and component in the cavity, and a buildup layer formed on the first surface of the substrate and the component. The component has a coil layer, a second insulation layer formed on the coil layer, an electrode formed on the substance layer, and a via conductor formed in the substance layer and connecting the coil layer and the electrode, the component is accommodated in the cavity such that the electrode faces the first surface of the substrate, and the buildup layer includes an interlayer insulation layer formed on the first surface of the substrate and the component, a conductive layer formed on the insulation layer, and a connection via conductor connecting the conductive layer and electrode.

Abstract translation: 一种印刷电路板包括具有空腔并具有第一和第二表面的芯基板，容纳在空腔中的电感器部件，填充在基板和空腔中的部件之间形成的间隙的填充树脂，以及形成在第一 基板表面和部件。 该部件具有线圈层，形成在线圈层上的第二绝缘层，形成在物质层上的电极和形成在物质层中并连接线圈层和电极的通孔导体，该部件容纳在腔体 使得电极面对衬底的第一表面，并且积聚层包括形成在衬底的第一表面上的层间绝缘层和构件，形成在绝缘层上的导电层，以及连接导体 层和电极。

公开(公告)号：US09253872B2

公开(公告)日：2016-02-02

申请号：US13790070

申请日：2013-03-08

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hyon K. Lee ,  Daniel P. Brennan ,  Richard Paul Cormier

IPC: H05K7/00 ,  H05K1/02 ,  H01F5/04 ,  H01F17/04 ,  H01F27/28

CPC classification number: H05K1/0216 ,  H01F5/04 ,  H01F17/043 ,  H01F27/2852 ,  H05K1/0263 ,  H05K2201/1003 ,  H05K2201/10272

Abstract: An inductor assembly includes an inductor body including an inductor core and a mounting bracket that includes a first leg, a second leg, and a third leg. A portion of the mounting bracket passes through the inductor body, at least one of the first leg and the second leg of the mounting bracket is arranged to be mounted on a substrate, and the third leg of the mounting bracket is arranged to be mounted on an electrical component mounted on the substrate.

Abstract translation: 电感器组件包括电感器体，其包括电感器芯和包括第一腿，第二腿和第三腿的安装支架。 安装支架的一部分穿过电感器本体，安装支架的第一支腿和第二支腿中的至少一个被布置成安装在基板上，并且安装支架的第三支腿被安装在 安装在基板上的电气部件。

公开(公告)号：US09198301B2

公开(公告)日：2015-11-24

申请号：US13119041

申请日：2009-09-18

Applicant: Paul Fathauer

Inventor： Paul Fathauer

IPC: H05K1/00 ,  H05K3/34 ,  H05K1/11 ,  H05K3/42

CPC classification number: H05K1/115 ,  F16K31/02 ,  H05K1/119 ,  H05K1/18 ,  H05K3/3447 ,  H05K3/42 ,  H05K2201/09854 ,  H05K2201/1003 ,  H05K2201/10303 ,  H05K2201/10818 ,  Y10T29/49002

Abstract: A printed circuit assembly (PCA) that provides for a method of rebuilding an electrically operated automatic transmission solenoid module. The PCA allows for a repairable yet rugged interconnection of several solenoids that reside within the span of the module assembly.

Abstract translation: 一种印刷电路组件（PCA），其提供重建电动自动变速器螺线管模块的方法。 PCA允许驻留在模块组件的跨度内的几个螺线管的可修复但坚固的互连。

公开(公告)号：US20150296625A1

公开(公告)日：2015-10-15

申请号：US14438666

申请日：2013-05-09

Applicant: LG INNOTEK CO., LTD.

Inventor： Won Suk JUNG ,  Kyu Won LEE ,  Yun Ho AN ,  Woo Young LEE

IPC: H05K1/18 ,  H05K1/03 ,  H05K1/11 ,  H05K1/02

CPC classification number: H05K1/186 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/3135 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/2402 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/82039 ,  H01L2224/83005 ,  H01L2224/8314 ,  H01L2224/83191 ,  H01L2224/92144 ,  H01L2224/97 ,  H01L2924/15787 ,  H01L2924/15788 ,  H05K1/0298 ,  H05K1/0366 ,  H05K1/115 ,  H05K1/185 ,  H05K3/305 ,  H05K3/4602 ,  H05K2201/0195 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10984 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2224/82

Abstract: Provided is a printed circuit board including: an insulating layer; electronic devices embedded, in the insulating layer; and an adhesive layer for fixing the electronic devices.

Abstract translation: 提供一种印刷电路板，包括：绝缘层; 电子器件嵌入绝缘层; 以及用于固定电子设备的粘合剂层。

公开(公告)号：US20150213960A1

公开(公告)日：2015-07-30

申请号：US14275469

申请日：2014-05-12

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Byeong Cheol Moon ,  Jae Hoon Lee ,  Myeong Gi Kim ,  Jin Woo Hahn ,  Soo Hwan Son

IPC: H01G4/40 ,  H01G4/30 ,  H01G4/12 ,  H01G4/012 ,  H05K1/18 ,  H01F27/28 ,  H01F27/29 ,  H01F27/24 ,  H05K1/11 ,  H01G2/06 ,  H01G4/248

CPC classification number: H01G4/40 ,  H01F27/292 ,  H01F27/40 ,  H01G2/065 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232 ,  H01G4/248 ,  H01G4/30 ,  H05K1/111 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/1003 ,  Y02P70/611

Abstract: A composite electronic component may include: a composite body having a capacitor and an inductor coupled to each other therein; an input terminal disposed on a first end surface of the composite body; output terminals including a first output terminal disposed on a second end surface of the composite body and a second output terminal disposed on a lower surface of the capacitor of the composite body; and a ground terminal disposed on the lower surface of the capacitor of the composite body. The capacitor may be coupled to a side surface of the inductor.

Abstract translation: 复合电子部件可以包括：具有彼此耦合的电容器和电感器的复合体; 输入端子，设置在复合体的第一端面上; 输出端子，包括设置在复合体的第二端面上的第一输出端子和设置在复合体的电容器的下表面上的第二输出端子; 以及设置在复合体的电容器的下表面上的接地端子。 电容器可以耦合到电感器的侧表面。