公开(公告)号：US20060030080A1

公开(公告)日：2006-02-09

申请号：US10913868

申请日：2004-08-06

Applicant: Paul Hsueh ,  Jim Ni ,  Sun-Teck See ,  Kuang-Yu Wang

Inventor： Paul Hsueh ,  Jim Ni ,  Sun-Teck See ,  Kuang-Yu Wang

IPC: H01L21/50 ,  H01L21/48 ,  H01L21/44

CPC classification number: G11C5/04 ,  G11C2029/4402 ,  H01L23/5388 ,  H01L25/50 ,  H01L2924/0002 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/284 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/10053 ,  H05K2201/10446 ,  H05K2203/1316 ,  H01L2924/00

Abstract: A removable Flash integrated memory module card has a plastic shell and an integral Flash memory module. On the backside of the card, there are exposed contact pads. When the card is inserted into a card-hosting device, the card can communicate with the device through the exposed pads. The manufacturing method includes manufacturing of the memory module and utilizing plastic molding techniques for making the card outer body. The method involves preparing the substrate, mounting the components, testing the module, preparing the molding device, and molding the card body.

Abstract translation: 可拆卸的Flash集成内存模块卡具有塑料外壳和集成闪存模块。 在卡的背面，有暴露的接触垫。 当卡插入卡主机设备时，卡可以通过暴露的焊盘与设备通信。 该制造方法包括制造存储器模块并利用塑料模制技术制造卡外壳。 该方法包括准备基板，安装部件，测试模块，准备模制装置和模制卡体。

公开(公告)号：US06975200B2

公开(公告)日：2005-12-13

申请号：US11034272

申请日：2005-01-12

Applicant: Fumiaki Nakao ,  Yasuo Yamashita ,  Teruo Kiyomiya ,  Tetsuya Suzuki ,  Masayuki Inagaki ,  Mikio Kitaoka

Inventor： Fumiaki Nakao ,  Yasuo Yamashita ,  Teruo Kiyomiya ,  Tetsuya Suzuki ,  Masayuki Inagaki ,  Mikio Kitaoka

IPC: H01L25/00 ,  H01F19/08 ,  H01F27/28 ,  H01F27/29 ,  H01L23/552 ,  H02M3/00 ,  H02M3/155 ,  H02M3/158 ,  H05K1/18 ,  H05K3/34 ,  H01F5/00

CPC classification number: H01L23/552 ,  H01F19/08 ,  H01F27/28 ,  H01F27/292 ,  H01L23/49811 ,  H01L23/645 ,  H01L25/16 ,  H01L2224/16 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/13091 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/3025 ,  H02M3/00 ,  H02M3/158 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/0212 ,  H05K2201/1003 ,  H05K2201/10053 ,  H05K2201/10234 ,  H05K2201/10515 ,  H05K2201/10636 ,  H05K2201/10674 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A surface-mount microconverter is formed by mounting a microinductor chip and a semiconductor integrated circuit chip on a circuit board. Stud terminals are arranged on the circuit board and the microinductor chip is supported on the stud terminals, and the microinductor chip and the semiconductor integrated circuit chip are superposed on the circuit board. The microconverter has an improved ability and is small and thin. The microconverter includes an effective laminated magnetic-core inductor. The inductor comprises a helical coil formed by uniting alternately superposed insulating magnetic layers and conductive pattern layers, and an annular closed magnetic path formed by the insulating magnetic layers and defining a magnetic field created by the coil. The inductor can be miniaturized in a thin chip, and a wide range in which magnetic flux density varies linearly can be secured by balancing a closed magnetic path for a magnetic field created by the coil.

Abstract translation: 表面安装微型转换器通过将微型电感芯片和半导体集成电路芯片安装在电路板上而形成。 螺柱端子布置在电路板上，微电感芯片支撑在螺柱端子上，微电感芯片和半导体集成电路芯片叠加在电路板上。 微型转换器具有改进的能力，体积小而薄。 微型转换器包括有效的层叠磁芯电感器。 电感器包括通过将交替叠置的绝缘磁性层和导电图案层相互组合形成的螺旋线圈和由绝缘磁性层形成并限定由线圈产生的磁场的环形闭合磁路。 电感器可以在薄的芯片中小型化，并且可以通过平衡由线圈产生的磁场的闭合磁路来确保磁通密度线性变化的宽范围。

