公开(公告)号：US20060081065A1

公开(公告)日：2006-04-20

申请号：US11243309

申请日：2005-10-04

Applicant: Christ Heipp ,  Geoffrey Cochrane

Inventor： Christ Heipp ,  Geoffrey Cochrane

IPC: G01N3/02

CPC classification number: H05K1/144 ,  H01R12/52 ,  H01R12/714 ,  H01R13/24 ,  H05K3/325 ,  H05K2201/10151 ,  H05K2201/10265

Abstract: An interconnect subsystem having a sensor, at least one substrate, at least one contact assembly to said sensor and said substrate, and optionally a registration pin connected to said sensor and passing through said substrate. The contact assembly includes a guide tube, a spring within the guide tube, and a transmission tube having a contact surface and at least partially within the guide tube and forced outward by the spring, such that the contact surface contacts conductive pads on the substrate.

Abstract translation: 具有传感器，至少一个基板，至少一个接触组件到所述传感器和所述基板的互连子系统，以及可选地连接到所述传感器并通过所述基板的配准销。 接触组件包括引导管，引导管内的弹簧和具有接触表面并且至少部分地在引导管内并且被弹簧向外强制的传输管，使得接触表面接触基底上的导电焊盘。

公开(公告)号：US06978542B2

公开(公告)日：2005-12-27

申请号：US10402289

申请日：2003-03-28

Applicant: David J. Alcoe

Inventor： David J. Alcoe

IPC: H05K3/34 ,  H05K13/04 ,  H01R43/02

CPC classification number: H05K13/0465 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/10126 ,  H01L2924/01322 ,  H01L2924/09701 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/10265 ,  H05K2201/10977 ,  H05K2203/043 ,  H05K2203/0465 ,  H05K2203/306 ,  Y02P70/613 ,  Y10T29/49204 ,  Y10T29/49211 ,  Y10T29/49213 ,  H01L2924/00014

Abstract: An electronic package includes a substrate having a contact pad thereon, a reformable member such as a solder ball positioned on the contact pad, and an elastic member positioned around the reformable member. The elastic member exerts a girdling force on the reformable member so that when the reformable member is softened, the elastic member elongates the reformable member. This elongation accommodates thermal and other stresses between the foregoing substrate and another substrate joined at the free end of the reformable member. An apparatus is also provided for positioning the elastic member on and around the reformable member.

Abstract translation: 电子封装包括其上具有接触焊盘的衬底，位于接触焊盘上的诸如焊球的可重新构件，以及位于可重整构件周围的弹性构件。 弹性构件在可重整构件上施加环形力，使得当可重整构件软化时，弹性构件使可重整构件伸长。 该伸长率适应上述基底与在可重整构件的自由端连接的另一基底之间的热应力和其它应力。 还提供了一种用于将弹性构件定位在可重整构件上和周围的装置。

公开(公告)号：US06948942B1

公开(公告)日：2005-09-27

申请号：US10971078

申请日：2004-10-25

Applicant: Kuo-Hua Chih

Inventor： Kuo-Hua Chih

IPC: H01R12/04 ,  H01R12/22 ,  H01R13/24 ,  H01R29/00

CPC classification number: H01R12/7029 ,  H01R12/57 ,  H01R12/714 ,  H01R12/716 ,  H01R12/79 ,  H01R13/24 ,  H05K1/147 ,  H05K3/363 ,  H05K2201/0311 ,  H05K2201/10189 ,  H05K2201/10265 ,  H05K2201/1031 ,  Y02P70/611

Abstract: A board-to-board connector assembly is used to electrically connect a first circuit board and a second circuit board and has a receptacle connector and an engaging element assembled together. The receptacle connector includes an insulative housing and a plurality of conductive terminals received in the insulative housing. An engaging groove is defined in the receptacle connector and has the same shape as the engaging element for receiving the engaging element therein. The engaging element forms positioning portions thereon for guiding the receptacle connector to mate with a circuit board accurately and facilitating the terminals to contact electrodes on the circuit board firmly. The engaging element is firmly and accurately retained in the receptacle connector to assure reliable signal transmission between the first circuit board and the second circuit board. Simultaneously the overall height of the board-to-board connector assembly is effectively decreased.

