公开(公告)号：US4542439A

公开(公告)日：1985-09-17

申请号：US625273

申请日：1984-06-27

Applicant: Bernard M. Dick

Inventor： Bernard M. Dick

IPC: H05K3/30 ,  H05K3/34 ,  H05K1/18

CPC classification number: H05K3/303 ,  H05K3/3426 ,  H05K2201/10583 ,  H05K2201/10651 ,  H05K2203/0186 ,  Y02P70/613

Abstract: A surface mount component (11) has at least one lead (12) which extends from a body portion (16) of the component (11) along an axis (14) through the component. An outer end portion of the lead (12) is formed into a circuit termination (20) of a shape which, when projected onto a plane perpendicular to the axis, encompasses a projection of the body portion (16) of the component onto the plane.

Abstract translation: 表面安装部件（11）具有至少一个引线（12），其从部件（11）的主体部分（16）沿轴线（14）延伸穿过部件。 引线（12）的外端部形成为一个电路终端（20），该电路端子（20）当被投影到垂直于该轴线的平面上时，包围该部件的本体部分（16）在该平面上的突起 。

公开(公告)号：US4502059A

公开(公告)日：1985-02-26

申请号：US409803

申请日：1982-08-20

Applicant: Daniel R. Blessington

Inventor： Daniel R. Blessington

IPC: B41J2/01 ,  B41J2/045 ,  B41J2/055 ,  B41J2/14 ,  G01D15/18 ,  G06K15/10 ,  H05K1/18 ,  H05K3/40 ,  G01D15/16

CPC classification number: H01R12/526 ,  B41J2/1429 ,  H05K1/184 ,  H05K2201/10083 ,  H05K2201/10583 ,  H05K3/4046

Abstract: A device in which at least two separate electrical connections are made between a first member and a second member. The first member has at least two surfaces with at least one conductive element on each surface. These conductive elements are insulated from one another. The second member is mounted in an aperture of the first member. Electrically conductive regions of the second member, insulated from one another, are connected to the conductive elements of the first member.

Abstract translation: 一种其中在第一构件和第二构件之间形成至少两个单独的电连接的装置。 第一构件具有在每个表面上具有至少一个导电元件的至少两个表面。 这些导电元件彼此绝缘。 第二构件安装在第一构件的孔中。 彼此绝缘的第二构件的导电区域连接到第一构件的导电元件。

公开(公告)号：US4339785A

公开(公告)日：1982-07-13

申请号：US138438

申请日：1980-04-08

Applicant: Mitsuo Ohsawa

Inventor： Mitsuo Ohsawa

IPC: H05K1/18 ,  H05K1/02 ,  H05K3/30 ,  H05K3/34 ,  H05K7/02

CPC classification number: H05K1/0269 ,  H05K3/305 ,  H05K2201/09772 ,  H05K2201/10363 ,  H05K2201/10583 ,  H05K2201/10636 ,  H05K2203/161 ,  H05K2203/168 ,  H05K3/3452 ,  H05K3/3468 ,  Y02P70/611 ,  Y02P70/613

Abstract: In an electronic circuit arrangement mounted on a printed circuit board in which leadless circuit parts are attached to the printed circuit board with adhesive. A white paint is applied onto a region to which adhesive is applied, and an adhesive containing pigment contrastable to the white paint is applied onto the paint.

Abstract translation: 在安装在印刷电路板上的电子电路装置中，其中无引线电路部分用粘合剂附接到印刷电路板。 将白色涂料施加到施加有粘合剂的区域上，并将与白色涂料对比的含有颜料的粘合剂施加到涂料上。

公开(公告)号：US4254448A

公开(公告)日：1981-03-03

申请号：US38742

申请日：1979-05-14

Applicant: Gerald J. Martyniak

Inventor： Gerald J. Martyniak

IPC: H05K1/00 ,  H05K1/11 ,  H05K1/18 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K7/06

