公开(公告)号：US07378794B2

公开(公告)日：2008-05-27

申请号：US10948667

申请日：2004-09-24

Applicant: Myoung-Kon Kim

Inventor： Myoung-Kon Kim

IPC: H01J17/49 ,  H05K7/04 ,  H05K5/02 ,  H02B1/00

CPC classification number: H05K1/0215 ,  H01R4/34 ,  H01R4/66 ,  H05K3/325 ,  H05K2201/10295 ,  H05K2201/10386 ,  H05K2201/10401 ,  H05K2201/10409

Abstract: A coupling and grounding structure of a plasma display device for grounding a circuit board effectively, and fixing the circuit board stably. The plasma display device includes a plasma display panel having a display area, on which images are displayed; a chassis base coupled to a back surface of the plasma display panel; at least one circuit board, on which at least one electronic element for driving the plasma display panel is mounted, the circuit board having a conductive portion and at least one coupling hole to be coupled to the chassis base by a bolt member penetrating the coupling hole; and at least a conductive member which contacts the conductive portion and the bolt member in the coupling hole.

Abstract translation: 用于有效地接地电路板的等离子体显示装置的耦合和接地结构，并且稳定地固定电路板。 等离子体显示装置包括具有显示区域的等离子体显示面板，显示图像; 耦合到所述等离子体显示面板的后表面的底架; 至少一个电路板，其上安装有用于驱动等离子体显示面板的至少一个电子元件，所述电路板具有导电部分和至少一个耦合孔，以通过穿过所述耦合孔的螺栓构件联接到所述底架 ; 以及至少一个与所述连接孔中的导电部分和螺栓构件接触的导电构件。

公开(公告)号：US06370027B1

公开(公告)日：2002-04-09

申请号：US09925706

申请日：2001-08-10

Applicant: Shoji Koizumi ,  Hiroyuki Komatsu

Inventor： Shoji Koizumi ,  Hiroyuki Komatsu

IPC: H05H720

CPC classification number: H05K7/20509 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/10401 ,  H05K2201/10598 ,  H05K2203/1572

Abstract: A semiconductor module includes a circuit board provided with a plurality of attachment holes and semiconductor elements or semiconductor devices mounted on the circuit board and a pair of metallic plates. The circuit board is disposed, between the pair of metallic plates, in such a manner that spaces are defined between the circuit board and the pair of metallic plates for accommodating the semiconductor elements or semiconductor devices when the pair of metallic plates are attached to the circuit board. One of the metallic plates is provided at positions corresponding to the attachment holes with through holes and the other metallic plate is provided at positions corresponding to the attachment holes with tubular projections having a length larger than a sum of a thickness of the circuit board and a thickness of the one metallic plate. The tubular projections are inserted into the attachment holes and the through holes and tip ends of the tubular projections are enlarged to firmly attach the pair of metallic plates to the circuit board.

Abstract translation: 半导体模块包括设置有多个安装孔的电路板和安装在电路板上的半导体元件或半导体器件以及一对金属板。 电路板设置在一对金属板之间，使得当一对金属板附接到电路时，在电路板和一对金属板之间限定用于容纳半导体元件或半导体器件的空间 板。 金属板之一设置在与具有通孔的附接孔对应的位置处，另一个金属板设置在与安装孔相对应的位置，管状突起的长度大于电路板的厚度和 一块金属板的厚度。 管状突起插入到安装孔中，并且扩大了管状突起的通孔和末端，以将一对金属板牢固地连接到电路板。

公开(公告)号：US6084296A

公开(公告)日：2000-07-04

申请号：US112683

申请日：1998-07-09

Applicant: Gary M. Colello ,  Dennis E. Hartzell

Inventor： Gary M. Colello ,  Dennis E. Hartzell

IPC: H05K1/02 ,  H05K1/03 ,  H05K3/34 ,  H05K3/40 ,  H01L23/04 ,  H01L23/043 ,  H01L23/34

CPC classification number: H05K1/0209 ,  H05K3/4015 ,  H05K3/4046 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/19107 ,  H05K1/0306 ,  H05K2201/09781 ,  H05K2201/10166 ,  H05K2201/10295 ,  H05K2201/10333 ,  H05K2201/10401 ,  H05K2201/10962 ,  H05K3/3447

Abstract: A method for providing pre-placed, pre-brazed feed throughs in the substrate of a hermetic package corresponding to the terminal leads of the encased circuit COTS components. The substrate may include directly bonded copper (DBC) regions forming circular shapes where the holes for the special connectors of the present invention will be located. These holes will correspond to the leads of the COTS component that will be mounted to it. Holes are laser or mechanically drilled into the substrate inside the circular shapes formed in the DBC. To form the feed through, a bushing, such as a blind copper rivet, is brazed in the hole, with the open end thereof oriented toward the component-side of the substrate. These open ends can accept the leads of the COTS component, like the holes of a conventional PC circuit board.

