公开(公告)号：US20180338371A1

公开(公告)日：2018-11-22

申请号：US15768444

申请日：2017-05-19

Applicant: SHENZHEN JBT SMART LIGHTING CO., LTD.

Inventor： Wenbin ZHANG ,  Huiping CHEN ,  Guangli GUO ,  Xin HUANG ,  Zhiguang PENG

IPC: H05B37/02 ,  H05K1/18 ,  H05K7/14 ,  H02M3/10 ,  H05B33/08 ,  H04W4/80

CPC classification number: H05B37/0272 ,  H02M3/10 ,  H04W4/80 ,  H05B33/0857 ,  H05B37/02 ,  H05K1/181 ,  H05K7/1427 ,  H05K2201/10015 ,  H05K2201/10053 ,  H05K2201/10098 ,  H05K2201/10121 ,  H05K2201/10174 ,  H05K2201/10325

Abstract: A Bluetooth controller (100) comprises: a controller housing assembly (1); a control module (2), disposed in the controller housing assembly (1); a Bluetooth mesh module (3), used for receiving an external control signal by means of Bluetooth and coupled to the control module (2); a Bluetooth control circuit (5), used for controlling the light emitting unit and coupled to the control module (2); and a Bluetooth power supply module (4), used for supplying a direct current to the Bluetooth control circuit (5) and coupled to the Bluetooth control circuit (5). By means of a Bluetooth wireless control technology, remote brightness adjustment, color adjustment, timing, splendid colors with music, profiles and other functions are implemented by the controller, thereby bringing convenience to the life of the people, and increasing the variety and the enjoyment of smart home lighting.

公开(公告)号：US20180218669A1

公开(公告)日：2018-08-02

申请号：US15937581

申请日：2018-03-27

Applicant: LightnTec GmbH & Co. KG

Inventor： Manuel Huebner ,  Florian Kall

IPC: G09G3/32 ,  H05K1/18 ,  H05K1/02 ,  H05K3/34

CPC classification number: G09G3/32 ,  G09G2320/0626 ,  G09G2380/02 ,  H05K1/0274 ,  H05K1/189 ,  H05K3/0011 ,  H05K3/341 ,  H05K3/3494 ,  H05K2201/0108 ,  H05K2201/0145 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2201/09781 ,  H05K2201/0979 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10128 ,  H05K2201/10151 ,  H05K2201/10174 ,  H05K2201/10522 ,  H05K2203/0143 ,  H05K2203/1545

Abstract: An illuminated display includes a plurality of illumination means, in particular a plurality of LEDs, which are arranged on a transparent base member. The transparent base member reduces visible light on average by a maximum of 40%. Preferably, the transparent base member is constructed in the form of a film, or in a further preferred manner in the form of a plastics material film. The illumination means are supplied with voltage by means of strip conductors. The strip conductors are electrically connected at one end preferably to a control unit and at the other end to at least one illumination means.

公开(公告)号：US20180211899A1

公开(公告)日：2018-07-26

申请号：US15880055

申请日：2018-01-25

Applicant: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Inventor： Mike MORIANZ ,  Gerald WEIS ,  Johannes STAHR

IPC: H01L23/367 ,  H01L23/538 ,  H01L23/00 ,  H01L25/07 ,  H01L21/48 ,  H05K1/02 ,  H05K1/18 ,  H05K3/30 ,  H05K3/46

CPC classification number: H01L23/3675 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/4871 ,  H01L23/36 ,  H01L23/367 ,  H01L23/3735 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L25/072 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/06181 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/214 ,  H01L2224/24226 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/82047 ,  H01L2924/12031 ,  H01L2924/12036 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1461 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H02M7/06 ,  H05K1/0203 ,  H05K1/185 ,  H05K3/30 ,  H05K3/4644 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/10174

Abstract: A component carrier has an interconnected stack with at least one electrically insulating layer structure and/or at least one electrically conductive layer structure, a component embedded in the stack and a diode, and at least one heat removal layer configured for removing heat from the diode and substantially fully covering a whole main surface of the component carrier.

