公开(公告)号：US08425785B2

公开(公告)日：2013-04-23

申请号：US12059031

申请日：2008-03-31

Applicant: Ravi Nalla ,  Omar Bchir ,  Houssain Jomas

Inventor： Ravi Nalla ,  Omar Bchir ,  Houssain Jomas

IPC: B32B38/04 ,  B32B5/16 ,  B32B7/12

CPC classification number: H01L23/53238 ,  C08J5/18 ,  C08J2363/00 ,  H01L24/26 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/0298 ,  H05K3/181 ,  H05K3/381 ,  H05K3/4661 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2203/0773 ,  H05K2203/0796 ,  Y10T156/1052 ,  Y10T428/249921 ,  Y10T428/254 ,  Y10T428/268 ,  H01L2924/00

Abstract: In some embodiments, an improved mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers is presented. In this regard, a substrate build-up film is introduced having epoxy material and a plurality of epoxy microspheres, wherein an interior of the microspheres is not fully cured. Other embodiments are also disclosed and claimed.

公开(公告)号：US08361614B2

公开(公告)日：2013-01-29

申请号：US12302640

申请日：2008-04-22

Applicant: Yasushi Akutsu ,  Daisuke Sato ,  Shinichi Hayashi

Inventor： Yasushi Akutsu ,  Daisuke Sato ,  Shinichi Hayashi

IPC: B32B5/16 ,  B32B27/00

CPC classification number: H01R4/04 ,  C08G2650/56 ,  C08L33/066 ,  C08L71/00 ,  H01B1/20 ,  H05K3/323 ,  H05K2201/0133 ,  H05K2201/0212 ,  Y10T428/254 ,  Y10T428/31855 ,  C08L2666/04

Abstract: An anisotropic electrically conductive film formed by a thermosetting acrylic resin composition is disclosed. The composition contains at least a thermosetting agent (A), a thermo-settable ingredient (B), an acrylic rubber containing hydroxyl groups (C), organic fine particles (D) and electrically conductive particles (E). The thermo-settable ingredient (B) may include a phosphorus-containing acrylic ester (b1). The weight averaged molecular weight of the acrylic rubber containing the hydroxyl groups (C) is not less than 1000000. The organic fine particles (D) include polybutadiene-based fine particles (d1).

Abstract translation: 公开了由热固性丙烯酸树脂组合物形成的各向异性导电膜。 该组合物至少含有热固性剂（A），热固性成分（B），含有羟基的丙烯酸类橡胶（C），有机细颗粒（D）和导电性颗粒（E）。 热固性成分（B）可以包括含磷丙烯酸酯（b1）。 含有羟基（C）的丙烯酸类橡胶的重均分子量不小于1000000.有机细颗粒（D）包括聚丁二烯基微粒（d1）。

公开(公告)号：US20130008701A1

公开(公告)日：2013-01-10

申请号：US13617012

申请日：2012-09-14

Applicant: Yukihiko TOYODA ,  Yoichiro Kawamura ,  Tomoyuki Ikeda

Inventor： Yukihiko TOYODA ,  Yoichiro Kawamura ,  Tomoyuki Ikeda

IPC: H05K1/11

CPC classification number: H05K1/115 ,  H01L21/486 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/0271 ,  H05K1/113 ,  H05K1/116 ,  H05K3/28 ,  H05K3/4602 ,  H05K3/4644 ,  H05K3/4661 ,  H05K3/4688 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/068 ,  H05K2201/09454 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09627 ,  H05K2201/09745 ,  H01L2924/00

Abstract: A multilayered printed circuit board including a substrate, a multilayered structure formed on the substrate and including multiple conductor circuits and multiple interlaminar resin insulating layers, and a stack-via structure having multiple via-holes and formed in the multilayered structure such that the via-holes are piled through the interlaminar resin insulating layers in the multilayered structure. The interlaminar resin insulating layers include an outermost interlaminar resin insulating layer forming an outermost layer of the interlaminar resin insulating layers and having a coefficient of linear expansion which is equal to or smaller than coefficients of linear expansion of the interlaminar resin insulating layers other than the outermost interlaminar resin insulating layer.