公开(公告)号：US20050225341A1

公开(公告)日：2005-10-13

申请号：US11138920

申请日：2005-05-26

Applicant: Phillip Byrd

Inventor： Phillip Byrd

IPC: G01R1/073 ,  H05K1/00 ,  G01R31/02

CPC classification number: G01R1/06766 ,  G01R1/07371 ,  G01R3/00 ,  G01R31/2886 ,  H05K1/0293 ,  H05K1/09 ,  H05K1/167 ,  H05K2201/068 ,  H05K2201/10053 ,  H05K2201/10181 ,  Y10T29/49004 ,  Y10T29/49005 ,  Y10T29/49107 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49204

Abstract: Probe cards are configured with protective circuitry suitable for use in electrical testing of semiconductor dice without damage to the probe cards. Protective fuses are provided in electrical communication with conductive traces and probe elements (e.g., probe needles) of a probe card. The fuses may be active or passive fuses and are preferably self-resetting, repairable, and/or replaceable. Typically, the fuses will be interposed in, or located adjacent to, conductive traces residing over a surface of the probe card. Methods of fabricating a probe card are provided, as well as various probe card configurations. A semiconductor die testing system using the probe card is also provided.

Abstract translation: 探头卡配置有适用于半导体裸片电气测试的保护电路，而不会损坏探针卡。 提供保护性熔丝与探针卡的导电迹线和探针元件（例如探针）电连通。 保险丝可以是有源或被动保险丝，并且优选地是自复位，可修复和/或可更换的。 通常，保险丝将被置于位于探针卡的表面上方的导电迹线中或邻近其上。 提供制造探针卡的方法以及各种探针卡配置。 还提供了使用探针卡的半导体管芯测试系统。

公开(公告)号：US06949709B1

公开(公告)日：2005-09-27

申请号：US10019504

申请日：2000-06-30

Applicant: Didier Barat ,  Andrew Nash

Inventor： Didier Barat ,  Andrew Nash

IPC: B60R7/06 ,  B29C70/70 ,  B29C70/72 ,  B60K37/00 ,  B60R16/02 ,  H05K1/11 ,  H05K3/28 ,  B29C45/14

CPC classification number: B29C70/70 ,  B29C70/72 ,  B60K37/00 ,  B60R16/0215 ,  H05K1/118 ,  H05K3/284 ,  H05K2201/091 ,  H05K2201/10053 ,  H05K2203/1327

Abstract: The invention concerns a method for making a dashboard subassembly comprising electrical and/or electronic components (1) connected to conductors (2) and attached to a rigid support (3). The invention is characterized in that it consists in: providing a flexible mat (4) provided with said conductors (2); mounting said components (1) on said mat (4), connected to said electrical conductors (2); rigidizing said mat (4) by overmoulding it with a material designed to form said support (3). The invention also concerns a dashboard subassembly, in particular a motor vehicle dashboard console, obtained by said method.

Abstract translation: 本发明涉及一种用于制造仪表板子组件的方法，其包括连接到导体（2）并连接到刚性支撑件（3）的电和/或电子部件（1）。 本发明的特征在于：提供设置有所述导体（2）的柔性垫（4）; 将所述部件（1）安装在所述垫（4）上，连接到所述电导体（2）; 通过用设计成形成所述支撑件（3）的材料将其模制成硬化所述垫（4）。 本发明还涉及通过所述方法获得的仪表板子组件，特别是机动车辆仪表板控制台。

公开(公告)号：US06931500B2

公开(公告)日：2005-08-16

申请号：US10615325

申请日：2003-07-07

Applicant: Dean A. Klein

Inventor： Dean A. Klein

IPC: G06F13/40 ,  G11C7/10 ,  G11C8/00 ,  H05K1/18 ,  G06F12/00

CPC classification number: G11C7/1048 ,  G06F13/4077 ,  G11C2207/002 ,  H05K1/181 ,  H05K2201/09236 ,  H05K2201/10053 ,  H05K2201/10159 ,  Y02P70/611

Abstract: Data bus capacitance is reduced by decoupling unaccessed memory circuits from a data bus during data transfers to or from other memory circuits.