Abstract translation: 板对板连接器组件用于电连接第一电路板和第二电路板，并具有插座连接器和组装在一起的接合元件。 插座连接器包括绝缘壳体和容纳在绝缘壳体中的多个导电端子。 接合槽限定在插座连接器中，并且具有与用于在其中容纳接合元件的接合元件相同的形状。 接合元件在其上形成定位部分，用于引导插座连接器以准确地与电路板匹配，并且便于端子牢固地接触电路板上的电极。 接合元件牢固而准确地保持在插座连接器中，以确保在第一电路板和第二电路板之间可靠的信号传输。 同时，板对板连接器组件的整体高度有效降低。

公开(公告)号：US20050064607A1

公开(公告)日：2005-03-24

申请号：US10980178

申请日：2004-11-04

Applicant: Brett Hamilton

Inventor： Brett Hamilton

IPC: H01L21/00 ,  H01L23/04 ,  H01L23/52 ,  H01L29/00 ,  H01L29/82 ,  H01L43/00 ,  H05K1/02 ,  H05K1/16 ,  H05K9/00

CPC classification number: H05K9/00 ,  H05K1/0233 ,  H05K1/165 ,  H05K2201/10265 ,  H05K2201/10689 ,  H05K2203/304 ,  Y10S438/953

Abstract: A magnetically shielded circuit board having a conductive solenoid to repel high speed charged particles away from an integrated circuit chip. The conductive solenoid is embedded in the circuit board, or located around the circuit board, or located within an integrated circuit package, the integrated circuit package have been connected to the circuit board. The conductive solenoid is used for conducting an electrical current, the electrical current forming a magnetic field. The magnetic field will repel high speed charged particles away from the integrated circuit chip, the integrated circuit chip being within the integrated circuit package. The circuit board can be used in a space vehicle.

Abstract translation: 一种具有导电螺线管的磁屏蔽电路板，用于将高速带电粒子排斥离开集成电路芯片。 导电螺线管嵌入在电路板中，或者位于电路板周围，或者位于集成电路封装内，集成电路封装已经连接到电路板。 导电螺线管用于传导电流，电流形成磁场。 磁场将排斥高速带电粒子远离集成电路芯片，集成电路芯片在集成电路封装内。 电路板可用于太空车。

公开(公告)号：US20040203262A1

公开(公告)日：2004-10-14

申请号：US10411175

申请日：2003-04-10

Applicant: FormFactor, Inc.

Inventor： Scott E. Lindsey ,  Charles A. Miller ,  David M. Royster ,  Stuart W. Wenzel

IPC: H01R012/00

CPC classification number: G01R1/06733 ,  G01R1/06711 ,  G01R1/06744 ,  G01R31/2884 ,  H01L21/4853 ,  H01L23/49811 ,  H01L2224/16 ,  H01L2924/00014 ,  H01R4/4863 ,  H01R12/57 ,  H01R13/035 ,  H01R13/2421 ,  H01R13/33 ,  H01R43/16 ,  H05K3/326 ,  H05K3/4007 ,  H05K3/4092 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/10265 ,  H05K2203/308 ,  H01L2224/0401

Abstract: A microelectronic spring contact for making electrical contact between a device and a mating substrate and method of making the same are disclosed. The spring contact has a compliant pad adhered to a substrate of the device and spaced apart from a terminal of the device. The compliant pad has a base adhered to the substrate, and side surfaces extending away from the substrate and tapering to a smaller end area distal from the substrate. A trace extends from the terminal of the device in a coil pattern over the compliant pad to its end area, forming a helix. At least a portion of the compliant pad end area is covered by the trace, and a portion of the trace that is over the compliant pad is supported by the compliant pad. In an alternative embodiment, the pad is removed to leave a freestanding helical contact.

