公开(公告)号：US09388038B2

公开(公告)日：2016-07-12

申请号：US14265116

申请日：2014-04-29

Applicant: STMicroelectronics S.r.l.

Inventor： Roberto Campedelli ,  Raffaella Pezzuto ,  Stefano Losa ,  Marco Mantovani ,  Mikel Azpeitia Urquia

IPC: H01L29/84 ,  B81B7/00 ,  B81B3/00 ,  B81C1/00

CPC classification number: B81B7/0006 ,  B81B3/0086 ,  B81B7/007 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2207/07 ,  B81B2207/097 ,  B81C1/00476 ,  H01L29/84

Abstract: A MEMS device formed by a body; a cavity, extending above the body; mobile and fixed structures extending above the cavity and physically connected to the body via anchoring regions; and electrical-connection regions, extending between the body and the anchoring regions and electrically connected to the mobile and fixed structures. The electrical-connection regions are formed by a conductive multilayer including a first semiconductor material layer, a composite layer of a binary compound of the semiconductor material and of a transition metal, and a second semiconductor material layer.

Abstract translation: 由身体形成的MEMS器件; 一个在身体上方延伸的空腔; 移动和固定结构延伸到腔体之上并通过锚定区域物理地连接到身体; 以及电连接区域，其在主体和锚定区域之间延伸并且电连接到移动和固定结构。 电连接区域由包括第一半导体材料层，半导体材料的二元化合物和过渡金属的复合层和第二半导体材料层的导电多层形成。

公开(公告)号：US20160159644A1

公开(公告)日：2016-06-09

申请号：US15043850

申请日：2016-02-15

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chia-Hua Chu ,  Chun-Wen Cheng

IPC: B81C1/00 ,  B81B7/00

CPC classification number: B81C1/00293 ,  B81B3/0021 ,  B81B7/0041 ,  B81B7/007 ,  B81B7/02 ,  B81B7/04 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/025 ,  B81B2201/0264 ,  B81C1/00134 ,  B81C1/00309 ,  B81C2201/013 ,  B81C2203/0118 ,  G01C19/56 ,  G01C19/5769 ,  G01L9/0044 ,  G01L19/0076 ,  G01L19/0092 ,  G01P15/00 ,  G01P15/0802 ,  G01P15/125

Abstract: A method embodiment includes providing a micro-electromechanical (MEMS) wafer including a polysilicon layer having a first and a second portion. A carrier wafer is bonded to a first surface of the MEMS wafer. Bonding the carrier wafer creates a first cavity. A first surface of the first portion of the polysilicon layer is exposed to a pressure level of the first cavity. A cap wafer is bonded to a second surface of the MEMS wafer opposite the first surface of the MEMS wafer. The bonding the cap wafer creates a second cavity comprising the second portion of the polysilicon layer and a third cavity. A second surface of the first portion of the polysilicon layer is exposed to a pressure level of the third cavity. The first cavity or the third cavity is exposed to an ambient environment.

公开(公告)号：US09352956B2

公开(公告)日：2016-05-31

申请号：US14157273

申请日：2014-01-16

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chun-Wen Cheng ,  Jung-Huei Peng ,  Shang-Ying Tsai ,  Hung-Chia Tsai ,  Yi-Chuan Teng

IPC: B81B7/00 ,  B81C1/00 ,  B81B7/02 ,  H01L21/78 ,  H01L23/053 ,  H01L23/31

CPC classification number: B81B7/0006 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0264 ,  B81B2203/0315 ,  B81B2207/098 ,  B81C1/0023 ,  B81C2203/0154 ,  B81C2203/0714 ,  H01L21/78 ,  H01L23/053 ,  H01L23/31 ,  H01L2924/16152 ,  H01L2924/16235

Abstract: An embodiment is MEMS device including a first MEMS die having a first cavity at a first pressure, a second MEMS die having a second cavity at a second pressure, the second pressure being different from the first pressure, and a molding material surrounding the first MEMS die and the second MEMS die, the molding material having a first surface over the first and the second MEMS dies. The device further includes a first set of electrical connectors in the molding material, each of the first set of electrical connectors coupling at least one of the first and the second MEMS dies to the first surface of the molding material, and a second set of electrical connectors over the first surface of the molding material, each of the second set of electrical connectors being coupled to at least one of the first set of electrical connectors.

