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1.发明授权公开(公告)号：US09514876B2
公开(公告)日：2016-12-06
申请号：US14603822
申请日：2015-01-23
Applicant: IBIDEN Co., Ltd.
Inventor： Yasuhiko Mano , Kazuhiro Yoshikawa , Haruhiko Morita
CPC classification number: H01F27/2804 , H01F27/24 , H01F41/041 , H01F2027/2809 , Y10T29/4902
Abstract: A printed wiring board includes an insulation layer having a first penetrating hole penetrating through the insulation layer, a magnetic core structure including a magnetic material filled in the first penetrating hole through the insulation layer such that the magnetic core structure including a first magnetic body layer formed in the first penetrating hole is formed through the insulation layer, and a conductor layer formed on the insulation layer and having an inductor pattern such that the inductor pattern is surrounding a circumference of the magnetic core structure. The magnetic core structure and the inductor pattern of the conductor layer form an inductor device.
Abstract translation: 印刷布线板包括具有穿过绝缘层的第一穿透孔的绝缘层，包括填充在穿过绝缘层的第一穿透孔中的磁性材料的磁芯结构，使得包括形成第一磁性体层的磁芯结构 在第一贯通孔中形成绝缘层，导体层形成在绝缘层上并具有使电感器图案围绕磁芯结构的圆周的电感图案。 导体层的磁芯结构和电感器图案形成电感器件。
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2.发明授权公开(公告)号：US09357660B2
公开(公告)日：2016-05-31
申请号：US14067080
申请日：2013-10-30
Applicant: IBIDEN CO., LTD.
Inventor： Kazuhiro Yoshikawa , Liyi Chen , Toshiki Furutani
IPC: H05K1/18 , H05K3/46 , H01L23/498 , H01L23/538 , H05K1/16
CPC classification number: H05K3/4644 , H01L23/49822 , H01L23/49827 , H01L23/5383 , H01L23/5384 , H01L23/5389 , H01L2924/0002 , H01L2924/3511 , H05K1/165 , H05K1/185 , H05K3/4602 , H05K3/4694 , H05K2201/10015 , H05K2201/10636 , H05K2203/1469 , Y02P70/611 , Y10T29/4913 , H01L2924/00
Abstract: A printed wiring board includes a core substrate having opening, an electronic component device accommodated in the opening of the substrate and including inductor and passive components, a wiring structure connecting the inductor and passive components in the electronic device, a filler resin body filling space formed between the substrate and electronic device in the opening of the substrate, a first buildup layer including a first interlayer insulation layer on first surface of the substrate, a first conductive layer on the first insulation layer, and a first via conductor in the first insulation layer, and a second buildup layer including a second interlayer insulation layer on second surface of the substrate on the opposite side of the first surface of the substrate, a second conductive layer on the second insulation layer, and a second via conductor in the second insulation layer.
Abstract translation: 印刷电路板包括具有开口的芯基板，容纳在基板的开口中并包括电感器和无源部件的电子部件装置，连接电子装置中的电感器和无源部件的布线结构，填充树脂体填充空间 在衬底和电子器件之间的衬底的开口中的第一堆积层，在衬底的第一表面上包括第一层间绝缘层，第一绝缘层上的第一导电层和第一绝缘层中的第一通孔导体 以及第二累积层，其在基板的第一表面的相反侧的第二表面上包括第二层间绝缘层，第二绝缘层上的第二导电层和第二绝缘层中的第二通孔导体 。
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公开(公告)号：US20140225701A1
公开(公告)日：2014-08-14
申请号：US14178600
申请日：2014-02-12
Applicant: IBIDEN CO., LTD.
Inventor： Haruhiko MORITA , Yasuhiko Mano , Kazuhiro Yoshikawa
IPC: H01F17/00
CPC classification number: H01F17/0013 , H01F2017/0066
Abstract: A printed wiring board includes a first core substrate having an opening portion, an inductor component accommodated in the opening portion of the first core substrate, a first buildup layer formed on a first surface of the first core substrate and the inductor component, and a second buildup layer formed on a second surface of the first core substrate and the inductor component on the opposite side with respect to the first surface of the first core substrate. The inductor component has a second core substrate, a buildup layer formed on a surface of the second core substrate and a coil layer formed on the buildup layer, and the second buildup layer has a coil layer and a via conductor connecting the coil layer in the second buildup layer and the coil layer formed on the buildup layer in the inductor component.