Abstract translation: 一种在封装的电路COTS部件的端子引线对应于密封封装的基板中提供预置的预钎焊的进料通道的方法。 基板可以包括形成圆形形状的直接结合的铜（DBC）区域，其中本发明的特殊连接器的孔将被定位。 这些孔将对应于将被安装到其上的COTS部件的引线。 在DBC中形成的圆形内部，孔被激光或机械地钻入基板内。 为了形成进料通道，诸如盲铜铆钉的套管钎焊在孔中，其开口端朝向基板的部件侧。 这些开口端可以接受COTS部件的引线，如常规PC电路板的孔。

公开(公告)号：US6036528A

公开(公告)日：2000-03-14

申请号：US12295

申请日：1998-01-23

Applicant: Ralph Sykes Martin

Inventor： Ralph Sykes Martin

IPC: B23K1/00 ,  H01R4/02 ,  H05K3/34 ,  H01R4/24

CPC classification number: H01R12/57 ,  H01R4/024 ,  H01R4/026 ,  H05K3/34 ,  H05K2201/10287 ,  H05K2201/10401 ,  H05K2201/10962 ,  H05K2203/1189 ,  H05K3/3447

Abstract: An electrical contact facilitates making a soldered connection between an insulated wire conductor and a circuit board. The contact includes a tubular contact body having a hollow interior. One end of the contact body has an insulation piercing edge which promotes penetration of the contact body through the insulation of the wire conductor and into the conductive core when the wire conductor is pressed against the edge of the contact body. The other end of the contact body is solderable to a circuit board. The hollow interior permits solder to be drawn by capillary action through the contact body and into the wire conductive core.

Abstract translation: 电触点有助于在绝缘电线导体和电路板之间进行焊接连接。 触点包括具有中空内部的管状接触体。 接触体的一端具有绝缘穿刺边缘，当导线被压靠在接触体的边缘上时，该绝缘穿刺边缘促进接触体穿过线导体的绝缘并进入导电芯体中。 接触体的另一端可焊接到电路板上。 中空内部允许焊料通过毛细管作用被拉伸通过接触体并进入导线芯。

公开(公告)号：US05999410A

公开(公告)日：1999-12-07

申请号：US124740

申请日：1998-07-29

Applicant: Allan P. Weiler

Inventor： Allan P. Weiler

IPC: H01M2/10 ,  H01M2/20 ,  H01M10/42 ,  H05K1/00 ,  H05K1/18 ,  H02J7/00

CPC classification number: H05K1/189 ,  H01M10/425 ,  H01M2/1022 ,  H01M2/20 ,  H05K1/0295 ,  H01M10/4221 ,  H05K2201/09954 ,  H05K2201/0999 ,  H05K2201/10401 ,  H05K2203/173

Abstract: A flexible circuit board includes a plurality of discrete circuits for use with different types of rechargeable battery packs. Conductive traces formed on the circuit board include gaps which cause certain portions of the circuitry to be disconnected from the circuit rendering that portion of the circuit inactive. The process of bridging the gaps by attaching one or more components over the gaps causes the corresponding inactive portion of the circuit to be activated. By selectively activating certain portions of the circuit, a desired result is obtained.