Abstract translation: 一个实施例是包括具有第一压力的第一腔的第一MEMS模具和第二压力下具有第二空腔的第二MEMS模具，第二压力不同于第一压力的MEMS装置和围绕第一MEMS的模制材料 模具和第二MEMS模具，所述模制材料具有在第一和第二MEMS模具上的第一表面。 该装置还包括模制材料中的第一组电连接器，第一组电连接器中的每一个将第一和第二MEMS模具中的至少一个耦合到模制材料的第一表面，以及将第二组电连接器 连接器在模制材料的第一表面上，每个第二组电连接器被耦合到第一组电连接器中的至少一个。

公开(公告)号：US20160116631A1

公开(公告)日：2016-04-28

申请号：US14985037

申请日：2015-12-30

Applicant: STMicroelectronics (Rousset) SAS

Inventor： Abderrezak Marzaki ,  Yoann Goasduff ,  Virginie Bidal ,  Pascal Fornara

IPC: G01V7/04 ,  B81C1/00 ,  H01H37/32 ,  H01L29/423 ,  B81B3/00 ,  H01H37/04 ,  H01L21/3213 ,  H01L49/02

CPC classification number: G01V7/04 ,  B81B3/001 ,  B81B2201/018 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/0361 ,  B81B2203/04 ,  B81C1/00111 ,  H01H9/02 ,  H01H37/04 ,  H01H37/32 ,  H01H37/42 ,  H01H61/013 ,  H01L21/32139 ,  H01L28/82 ,  H01L28/88 ,  H01L29/4238

Abstract: A method for producing an integrated circuit pointed element is disclosed. An element has a projection with a concave part directing its concavity towards the element. The element includes a first etchable material. A zone is formed around the concave part of the element. The zone includes a second material that is less rapidly etchable than the first material for a particular etchant. The first material and the second material are etched with the particular etchant to form an open crater in the concave part and thus to form a pointed region of the element.

Abstract translation: 公开了一种用于制造集成电路尖锐元件的方法。 元件具有突出部，其凹部朝向元件引导其凹面。 元件包括第一可蚀刻材料。 围绕元件的凹部形成区域。 该区域包括与用于特定蚀刻剂的第一材料不太可蚀刻的第二材料。 用特定的蚀刻剂蚀刻第一材料和第二材料，以在凹部中形成开放的凹坑，从而形成元件的尖锐区域。

公开(公告)号：US09316666B2

公开(公告)日：2016-04-19

申请号：US14090266

申请日：2013-11-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Toshihisa Suzuki

IPC: G01P15/125 ,  G01P15/18 ,  B81B3/00 ,  G01P15/08

CPC classification number: G01P15/125 ,  B81B3/0051 ,  B81B2201/0235 ,  G01P15/18 ,  G01P2015/0814 ,  G01P2015/0871

Abstract: An acceleration sensor achieving improvement of sensitivity and comprehensive miniaturization as a device includes a first sensor. The first sensor is furnished with an electrostatic capacitor that is configured such that a first fixed electrode, a second fixed electrode and a movable electrode are intensively arranged in a row. In the electrostatic capacitor, the first fixed electrode, the second fixed electrode and the movable electrode are arranged adjoining one another in acceleration detection direction (y-axis direction) at a position corresponding to the center of a weight in a plane view of a substrate. At one of longitudinal-side's ends of each electrode (one of ends in x-axis direction), connectors are provided so as to connect the first fixed electrode and the second fixed electrode to the substrate by connectors.