CPC classification number: H05K3/325 ,  H05K1/0284 ,  H05K1/119 ,  H05K1/183 ,  H05K3/303 ,  H05K3/3421 ,  H05K1/111 ,  H05K2201/0129 ,  H05K2201/09036 ,  H05K2201/091 ,  H05K2201/09118 ,  H05K2201/09472 ,  H05K2201/09745 ,  H05K2201/10393 ,  H05K2201/10568 ,  H05K2201/10583 ,  H05K2201/10598 ,  H05K2201/10651 ,  H05K2201/10689 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: Electrical components (10 or 30) are fastened to a mounting surface (16) of a printed circuit board (11) by forming a plurality of thermoplastic pins (20, 35) projecting from the mounting surface of the board adjacent to positions where components are to be located. The component is placed on the board so that portions of the component are located adjacent to portions of the pins, following which portions of the pins are heated and formed about portions of the component to form plastic locking sections (22 or 37) that fasten the component to the board in a desired position. The mounting surface (16) of the board may be formed with a pocket (18 or 33) that receives and positions the component at the desired location, so that component leads (17 or 32) extend along the mounting surface to positions overlapping lead-contact areas (14, 34) of printed contact patterns deposited on the mounting surface, after which the leads are attached to the contact areas, as by reflow soldering.

Abstract translation: 电气部件（10或30）通过形成从板的安装表面突出的多个热塑性销（20,35）紧固到印刷电路板（11）的安装表面（16），邻近于部件的位置 被安置在。 部件被放置在板上，使得部件的一部分邻近销的部分定位，随后销的部分被加热并围绕部件的部分形成以形成塑料锁定部分（22或37） 组件到板的所需位置。 板的安装表面（16）可以形成有一个口袋（18或33），该口袋（18或33）将部件接收并定位在所需的位置，使得元件引线（17或32）沿着安装表面延伸， 接触区域（14,34），其沉积在安装表面上，之后通过回流焊接将引线附接到接触区域。

公开(公告)号：US4109295A

公开(公告)日：1978-08-22

申请号：US820654

申请日：1977-08-01

Applicant: Paul M. Rostek ,  John F. Baeyertz

Inventor： Paul M. Rostek ,  John F. Baeyertz

IPC: H01G2/06 ,  H01R12/58 ,  H05K1/18 ,  H05K3/30 ,  H05K3/40 ,  H05K1/04

CPC classification number: H01G2/06 ,  H05K1/184 ,  H01R12/58 ,  H05K2201/0373 ,  H05K2201/0919 ,  H05K2201/10583 ,  H05K2201/1059 ,  H05K2201/10606 ,  H05K2201/10636 ,  H05K3/301 ,  H05K3/4046 ,  Y02P70/611 ,  Y10S439/94

Abstract: A circuit board component, specifically a capacitor, which is configured to be machine-insertable into apertures of a circuit board to make a solderless electrical connection to electrical conductors positioned on and in the circuit board. The component is a cylindrical element which has portions of its outer surface affixed with an electrically conductive material which material is formed with a plurality of serrations. The serrations are designed to cut through and to make a force fit, gas tight, seal with the walled portions and the electrical conductors of a circuit board. The electrically conductive material also either forms a part of the component, such as capacitor plates and/or provides a contact surface for the connecting of an internally-mounted electrical component. An indexing means positioned on one end of the cylindrical element provides a mechanical indexing to insure the correct orientation of the component with regard to corresponding electrical contacts on the circuit board. A flange member extending from one end of the cylindrical element provides a stop in order to insure proper alignment of the component when the component is inserted into a circuit board by automatic means.

公开(公告)号：US3978375A

公开(公告)日：1976-08-31

申请号：US460886

申请日：1974-04-15

Applicant: Noriaki Fukui ,  Toyokiti Yamasita

Inventor： Noriaki Fukui ,  Toyokiti Yamasita

IPC: H05K1/00 ,  H05K1/02 ,  H05K3/20 ,  H05K3/30 ,  H05K3/34 ,  H05K3/40 ,  H05K3/46 ,  H05K7/06 ,  H05K1/04

CPC classification number: H05K3/3447 ,  H05K3/202 ,  H05K7/06 ,  H05K1/0269 ,  H05K1/0284 ,  H05K1/0292 ,  H05K2201/0373 ,  H05K2201/0382 ,  H05K2201/0394 ,  H05K2201/091 ,  H05K2201/09118 ,  H05K2201/09681 ,  H05K2201/10583 ,  H05K2201/2072 ,  H05K2203/0723 ,  H05K2203/161 ,  H05K2203/175 ,  H05K3/301 ,  H05K3/3468 ,  H05K3/4092 ,  H05K3/4685

Abstract: A wiring unit of high reliability is obtained without the need for any chemical treatment. It is obtained by assembling a wiring means having a predetermined wiring pattern and made from a conductive plate into an insulating frame having a predetermined pattern and electrically connecting circuit elements to the wiring means.