公开(公告)号：US09871463B2

公开(公告)日：2018-01-16

申请号：US15165863

申请日：2016-05-26

Applicant: Delta Electronics Int'l (Singapore) Pte Ltd

Inventor： Yiu-Wai Lai ,  Da-Jung Chen

IPC: H02M7/00 ,  H05K1/11 ,  H05K1/18 ,  H05K1/02 ,  H01L23/367 ,  H01L23/373 ,  H01L23/48 ,  H05K7/20 ,  H01L25/18 ,  H01L23/36 ,  H01L23/538 ,  H01L23/00 ,  H01L25/11

CPC classification number: H02M7/003 ,  H01L23/36 ,  H01L23/3735 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/18 ,  H01L24/20 ,  H01L24/24 ,  H01L25/115 ,  H01L25/18 ,  H01L2224/04105 ,  H01L2224/18 ,  H01L2224/24137 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2924/15153 ,  H05K1/0206 ,  H05K1/0207 ,  H05K7/209 ,  H05K2201/066 ,  H05K2201/10053 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10416

Abstract: A power module includes a substrate, a first sub-module and a second sub-module. The substrate includes plural first conducting parts, plural second conducting parts and a third conducting part. The first sub-module is disposed on the substrate, and includes a first semiconductor switch, a first diode, a first electrode, a second electrode and a third electrode. The first electrode and the second electrode are electrically connected with the corresponding first conducting parts. The third electrode is electrically connected with the third conducting part. The second sub-module is disposed on the substrate, and includes a second semiconductor switch, a second diode, a fourth electrode, a fifth electrode and a sixth electrode. The fourth electrode and the fifth electrode are electrically connected with the corresponding second conducting parts. The sixth electrode is electrically connected with the third conducting part.

公开(公告)号：US09819146B2

公开(公告)日：2017-11-14

申请号：US14782980

申请日：2014-04-10

Applicant: BRIGHTLOOP

Inventor： Florent Liffran ,  Olivier Rabot

IPC: H03K3/57 ,  H01S5/042 ,  H05K1/18 ,  H05K1/02

CPC classification number: H01S5/0428 ,  H03K3/57 ,  H05K1/0243 ,  H05K1/181 ,  H05K2201/0792 ,  H05K2201/10015 ,  H05K2201/10174 ,  H05K2201/10446 ,  H05K2201/10545 ,  Y02P70/611

Abstract: The invention concerns a device for controlling at least one diode 2, the control device comprising an electrical card 4 comprising a printed circuit 5 on which the following are mounted: a diode 2, a front component 7 and a storage capacitor 9 connected in such a way as to form a circuit loop 17 extending substantially in a thickness of the electrical card 4.

公开(公告)号：US09762269B2

公开(公告)日：2017-09-12

申请号：US15346819

申请日：2016-11-09

Applicant: HARRIS CORPORATION

Inventor： John McIntyre ,  Kevin Dell ,  Christopher David Mackey ,  John Paul Shoots

IPC: H04B1/04 ,  H03K17/74 ,  H01L29/06 ,  H01L23/13

CPC classification number: H04B1/0483 ,  H01L23/13 ,  H01L23/66 ,  H01L29/06 ,  H01L29/0688 ,  H01L2924/1015 ,  H01P3/08 ,  H03K17/74 ,  H04B1/006 ,  H05K1/0243 ,  H05K3/30 ,  H05K2201/10098 ,  H05K2201/10174

Abstract: An RF communications device may include a circuit board having a dielectric layer and conductive traces, one of the conductive traces defining a transmission line. The RF communications device may also include an RF transmitter carried by the circuit board and coupled to the transmission line, and RF switching circuits, each RF switching circuit including a substrate having a tapered proximal end coupled to the transmission line, and a distal end extending outwardly on the convex side of the transmission line. Each RF switching circuit may include a series diode, and a shunt diode coupled to the series diode, the series diode extending from the tapered proximal end and across an interior of the substrate.

公开(公告)号：US09761569B2

公开(公告)日：2017-09-12

申请号：US14984092

申请日：2015-12-30

Applicant: FREESCALE SEMICONDUCTOR INC.