Abstract translation: 实现作为装置的灵敏度提高和综合小型化的加速度传感器包括第一传感器。 第一传感器配备有静电电容器，其被构造成使得第一固定电极，第二固定电极和可移动​​电极被排列成一排。 在静电电容器中，第一固定电极，第二固定电极和可动电极在与基板的平面图中的重量的中心对应的位置处相对于加速度检测方向（y轴方向）彼此相邻配置 。 在每个电极的纵向端部（x轴方向的一个端部）中的一个处，设置连接器，以通过连接器将第一固定电极和第二固定电极连接到基板。

公开(公告)号：US20160084865A1

公开(公告)日：2016-03-24

申请号：US14890527

申请日：2014-05-05

Applicant: ROBERT BOSCH GMBH

Inventor： Arnd Kaelberer ,  Jochen Reinmuth ,  Johannes Classen

IPC: G01P1/00 ,  G01C19/56 ,  G01P15/02 ,  B81C1/00

CPC classification number: G01P1/00 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2207/012 ,  B81C1/00301 ,  G01C19/56 ,  G01P15/02

Abstract: A micromechanical device having a main plane of extension includes a sensor wafer, an evaluation wafer, and an intermediate wafer situated between the sensor wafer and the evaluation wafer, the evaluation wafer having at least one application-specific integrated circuit. The sensor wafer and/or the intermediate wafer includes a first sensor element and a second sensor element spatially separated from the first sensor element, the first and second sensor elements being respectively located in a first cavity and a second cavity each formed by the intermediate wafer and the sensor wafer, a first gas pressure in the first cavity differing from a second gas pressure in the second cavity, and the intermediate wafer having an opening at a point in a direction perpendicular to the main plane of extension.

Abstract translation: 具有主平面延伸的微机械装置包括传感器晶片，评估晶片和位于传感器晶片和评估晶片之间的中间晶片，评估晶片具有至少一个专用集成电路。 传感器晶片和/或中间晶片包括第一传感器元件和与第一传感器元件空间分离的第二传感器元件，第一和第二传感器元件分别位于由中间晶片形成的第一腔和第二腔中 和所述传感器晶片，所述第一空腔中的第一气体压力与所述第二空腔中的第二气体压力不同，并且所述中间晶片在垂直于所述主平面的主平面的方向上具有开口。

公开(公告)号：US20160061853A1

公开(公告)日：2016-03-03

申请号：US14819756

申请日：2015-08-06

Applicant: Seiko Epson Corporation

Inventor： Teruo TAKIZAWA

IPC: G01P1/02

CPC classification number: G01P1/02 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C2203/0109 ,  B81C2203/0145 ,  B81C2203/031 ,  G01C19/5712 ,  G01C19/5719 ,  G01C19/5747 ,  G01C19/5783 ,  G01D11/245 ,  G01P1/023

Abstract: A physical quantity sensor has a package, which is provided with a substrate and a lid and has an internal space inside, and a functional element which is accommodated in the internal space, the lid is formed on a partition wall section which is provided on the periphery of the internal space in planar view and has a communication hole which causes a lower surface at the substrate side to communicate with an upper surface at the opposite side to the substrate, and the communication hole communicates with the internal space via a groove which is formed in the substrate.

Abstract translation: 物理量传感器具有封装，其具有基板和盖子，并且内部具有内部空间，以及容纳在内部空间中的功能元件，盖体形成在设置在内部空间的隔壁部分上 在平面视图中具有内部空间的周边，并且具有连通孔，其使得在基板侧的下表面与与基板相反的一侧的上表面连通，并且连通孔通过凹槽与内部空间连通， 形成在基板中。

公开(公告)号：US20160060104A1

公开(公告)日：2016-03-03

申请号：US14934854

申请日：2015-11-06

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chia-Hua Chu ,  Chun-Wen Cheng

IPC: B81B7/02

CPC classification number: B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81C1/00309 ,  B81C2203/0118

Abstract: A method embodiment for forming a micro-electromechanical (MEMS) device includes providing a MEMS wafer, wherein a portion of the MEMS wafer is patterned to provide a first membrane for a microphone device and a second membrane for a pressure sensor device. A carrier wafer is bonded to the MEMS wafer, and the carrier wafer is etched to expose the first membrane for the microphone device to an ambient environment. A MEMS substrate is patterned and portions of a first sacrificial layer are removed of the MEMS wafer to form a MEMS structure. A cap wafer is bonded to a side of the MEMS wafer opposing the carrier wafer to form a first sealed cavity including the MEMS structure. A second sealed cavity and a cavity exposed to an ambient environment on opposing sides of the second membrane for the pressure sensor device are formed.