Abstract translation: 印刷电路板包括具有开口部分的第一芯基板，容纳在第一芯基板的开口部分中的电感器部件，形成在第一芯基板和电感器部件的第一表面上的第一累积层， 形成在第一芯基板的第二表面上的电感器部件和相对于第一芯基板的第一表面的相反侧的电感器部件。 电感器部件具有第二芯基板，形成在第二芯基板的表面上的积累层和形成在积层上的线圈层，第二累积层具有线圈层和通孔导体， 第二积累层和形成在电感器部件中的积聚层上的线圈层。
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4.发明申请公开(公告)号：US20140159851A1
公开(公告)日：2014-06-12
申请号：US14103010
申请日：2013-12-11
Applicant: IBIDEN CO., LTD.
Inventor： Yasuhiko MANO , Kazuhiro Yoshikawa , Toshimasa Yano , Takashi Kariya
CPC classification number: H01F27/2804 , H01F17/0013 , H01F17/0033 , H01F41/02 , H01F41/046 , H01F2017/002 , Y10T29/4902
Abstract: An inductor device has a core base, and an inductor structure including a first conductive pattern formed on a first surface side of the core base, a second conductive pattern formed on a second surface side of the core base on the opposite side with respect to the first surface side of the core base, and a through-hole conductor formed through the core base such that the through-hole conductor is connecting the first conductive pattern and the second conductive pattern. The core base includes a magnetic material layer including a magnetic material, and the magnetic material layer of the core base is positioned adjacent to at least a portion of the periphery of the inductor structure.
Abstract translation: 电感器件具有芯基部和电感结构，该电感器结构包括形成在芯基部的第一表面侧上的第一导电图案，第二导电图案形成在芯基部的相对于第二表面侧的第二表面侧上 芯基部的第一表面侧和通过芯基部形成的通孔导体，使得通孔导体连接第一导电图案和第二导电图案。 芯基部包括包括磁性材料的磁性材料层，并且芯基部的磁性材料层位于电感器结构的周边的至少一部分附近。
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5.发明授权公开(公告)号：US09693458B2
公开(公告)日：2017-06-27
申请号：US14509354
申请日：2014-10-08
Applicant: IBIDEN CO., LTD.
Inventor： Kazuhiro Yoshikawa , Takashi Kariya
CPC classification number: H05K1/144 , H01L21/4853 , H01L23/00 , H01L23/49811 , H01L23/49822 , H01L23/49827 , H01L24/16 , H01L25/105 , H01L2224/131 , H01L2224/13111 , H01L2224/16237 , H01L2224/81192 , H01L2224/81801 , H01L2924/12042 , H01L2924/15311 , H01L2924/1533 , H01L2924/181 , H01L2924/18161 , H05K3/4007 , H05K2203/054 , H01L2924/00 , H01L2924/00014 , H01L2924/014
Abstract: A method for manufacturing a printed wiring board includes forming a resin layer on an interlayer layer such that the resin layer has first openings exposing circuits in central portion and second openings exposing circuits in peripheral portion of the interlayer layer, forming solder bumps on the circuits in the first openings, forming a plating resist over the bumps and resin layer such that the resist has openings having diameters greater than the second openings and exposing the second openings, forming a seed layer on the resist, in the openings and on the circuits through the second openings, applying electrolytic plating on the resist such that electrolytic plating fills the openings and forms a plated film on the resist and metal posts in the openings, etching the plating such that the plated film is removed and recesses are formed on end surfaces of the posts, and removing the resist.
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Patent Agency Ranking
6.发明授权公开(公告)号：US09257217B2
公开(公告)日：2016-02-09
申请号：US13954431
申请日：2013-07-30
Applicant: IBIDEN CO., LTD.
Inventor： Kazuhiro Yoshikawa , Yasuhiko Mano
CPC classification number: H01F5/003 , H01F5/00 , H01F17/0013 , H01F41/32 , H01F2017/0066 , H05K1/165 , H05K1/185 , H05K2201/083 , H05K2201/09672 , Y10T29/4902
Abstract: An inductor element has a support layer, a first conductive layer formed on the support layer and having a first inductor pattern and a first pad at one end of the first inductor pattern, a first insulation layer formed on the support layer and first conductive layer and including a magnetic material layer and a resin layer, a second conductive layer formed on the first insulation layer and having a second inductor pattern and a second pad at one end of the second inductor pattern, and a via conductor formed through the first insulation layer and connecting the first and second conductive layers. The magnetic material layer is covering at least part of the first inductor pattern, the resin layer is covering the first pad and has opening exposing at least part of the first pad, and the via conductor is formed in the opening of the first insulation layer.