公开(公告)号：US3462651A

公开(公告)日：1969-08-19

申请号：US3462651D

申请日：1967-09-27

Applicant: WEYENBERG LIONEL E

Inventor： WEYENBERG LIONEL E

IPC: H01C1/14 ,  H01C1/148 ,  H05K3/30 ,  H02B1/04 ,  H02B9/00

CPC classification number: H05K3/308 ,  H01C1/14 ,  H01C1/148 ,  H05K2201/10583 ,  H05K2201/10651 ,  H05K2201/10871

公开(公告)号：US3246386A

公开(公告)日：1966-04-19

申请号：US16899262

申请日：1962-01-26

Applicant: CORNING GLASS WORKS

Inventor： ENDE WOLFGANG A

IPC: H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K3/32 ,  H05K3/34 ,  H05K3/42

CPC classification number: H05K3/3442 ,  H01R12/523 ,  H01R12/58 ,  H05K1/115 ,  H05K1/119 ,  H05K1/145 ,  H05K1/184 ,  H05K3/326 ,  H05K3/34 ,  H05K3/42 ,  H05K2201/09827 ,  H05K2201/10454 ,  H05K2201/1053 ,  H05K2201/10583 ,  H05K2201/1059 ,  H05K2201/10969 ,  Y02P70/613 ,  Y10T29/49139

公开(公告)号：US20230319998A1

公开(公告)日：2023-10-05

申请号：US17981847

申请日：2022-11-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： SOOJAE PARK

IPC: H01L23/00 ,  H01G4/28 ,  H01G4/012 ,  H05K1/11 ,  H01L25/16 ,  H01G4/01 ,  H05K1/18 ,  H01G4/38

CPC classification number: H05K1/186 ,  H01G4/01 ,  H01G4/012 ,  H01G4/28 ,  H01G4/38 ,  H01L24/16 ,  H01L25/16 ,  H05K1/119 ,  H05K1/181 ,  H05K1/183 ,  H01L23/3128 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/10015 ,  H05K2201/10378 ,  H05K2201/10545 ,  H05K2201/10583

Abstract: A wiring board includes an insulating layer having a first surface and a second surface, which are opposite to each other, upper wiring patterns on the first surface of the insulating layer, lower wiring patterns on the second surface of the insulating layer, intermediate wiring patterns, which are disposed in the insulating layer and are electrically connected to the upper wiring patterns and the lower wiring patterns, and a capacitor wire connected to corresponding wiring patterns of the upper wiring patterns, the lower wiring patterns, and the intermediate wiring patterns. The capacitor wire includes a core electrode line having a wire shape, an outer electrode line covering at least a portion of the core electrode line, and a dielectric line interposed between the core electrode line and the outer electrode line.

公开(公告)号：US20170273172A1

公开(公告)日：2017-09-21

申请号：US15500160

申请日：2014-09-02

Applicant: Telefonaktiebolaget LM Ericsson (publ)

Inventor： Per Ligander ,  Tomas Bergsten ,  Ingolf Larsson ,  Olle Nyström ,  Torbjörn Westin

IPC: H05K1/02 ,  H05K3/42 ,  H05K1/11

CPC classification number: H01P11/003 ,  H01P1/045 ,  H01P1/047 ,  H01P5/085 ,  H01P11/005 ,  H05K1/0242 ,  H05K1/0243 ,  H05K1/0251 ,  H05K1/115 ,  H05K1/184 ,  H05K3/4038 ,  H05K3/42 ,  H05K2201/0784 ,  H05K2201/10583

Abstract: The present invention relates to a microwave signal transition component (1) having a first signal conductor side (2) and a second signal conductor side (3). The signal transition component (1) is arranged for transfer of microwave signals from the first signal conductor side (2) to the second signal conductor side (3). The transfer component (1) comprises at least one, at least partly circumferentially running, electrically conducting frame (4), a dielectric filling (5) positioned at least partly within said conducting frame (4), at least one filling aperture (6; 6a, 6b) miming through the dielectric filling, and, for each filling aperture (6; 6a, 6b), an electrically conducting connection (7; 7a, 7b) that at least partly is positioned within said filling aperture (6; 6a, 6b). The present invention also relates to a method for manufacturing a microwave signal transition component according to the above.