Abstract translation: 公开了一种用于在器件和匹配衬底之间进行电接触的微电子弹簧触点及其制造方法。 弹簧触点具有粘附到装置的基板并与装置的端子间隔开的柔性衬垫。 柔性衬垫具有粘附到衬底的基底，以及远离衬底延伸的侧表面，并且逐渐变细到远离衬底的较小端部区域。 迹线从器件的端子以柔性衬垫的线圈图案延伸到其端部区域，形成螺旋线。 柔性焊盘端部区域的至少一部分被迹线覆盖，并且位于柔性焊盘上方的迹线的一部分由柔性焊盘支撑。 在替代实施例中，去除垫以留下独立的螺旋接触。

公开(公告)号：US20010000762A1

公开(公告)日：2001-05-03

申请号：US09751171

申请日：2000-12-29

Applicant: International Business Machines Corporation

Inventor： Barry Lee Shepherd

IPC: H01R012/00

CPC classification number: H01R12/7088 ,  H01R13/514 ,  H05K1/0263 ,  H05K3/325 ,  H05K2201/10265 ,  H05K2201/10272

Abstract: An electrical interface arrangement includes a buss bar having a longitudinal edge that is substantially smooth and free of conductive tabs. A conductive member is arranged adjacent to the longitudinal edge of the buss bar, and contacts the buss bar with at least 40 A-spots per inch, along substantially an entire length of the buss bar. A circuit board having a plurality of internal planes is provided, with at least one of the internal planes being an internal power plane, and with at least another one of the internal planes being an internal wiring plane having a plurality of conductive wirings. The circuit board further has an arrangement for electrically connecting the conductive member to the internal power plane without interfering with a placement of the conductive wirings, so that the circuit board and the buss bar are in electrical communication.

Abstract translation: 电接口装置包括具有基本上平滑且没有导电片的纵向边缘的总线。 导电构件布置成与母线的纵向边缘相邻，并且沿着母线的大致整个长度与每英寸具有至少40个A点的汇流条接触。 提供具有多个内部平面的电路板，其中至少一个内部平面是内部功率平面，并且至少另一个内部平面是具有多个导电布线的内部布线平面。 电路板还具有用于将导电构件电连接到内部电力平面而不干扰导电布线的布置的布置，使得电路板和母线处于电气连通状态。

公开(公告)号：US5244395A

公开(公告)日：1993-09-14

申请号：US921161

申请日：1992-07-29

Applicant: John A. DeSantis ,  Peter E. Albertson

Inventor： John A. DeSantis ,  Peter E. Albertson

IPC: H01R12/52 ,  H01R12/82 ,  H01R13/24 ,  H05K3/32 ,  H05K3/36

CPC classification number: H01R12/52 ,  H01R12/82 ,  H05K3/366 ,  H01R13/2414 ,  H05K2201/0314 ,  H05K2201/048 ,  H05K2201/09645 ,  H05K2201/10265 ,  H05K3/325

Abstract: A circuit interconnect system comprises a circuit pattern (22) on a rigid insulating sheet (17), forming a first circuit carrying substrate (12). A portion of the circuit pattern wraps around an edge of the insulating sheet and continues onto a vertical wall (20) of the sheet to provide a contact surface (24). An electrically conductive portion (16) of a second member (14) is mated to the first circuit carrying substrate by aligning the contact surface to the electrically conductive portion. An electrically conductive resilient material such as a conductive elastomer (35) or metal spring (35) provides electrical interconnection between the circuit pattern and the electrically conductive portion.

Abstract translation: 电路互连系统包括刚性绝缘片（17）上的电路图案（22），形成第一电路承载衬底（12）。 电路图案的一部分围绕绝缘片的边缘缠绕并且继续到片材的垂直壁（20）以提供接触表面（24）。 第二构件（14）的导电部分（16）通过将接触表面对准导电部分而与第一电路承载衬底配合。 诸如导电弹性体（35）或金属弹簧（35）的导电弹性材料提供电路图案和导电部分之间的电互连。

公开(公告)号：US4841633A

公开(公告)日：1989-06-27

申请号：US267290

申请日：1988-11-04

Applicant: Seiichi Kinugawa

Inventor： Seiichi Kinugawa

IPC: G06F15/02 ,  H01H11/04 ,  H01H13/702 ,  H05K1/11 ,  H05K1/18 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40