Abstract translation: 电感器元件具有支撑层，形成在支撑层上并具有第一电感器图案的第一导电层和位于第一电感器图案的一端的第一焊盘，形成在支撑层和第一导电层上的第一绝缘层和 包括磁性材料层和树脂层，形成在第一绝缘层上并具有第二电感器图案的第二导电层和在第二电感器图案的一端的第二焊盘，以及通过第一绝缘层形成的通孔导体和 连接第一和第二导电层。 磁性材料层覆盖第一电感器图案的至少一部分，树脂层覆盖第一焊盘，并且具有暴露第一焊盘的至少一部分的开口，并且通孔导体形成在第一绝缘层的开口中。
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7.发明授权Printed wiring board, method for manufacturing printed wiring board and package-on-package 有权印刷电路板，印刷电路板的制造方法和封装的封装公开(公告)号：US09578745B2
公开(公告)日：2017-02-21
申请号：US14504842
申请日：2014-10-02
Applicant: IBIDEN CO., LTD.
Inventor： Kazuhiro Yoshikawa , Takashi Kariya
IPC: H05K1/03 , H05K1/11 , H05K1/18 , H05K3/02 , H05K3/04 , H05K3/18 , H01L25/00 , H05K3/40 , H05K1/02 , H05K1/14 , H05K3/24 , H05K3/28 , H05K3/34 , H05K3/46
CPC classification number: H05K1/113 , H01L25/00 , H01L2224/16225 , H01L2924/15311 , H05K1/0271 , H05K1/112 , H05K1/144 , H05K1/183 , H05K3/244 , H05K3/282 , H05K3/3473 , H05K3/4007 , H05K3/4602 , H05K2201/0347 , H05K2201/096 , H05K2201/09854 , H05K2203/0392 , H05K2203/0577 , H05K2203/0723 , H05K2203/1383 , Y10T29/49156
Abstract: A method for manufacturing a printed wiring board includes forming a removable layer over first pads in central portion of an interlayer insulation layer to mount IC chip, forming on the interlayer and removable layers a resin insulation layer having openings exposing second pads in peripheral portion of the interlayer layer to connect second substrate, forming a seed layer on the resin layer, in the openings and on the second pads, forming on the seed layer a plating resist having resist openings exposing the openings of the resin layer with diameters greater than the openings, filling the resist openings with electrolytic plating such that metal posts are formed in the resist openings, removing the resist, removing the seed layer exposed on the resin layer, and removing the removable layer and the resin layer on the removable layer such that cavity exposing the first pads is formed in the resin layer.
Abstract translation: 一种制造印刷电路板的方法，包括在层间绝缘层的中心部分的第一焊盘上形成可移除层以安装IC芯片，在中间层和可去除层上形成具有露出第二焊盘的开口的树脂绝缘层， 层间层，用于连接第二基板，在树脂层上，在开口和第二焊盘上形成种子层，在种子层上形成具有抗蚀剂开口的电镀抗蚀剂，该抗蚀剂开口露出具有大于开口的直径的树脂层的开口， 通过电解电镀填充抗蚀剂开口，使得在抗蚀剂开口中形成金属柱，去除抗蚀剂，除去暴露在树脂层上的种子层，以及去除可去除层上的可去除层和树脂层， 在树脂层中形成第一焊盘。
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8.发明授权Printed wiring board, method for manufacturing printed wiring board, and package-on-package 有权印刷电路板，印刷电路板的制造方法和封装的封装公开(公告)号：US09572256B2
公开(公告)日：2017-02-14
申请号：US14633864
申请日：2015-02-27
Applicant: IBIDEN CO., LTD.