公开(公告)号：US20050159024A1

公开(公告)日：2005-07-21

申请号：US11037059

申请日：2005-01-19

Applicant: Hiroaki Yamada ,  Akemi Maebashi

Inventor： Hiroaki Yamada ,  Akemi Maebashi

IPC: H05K7/06 ,  H01H50/04 ,  H01H50/14 ,  H01R12/00 ,  H02G3/16 ,  H05K1/14 ,  H05K3/20

CPC classification number: H05K1/144 ,  H01H50/04 ,  H01H50/14 ,  H01H2050/049 ,  H05K3/202 ,  H05K2201/10053

Abstract: Two circuit boards 1′ and 3′ are disposed vertically, and the relays 2 and 4, provided respectively on the circuit boards, are arranged side by side in a vertical or a horizontal direction. Each of the circuit boards 1′ and 3′ include a bus bar circuit board, and terminals 7 of each relay 2, 4 are connected to bus bars 6, 13 of the corresponding bus bar circuit board. Part of the bus bars 6, 13 of each of the circuit boards 1′, 3′ project outwardly from the circuit board to provide terminal portions 6c, 13c for forming a connector. The bus bars 6 on the one circuit board 1′ and/or the bus bars 13 on the other circuit board 3′ are covered with respective insulating sub-boards 9 and 14 to be insulated respectively from the second relays 4 and the first relays 2.

Abstract translation: 两个电路板1'和3'垂直设置，并且分别设置在电路板上的继电器2和4在垂直或水平方向上并排布置。 电路板1'和3'中的每一个包括母线电路板，并且每个继电器2,4的端子7连接到相应母线电路板的母线6,13。 每个电路板1'，3'的汇流条6,13的一部分从电路板向外突出，以提供用于形成连接器的端子部分6c，13c。 一个电路板1'上的汇流条6和/或另一个电路板3'上的母线13被相应的绝缘子板9和14覆盖，以分别与第二继电器4和第一继电器2 。

公开(公告)号：US20050134420A1

公开(公告)日：2005-06-23

申请号：US11034272

申请日：2005-01-12

Applicant: Fumiaki Nakao ,  Yasuo Yamashita ,  Teruo Kiyomiya ,  Tetsuya Suzuki ,  Masayuki Inagaki ,  Mikio Kitaoka

Inventor： Fumiaki Nakao ,  Yasuo Yamashita ,  Teruo Kiyomiya ,  Tetsuya Suzuki ,  Masayuki Inagaki ,  Mikio Kitaoka

IPC: H01L25/00 ,  H01F19/08 ,  H01F27/28 ,  H01F27/29 ,  H01L23/552 ,  H02M3/00 ,  H02M3/155 ,  H02M3/158 ,  H05K1/18 ,  H05K3/34 ,  H01F27/24

CPC classification number: H01L23/552 ,  H01F19/08 ,  H01F27/28 ,  H01F27/292 ,  H01L23/49811 ,  H01L23/645 ,  H01L25/16 ,  H01L2224/16 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/13091 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/3025 ,  H02M3/00 ,  H02M3/158 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/0212 ,  H05K2201/1003 ,  H05K2201/10053 ,  H05K2201/10234 ,  H05K2201/10515 ,  H05K2201/10636 ,  H05K2201/10674 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A surface-mount microconverter is formed by mounting a microinductor chip and a semiconductor integrated circuit chip on a circuit board. Stud terminals are arranged on the circuit board and the microinductor chip is supported on the stud terminals, and the microinductor chip and the semiconductor integrated circuit chip are superposed on the circuit board. The microconverter has an improved ability and is small and thin. The microconverter includes an effective laminated magnetic-core inductor. The inductor comprises a helical coil formed by uniting alternately superposed insulating magnetic layers and conductive pattern layers, and an annular closed magnetic path formed by the insulating magnetic layers and defining a magnetic field created by the coil. The inductor can be miniaturized in a thin chip, and a wide range in which magnetic flux density varies linearly can be secured by balancing a closed magnetic path for a magnetic field created by the coil.