CPC classification number: H05K3/3442 ,  H01H13/702 ,  H05K1/0215 ,  H05K1/112 ,  H05K1/189 ,  H01H2207/014 ,  H01H2207/016 ,  H01H2239/008 ,  H01H2239/014 ,  H05K2201/0305 ,  H05K2201/0311 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/10265 ,  H05K2201/10636 ,  H05K2203/1572 ,  H05K3/325 ,  H05K3/4038 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49139 ,  Y10T29/49144 ,  Y10T29/49156

Abstract: Disclosed is a method of mounting electronic parts onto a single-sided printed wiring board, including the provision of a key contact pattern on the front surface of a substrate member having a plurality of through-holes; the provision of a conductive pattern covering these through-holes on the front surface of the substrate member; and the mounting of electronic parts in position relative to these through-holes from the rear surface of the substrate member.

Abstract translation: 公开了一种将电子部件安装到单面印刷电路板上的方法，包括在具有多个通孔的基板部件的前表面上设置键接触图案; 在基板构件的前表面上设置覆盖这些通孔的导电图案; 以及从基板构件的后表面相对于这些通孔安装电子部件。

公开(公告)号：US4759120A

公开(公告)日：1988-07-26

申请号：US869686

申请日：1986-05-30

Applicant: Elliot Bernstein

Inventor： Elliot Bernstein

IPC: H01F5/04 ,  H01F41/10 ,  H05K1/18 ,  H01F41/06 ,  H05K3/34

CPC classification number: H01F5/04 ,  H01F41/10 ,  H05K1/181 ,  H01F2005/046 ,  H05K2201/1003 ,  H05K2201/10265 ,  Y02P70/611 ,  Y10T29/49071 ,  Y10T29/49144

Abstract: A coil is wound either with insulated wire or space wound with uninsulated wire and subsequently coated with a solder resist or insulating material. If insulated wire is used, the insulation is removed from the wire either during or after winding at predetermined locations to match the location of connection pads in a conductive pattern on a substrate. The coil is appropriately aligned and laid down on the substrate and an attachment technique is used to form an electrical connection between the exposed areas of wire and connection pads on the substrate. Alternatively, uninsulated wire may be used, which is space wound and coated with a solder resist or insulating material. The uninsulated wire may either be masked prior to coating or the insulating material may be removed following coating to form exposed connection locations on the coil corresponding to the location of the connection pads on the substrate. An attachment technique is then used to form an electrical connection between the exposed areas of wire and the corresponding connection pads on the substrate.

Abstract translation: 线圈用绝缘电线缠绕或用未绝缘线缠绕的空间，随后涂覆有阻焊剂或绝缘材料。 如果使用绝缘电线，则在预定位置的绕组期间或之后将电绝缘线从导线上除去，以使基板上的导电图案中的连接焊盘的位置匹配。 线圈被适当地对准并放置在基板上，并且使用附接技术在导线的暴露区域和基板上的连接焊盘之间形成电连接。 或者，可以使用未绝缘的线，其被空间缠绕并涂覆有阻焊剂或绝缘材料。 未绝缘导线可以在涂覆之前被掩蔽，或者可以在涂覆之后去除绝缘材料，以在线圈上形成对应于衬底上的连接焊盘的位置的暴露的连接位置。 然后使用附接技术在导线的暴露区域和衬底上相应的连接焊盘之间形成电连接。

公开(公告)号：US3509270A

公开(公告)日：1970-04-28

申请号：US3509270D

申请日：1968-04-08

Applicant: NEY CO J M

Inventor： DUBE MILFORD J ,  YORGENSEN HARRY P

IPC: H01H9/02 ,  H01R4/48 ,  H01R12/51 ,  H04L25/06 ,  H05K3/02 ,  H05K3/38 ,  H05K3/40 ,  H05K1/04 ,  H05K3/06

CPC classification number: H01R12/526 ,  H01R4/4872 ,  H04L25/061 ,  H05K3/022 ,  H05K3/386 ,  H05K3/4046 ,  H05K2201/0355 ,  H05K2201/10265