Inventor： Kazuhiro Yoshikawa , Takashi Kariya
IPC: H05K7/10 , H05K7/12 , H05K1/11 , H01L23/00 , H05K3/28 , H05K3/40 , H05K1/14 , H05K3/46 , H05K3/34
CPC classification number: H05K1/111 , H01L23/49822 , H01L23/49827 , H01L24/09 , H01L24/16 , H01L24/81 , H01L2224/13101 , H01L2224/16225 , H01L2224/81192 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/18161 , H05K1/144 , H05K3/28 , H05K3/3436 , H05K3/3452 , H05K3/3478 , H05K3/4007 , H05K3/4644 , H05K2201/042 , H05K2201/068 , H05K2201/09745 , H05K2201/098 , H05K2201/10977 , H05K2201/2072 , H05K2203/0353 , H05K2203/0361 , H05K2203/0405 , H05K2203/0594 , H05K2203/0597 , H05K2203/1184 , Y02P70/611 , H01L2924/00 , H01L2924/00012 , H01L2924/014 , H01L2924/00014
Abstract: A printed wiring board includes an uppermost insulating layer, first pads positioned to mount an IC chip on the insulating layer, second pads positioned to mount a second printed wiring board on the insulating layer, metal posts formed on the second pads, respectively, such that the metal posts mount the second board over the chip, and a solder resist layer formed on the uppermost insulating layer and having first and second openings such that the first openings exposes the first pads and that the second openings exposes the second pads, respectively. The metal posts are formed such that each of the metal posts has a diameter which is smaller than a diameter of each of the second opening portions, and the second opening portions are formed such that the diameter of each of the second opening portions is smaller than a diameter of each of the second pads.
Abstract translation: 印刷布线板包括最上层的绝缘层，位于绝缘层上的IC芯片安装的第一焊盘，位于绝缘层上的第二印刷电路板安装的第二焊盘，分别形成在第二焊盘上的金属柱，使得 金属柱将第二板安装在芯片上，以及形成在最上层绝缘层上并具有第一和第二开口的阻焊层，使得第一开口暴露第一焊盘，并且第二开口分别暴露第二焊盘。 金属柱形成为使得每个金属柱的直径小于每个第二开口部的直径，并且第二开口部形成为使得每个第二开口部的直径小于 每个第二垫的直径。
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公开(公告)号：US09478343B2
公开(公告)日：2016-10-25
申请号：US14178600
申请日：2014-02-12
Applicant: IBIDEN CO., LTD.
Inventor： Haruhiko Morita , Yasuhiko Mano , Kazuhiro Yoshikawa
CPC classification number: H01F17/0013 , H01F2017/0066
Abstract: A printed wiring board includes a first core substrate having an opening portion, an inductor component accommodated in the opening portion of the first core substrate, a first buildup layer formed on a first surface of the first core substrate and the inductor component, and a second buildup layer formed on a second surface of the first core substrate and the inductor component on the opposite side with respect to the first surface of the first core substrate. The inductor component has a second core substrate, a buildup layer formed on a surface of the second core substrate and a coil layer formed on the buildup layer, and the second buildup layer has a coil layer and a via conductor connecting the coil layer in the second buildup layer and the coil layer formed on the buildup layer in the inductor component.
Abstract translation: 印刷电路板包括具有开口部分的第一芯基板，容纳在第一芯基板的开口部分中的电感器部件，形成在第一芯基板和电感器部件的第一表面上的第一累积层， 形成在第一芯基板的第二表面上的电感器部件和相对于第一芯基板的第一表面的相反侧的电感器部件。 电感器部件具有第二芯基板，形成在第二芯基板的表面上的积累层和形成在积层上的线圈层，第二累积层具有线圈层和通孔导体， 第二积累层和形成在电感器部件中的积聚层上的线圈层。
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公开(公告)号：US09307645B2
公开(公告)日：2016-04-05
申请号：US13938637
申请日：2013-07-10
Applicant: IBIDEN Co., Ltd.
Inventor： Yasuhiko Mano , Kazuhiro Yoshikawa , Takashi Kariya
CPC classification number: H05K1/165 , H01L2924/3511 , H05K1/0233 , H05K1/186 , H05K3/0032 , H05K3/30 , H05K3/4676 , H05K3/4697 , H05K2201/0209 , Y10T29/4913
Abstract: A printed wiring board includes a core substrate, a first buildup layer formed on a first surface of the core substrate and including an insulation layer and a conductive layer, a second buildup layer formed on a second surface of the core substrate on the opposite side with respect to the first buildup layer and including an insulation layer and a conductive layer, and an inductor device positioned in the second buildup layer and including a resin insulation layer and a coil layer formed on the resin insulation layer. The second buildup layer has a cavity in which the inductor device is accommodated.
Abstract translation: 印刷电路板包括芯基板，形成在芯基板的第一表面上并包括绝缘层和导电层的第一累积层，在相对侧的芯基板的第二表面上形成的第二累积层， 相对于第一累积层，并且包括绝缘层和导电层，以及位于第二堆积层中的电感器件，并且包括树脂绝缘层和形成在树脂绝缘层上的线圈层。 第二累积层具有容纳电感器装置的空腔。
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