Abstract translation: 用于形成微机电（MEMS）装置的方法实施例包括提供MEMS晶片，其中MEMS晶片的一部分被图案化以提供用于麦克风装置的第一膜和用于压力传感器装置的第二膜。 载体晶片结合到MEMS晶片，并且载体晶片被蚀刻以将用于麦克风器件的第一膜暴露于周围环境。 图案化MEMS基板，并且去除MEMS晶片的第一牺牲层的部分以形成MEMS结构。 盖晶片结合到与晶片相对的MEMS晶片的一侧，以形成包括MEMS结构的第一密封腔。 形成用于压力传感器装置的第二密封空腔和暴露于第二隔膜相对侧周围环境的空腔。

公开(公告)号：US09274137B2

公开(公告)日：2016-03-01

申请号：US13878105

申请日：2011-10-06

Applicant: Maurice Moreau

Inventor： Maurice Moreau

IPC: G01P15/125 ,  G01P21/00 ,  B81C1/00 ,  B81B3/00

CPC classification number: G01P21/00 ,  B81B3/0018 ,  B81B2201/0235 ,  B81C1/00968 ,  G01P15/125

Abstract: An anti-stiction method is proposed in an inertial micro-electro-mechanical device. The device includes: a mobile mass, suspended to an armature via a spring, and having at least one mobile electrode; and at least one fixed electrode rigidly attached to the armature, each fixed electrode cooperating with one of the at least one mobile electrode to form a pair of electrodes. The anti-stiction method carries out a step of detecting, for at least one stuck pair of electrodes, a stiction associated to a stiction force and a step of applying, during a predetermined time period, a predetermined voltage between the electrodes of at least one of the pair or pairs of electrodes, so as to create an electrostatic force which generates a displacement of the mobile mass according to the direction of the stiction force.

Abstract translation: 在惯性微机电装置中提出了一种抗静电法。 该装置包括：通过弹簧悬挂到电枢并具有至少一个移动电极的移动质量块; 以及至少一个刚性地附接到所述电枢的固定电极，每个固定电极与所述至少一个移动电极中的一个配合，以形成一对电极。 防静电方法执行以下步骤：对于至少一个卡定的电极对，检测与静摩擦力相关联的静止，以及在预定时间段期间在至少一个电极之间施加预定电压的步骤 的一对或两对电极，以产生静电力，该静电力根据静力的方向产生移动体的位移。

公开(公告)号：US09255940B2

公开(公告)日：2016-02-09

申请号：US14159538

申请日：2014-01-21

Applicant: Seiko Epson Corporation

Inventor： Satoshi Nakajima

IPC: H05K1/11 ,  H05K1/14 ,  G01P1/02 ,  G01L19/00 ,  G01P15/125 ,  B81C1/00 ,  H01L23/31 ,  H01L23/00 ,  H01L25/16

CPC classification number: G01P1/023 ,  B81B2201/0235 ,  B81B2203/0136 ,  B81B2207/012 ,  B81C1/0023 ,  G01L19/00 ,  G01L19/147 ,  G01P15/125 ,  H01L23/3121 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L25/16 ,  H01L2224/16195 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/83855 ,  H01L2224/92127 ,  H01L2924/00014 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  Y10T156/10 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A sensor includes: a substrate on which an active chip including a semiconductor circuit is disposed; and a passive chip including an acceleration sensor, and a thick portion and a thin portion, the thick portion being disposed on the substrate so as to be in contact therewith. An active chip terminal is disposed on the active chip. A passive chip terminal is disposed on the passive chip at the thin portion. The passive chip terminal and the active chip terminal face each other and are connected via a bump.

Abstract translation: 传感器包括：基板，其上设置有包括半导体电路的有源芯片; 以及包括加速度传感器的无源芯片，以及厚部分和薄部分，所述厚部分设置在所述基板上以与其接触。 有源芯片端子设置在有源芯片上。 无源芯片端子以薄的部分设置在无源芯片上。 无源芯片端子和有源芯片端子彼此面对并通过凸块连接。