公开(公告)号：US06897672B2

公开(公告)日：2005-05-24

申请号：US10327469

申请日：2002-12-20

Applicant: Phillip E. Byrd

Inventor： Phillip E. Byrd

IPC: G01R1/073 ,  H05K1/00 ,  G01R31/26

CPC classification number: G01R1/06766 ,  G01R1/07371 ,  G01R3/00 ,  G01R31/2886 ,  H05K1/0293 ,  H05K1/09 ,  H05K1/167 ,  H05K2201/068 ,  H05K2201/10053 ,  H05K2201/10181 ,  Y10T29/49004 ,  Y10T29/49005 ,  Y10T29/49107 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49204

Abstract: Probe cards are configured with protective circuitry suitable for use in electrical testing of semiconductor dice without damage to the probe cards. Protective fuses are provided in electrical communication with conductive traces and probe elements (e.g., probe needles) of a probe card. The fuses may be active or passive fuses and are preferably self-resetting, repairable, and/or replaceable. Typically, the fuses will be interposed in, or located adjacent to, conductive traces residing over a surface of the probe card. Methods of fabricating a probe card are provided, as well as various probe card configurations. A semiconductor die testing system using the probe card is also provided.

Abstract translation: 探头卡配置有适用于半导体裸片电气测试的保护电路，而不会损坏探针卡。 提供保护性熔丝与探针卡的导电迹线和探针元件（例如探针）电连通。 保险丝可以是有源或被动保险丝，并且优选地是自复位，可修复和/或可更换的。 通常，保险丝将被置于位于探针卡的表面上方的导电迹线中或邻近其上。 提供制造探针卡的方法以及各种探针卡配置。 还提供了使用探针卡的半导体管芯测试系统。

公开(公告)号：US06885278B2

公开(公告)日：2005-04-26

申请号：US10624379

申请日：2003-07-22

Applicant: Fumiaki Nakao ,  Yasuo Yamashita ,  Teruo Kiyomiya ,  Tetsuya Suzuki ,  Masayuki Inagaki ,  Mikio Kitaoka

Inventor： Fumiaki Nakao ,  Yasuo Yamashita ,  Teruo Kiyomiya ,  Tetsuya Suzuki ,  Masayuki Inagaki ,  Mikio Kitaoka

IPC: H01L25/00 ,  H01F19/08 ,  H01F27/28 ,  H01F27/29 ,  H01L23/552 ,  H02M3/00 ,  H02M3/155 ,  H02M3/158 ,  H05K1/18 ,  H05K3/34 ,  H01F5/00

CPC classification number: H01L23/552 ,  H01F19/08 ,  H01F27/28 ,  H01F27/292 ,  H01L23/49811 ,  H01L23/645 ,  H01L25/16 ,  H01L2224/16 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/13091 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/3025 ,  H02M3/00 ,  H02M3/158 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/0212 ,  H05K2201/1003 ,  H05K2201/10053 ,  H05K2201/10234 ,  H05K2201/10515 ,  H05K2201/10636 ,  H05K2201/10674 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A surface-mount microconverter is formed by mounting a microinductor chip and a semiconductor integrated circuit chip on a circuit board. Stud terminals are arranged on the circuit board and the microinductor chip is supported on the stud terminals, and the microinductor chip and the semiconductor integrated circuit chip are superposed on the circuit board. The microconverter has an improved ability and is small and thin. The microconverter includes an effective laminated magnetic-core inductor. The inductor comprises a helical coil formed by uniting alternately superposed insulating magnetic layers and conductive pattern layers, and an annular closed magnetic path formed by the insulating magnetic layers and defining a magnetic field created by the coil. The inductor can be miniaturized in a thin chip, and a wide range in which magnetic flux density varies linearly can be secured by balancing a closed magnetic path for a magnetic field created by the coil.

公开(公告)号：US20040155021A1

公开(公告)日：2004-08-12

申请号：US10360703

申请日：2003-02-06

Inventor： David G. Norton ,  Jeffrey J. Kuss

IPC: H05B001/00

CPC classification number: H05B3/34 ,  H05K1/0212 ,  H05K1/189 ,  H05K5/0213 ,  H05K2201/10053 ,  H05K2201/10189 ,  H05K2201/10196 ,  H05K2203/165

Abstract: Disclosed is a flexible printed circuit board for use in a control handle. The circuit board includes resistive heating elements for heating electrical components in the circuit to limit the formation of frost and condensation on the components.

Abstract translation: 公开了一种用于控制手柄的柔性印刷电路板。 电路板包括用于加热电路中的电气部件的电阻加热元件，以限制结霜和部件上的冷凝。