Inventor： Weng F. Yap

IPC: H01L23/495 ,  H01L25/16 ,  H01L23/12 ,  H01L23/00 ,  H05K1/18 ,  H05K1/02 ,  H01L21/56 ,  H01L23/538 ,  H01L25/10 ,  H01L23/31 ,  H01L25/065 ,  H01L25/18 ,  H01L23/498

CPC classification number: H01L25/16 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L23/12 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/49589 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/165 ,  H01L25/18 ,  H01L2224/12105 ,  H01L2224/24175 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2225/1029 ,  H01L2225/1035 ,  H01L2225/1064 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/1203 ,  H01L2924/12042 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/181 ,  H05K1/0284 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10174 ,  Y10T29/41 ,  Y10T29/49126 ,  Y10T29/49139 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/82 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Embodiments of a method for fabricating System-in-Packages (SiPs) are provided, as are embodiments of a SiP. In one embodiment, the method includes producing a first package including a first molded package body having a sidewall. A first leadframe is embedded within the first molded package body and having a first leadframe lead exposed through the sidewall. In certain implementations, a semiconductor die may also be encapsulated within the first molded package body. A Surface Mount Device (SMD) is mounted to the sidewall of the first molded package body such that a first terminal of the SMD is in ohmic contact with the first leadframe lead exposed through the sidewall.

公开(公告)号：US20170223835A1

公开(公告)日：2017-08-03

申请号：US15414602

申请日：2017-01-24

Applicant: CYNTEC CO., LTD.

Inventor： Chun Hsien Lu ,  Bau-Ru Lu ,  Kaipeng Chiang

IPC: H05K1/18 ,  H01F27/29

CPC classification number: H05K1/181 ,  H01F5/00 ,  H01F27/06 ,  H01F27/29 ,  H01F27/292 ,  H01F2027/065 ,  H01F2027/297 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/10174

Abstract: An electronic module is provided. The electronic module includes: a magnetic device having a magnetic body, electronic devices, and a substrate, wherein a first lead extends out from a first lateral surface and a second lead extends out from a second lateral surface opposite to the first lateral surface of the magnetic body and the substrate and the second lead of the magnetic device are located at a same lateral side of the magnetic body and the second lead is extended from the second lateral surface of the magnetic body to the substrate to electrically connect the magnetic device and the substrate.

公开(公告)号：US20170164472A1

公开(公告)日：2017-06-08

申请号：US15360573

申请日：2016-11-23

Applicant: ROHM CO., LTD.

Inventor： Katsuya MATSUURA ,  Hiroshi TAMAGAWA

IPC: H05K1/11 ,  H05K3/28 ,  H05K3/00 ,  H05K1/18

CPC classification number: H05K1/111 ,  H05K1/181 ,  H05K3/0023 ,  H05K3/28 ,  H05K3/287 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/09036 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: A mounting substrate includes a substrate, a connection electrode, which is formed on a front surface of the substrate and on which an electronic component is mounted via a conductive bonding material, a resist film, formed on the front surface of the substrate so as to cover a peripheral edge portion of the connection electrode, and a receiving portion, formed in the resist film so as to expose a portion of the peripheral edge portion of the connection electrode and arranged to receive an excess portion of the conductive bonding material.

公开(公告)号：US20170127540A1

公开(公告)日：2017-05-04

申请号：US15200006

申请日：2016-07-01

Applicant: Delta Electronics (Shanghai) Co., Ltd.

Inventor： Pei-Ai YOU ,  Gang LIU ,  Jin-Fa ZHANG

IPC: H05K5/00 ,  H05K5/04 ,  H02M1/44 ,  H05K7/14 ,  H05K9/00 ,  H02M7/00 ,  H05K7/20 ,  H05K1/18

CPC classification number: H05K5/0026 ,  B60L11/18 ,  H02M1/44 ,  H02M7/003 ,  H05K1/181 ,  H05K5/0004 ,  H05K5/04 ,  H05K7/1417 ,  H05K7/1432 ,  H05K7/20245 ,  H05K9/0007 ,  H05K2201/10174

Abstract: A power conversion device includes a casing, a structural plate, a converter module, an auxiliary circuit board module and a top cover. The casing includes a base plate and a side wall, and the base plate and the side wall form a chamber. The structural plate is located in the chamber. The converter module is located between the base plate and the structural plate. The auxiliary circuit board module is located at a side of the structural plate in the chamber away from the base plate, and is electrically connected with the converter module. The top cover seals the chamber.