Abstract translation: 柔性电路板包括用于不同类型的可充电电池组的多个分立电路。 形成在电路板上的导电迹线包括导致电路的某些部分与电路断开的间隙，使电路的该部分无效。 通过在间隙上附接一个或多个部件来桥接间隙的过程导致电路的相应非活动部分被激活。 通过选择性地激活电路的某些部分，获得期望的结果。

公开(公告)号：US4562301A

公开(公告)日：1985-12-31

申请号：US577773

申请日：1984-02-07

Applicant: Eiichi Kameda ,  Seiichi Tobe

Inventor： Eiichi Kameda ,  Seiichi Tobe

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/34 ,  H05K3/40 ,  H05K1/14 ,  H05K3/00

CPC classification number: H05K3/4046 ,  H01R12/523 ,  H05K2201/10303 ,  H05K2201/10401 ,  H05K2201/1059 ,  H05K2201/1081 ,  H05K3/3447 ,  Y10T29/49124 ,  Y10T29/49153

Abstract: A through-hole pin connection for laminated circuit elements and method of connection are presented. The laminated circuit element consists of a plurality of individual circuit elements, each element having a land area about the periphery of the through-hole. The through-hole pin has at least one ridged region located along the direction of insertion into the through-hole. Upon insertion, the pin guides a solder into the land areas and the ridged region effects electrical and mechanical contact between the through-hole pin and each of the land areas of the laminated circuit element.

Abstract translation: 提出了一种用于层叠电路元件的通孔引脚连接和连接方法。 层压电路元件由多个单独的电路元件组成，每个元件具有围绕通孔周边的平台区域。 通孔销具有沿着插入通孔的方向定位的至少一个脊状区域。 在插入时，引脚将焊料引导到焊盘区域中，并且脊状区域在通孔引脚与层叠电路元件的每个焊盘区域之间实现电和机械接触。

公开(公告)号：US4097684A

公开(公告)日：1978-06-27

申请号：US513190

申请日：1974-10-08

Applicant: Robert Page Burr

Inventor： Robert Page Burr

IPC: H05K3/10 ,  H05K3/38 ,  H05K3/46 ,  H05K7/06 ,  H05K1/00

CPC classification number: H05K3/103 ,  H05K7/06 ,  H05K2201/10287 ,  H05K2201/10303 ,  H05K2201/10401 ,  H05K3/386

Abstract: This invention generally relates to prefabricated electric wire assemblies comprising an interconnected network of separately formed, integral, shaped conductors, and to materials and techniques used in the manufacture of such assemblies.

Abstract translation: 本发明一般地涉及包括单独形成的，整体形状的导体的互连网络以及用于制造这种组件的材料和技术的预制电线组件。

公开(公告)号：US3601662A

公开(公告)日：1971-08-24

申请号：US3601662D

申请日：1969-08-11

Applicant: MARCONI CO CANADA

Inventor： DEBARROS SYDNEY A

IPC: H01R12/00 ,  H05K3/22 ,  H05K3/34 ,  H05K1/18 ,  H05K3/30

CPC classification number: H05K3/225 ,  H05K3/3447 ,  H05K2201/10401 ,  H05K2203/176

Abstract: Termination means for each lead of a cordwood module which permits easy removal of the module from a circuit board on which it is mounted. The termination means includes a conductive cylinder which is placed over the lead and which is fixed to the circuit board, by soldering, on the side of the circuit board remote from the module. The lead is then soldered to the termination means at its end remote from the module, thereby providing a mechanical and electrical connection between the lead and the circuit board. The termination means is so constructed that, when a cut is made between the two solder joints, the lead is released from the board.

公开(公告)号：US3528173A

公开(公告)日：1970-09-15

申请号：US3528173D

申请日：1966-08-15

Applicant: ANDREW S GALL

Inventor： GALL ANDREW S

IPC: H01R12/71 ,  H05K1/11 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H01R43/00 ,  H05K3/00

CPC classification number: H05K3/4046 ,  H01R12/58 ,  H05K1/118 ,  H05K3/306 ,  H05K3/326 ,  H05K3/34 ,  H05K3/3447 ,  H05K3/4092 ,  H05K2201/091 ,  H05K2201/10295 ,  H05K2201/10401 ,  H05K2201/1059 ,  H05K2201/10916 ,  Y10T29/49142 ,  Y10T29/49167

公开(公告)号：US3452149A

公开(公告)日：1969-06-24

申请号：US3452149D

申请日：1967-10-30

Applicant: FRED J RINALDI

Inventor： RINALDI FRED J

IPC: H01R12/51 ,  H05K3/34 ,  H05K3/40 ,  H05K1/10

CPC classification number: H05K3/4046 ,  H01R12/58 ,  H05K3/3447 ,  H05K2201/0373 ,  H05K2201/10401 ,  Y10T403/35 ,  Y10T403/3966 ,  Y10T403/4637 ,  Y10T403/4648 ,  Y10T403/4694