Abstract translation: 一种多层印刷电路板，包括基板，形成在基板上的多层结构，包括多个导体电路和多个层间树脂绝缘层，以及具有多个通孔的叠层通孔结构，形成在多层结构中， 通过多层结构中的层间树脂绝缘层堆积孔。 层间树脂绝缘层包括形成层间树脂绝缘层的最外层的最外层间树脂绝缘层，其线膨胀系数等于或小于除最外层之外的层间树脂绝缘层的线性膨胀系数 层间树脂绝缘层。

公开(公告)号：US20130001199A1

公开(公告)日：2013-01-03

申请号：US13581668

申请日：2011-02-21

Applicant: Naoto Takahashi

Inventor： Naoto Takahashi

IPC: B05D1/36 ,  B05D3/02 ,  B05D5/00 ,  B05D3/10

CPC classification number: H05K3/386 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/1208 ,  H05K3/246 ,  H05K2201/0212

Abstract: The present invention provides a method of forming a fine pattern by the post-firing method. The production method of a metallized ceramic substrate comprises: a first step of forming an organic base layer on a ceramic substrate; a second step of forming a metal paste layer on the organic base layer to produce a metallized ceramic substrate precursor; and a third step of firing the metallized ceramic substrate precursor, wherein the organic base layer is a layer which absorbs a solvent in the metal paste layer and thermally decomposes at a temperature of firing the metal paste layer.

Abstract translation: 本发明提供通过后焙烧法形成精细图案的方法。 金属化陶瓷基板的制造方法包括：在陶瓷基板上形成有机基底层的第一工序; 在所述有机基底层上形成金属糊料层以制造金属化陶瓷基板前体的第二步骤; 以及烧制所述金属化陶瓷基板前体的第三工序，其中，所述有机基底层是吸收所述金属糊料层中的溶剂并在所述金属糊料层的烧成温度下热分解的层。

公开(公告)号：US08211788B2

公开(公告)日：2012-07-03

申请号：US12486771

申请日：2009-06-18

Applicant: Shyh-Ming Chang ,  Sheng-Shu Yang

Inventor： Shyh-Ming Chang ,  Sheng-Shu Yang

IPC: H01L21/44

CPC classification number: H01L21/563 ,  H01L23/295 ,  H01L24/13 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L24/91 ,  H01L2224/0554 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/13011 ,  H01L2224/13012 ,  H01L2224/13015 ,  H01L2224/13017 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/13562 ,  H01L2224/136 ,  H01L2224/14 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/29287 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/83136 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83205 ,  H01L2224/838 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/9211 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01022 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H05K3/305 ,  H05K3/361 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/10977 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A method of fabricating a bonding structure having compliant bumps includes first providing a first substrate and a second substrate. The first substrate includes first bonding pads. The second substrate is disposed on one side of the first substrate and includes second bonding pads and compliant bumps disposed thereon. The second bonding pads are opposite to the first bonding pads. Next, a non-conductive adhesive layer and ball-shaped spacers are formed between the first and the second substrates. Finally, the first substrate, the non-conductive adhesive layer, and the second substrate are compressed, such that the compliant bumps on the second bonding pads of the second substrate pass through the non-conductive adhesive layer and are electrically connected to the first bonding pads of the first substrate, respectively. The ball-shaped spacers are distributed in the non-conductive adhesive layer sandwiched between the first and the second substrates for maintaining the gap therebetween.

Abstract translation: 制造具有柔顺凸块的接合结构的方法包括首先提供第一基板和第二基板。 第一衬底包括第一接合焊盘。 第二基板设置在第一基板的一侧，并且包括设置在其上的第二接合焊盘和顺应凸块。 第二接合焊盘与第一接合焊盘相对。 接下来，在第一和第二基板之间形成非导电粘合剂层和球形间隔物。 最后，第一基板，非导电粘合剂层和第二基板被压缩，使得第二基板的第二接合焊盘上的顺从凸块穿过非导电粘合剂层，并且电连接到第一接合 第一基板的焊盘。 球形间隔件分布在夹在第一和第二基板之间的非导电粘合剂层中，以保持它们之间的间隙。

公开(公告)号：US20120111621A1

公开(公告)日：2012-05-10

申请号：US13386135

申请日：2010-07-21

Applicant: Noriyuki Ohigashi ,  Seiji Mori ,  Haruo Murakami ,  Akihiko Tobisawa ,  Hiroshi Obata ,  Takayoshi Masaki

Inventor： Noriyuki Ohigashi ,  Seiji Mori ,  Haruo Murakami ,  Akihiko Tobisawa ,  Hiroshi Obata ,  Takayoshi Masaki

IPC: H05K1/00 ,  C08L63/00 ,  C08K3/36 ,  B32B27/38 ,  B32B15/092 ,  B82Y30/00

CPC classification number: H05K1/0373 ,  B32B15/08 ,  B32B15/14 ,  B32B27/04 ,  C08K3/013 ,  C08K3/36 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0266 ,  Y10T428/25 ,  C08L63/00

Abstract: An object of the present invention is to provide a resin composition having excellent impregnation property into a base material and capable of producing a prepreg, metal-clad laminate and printed wiring board excellent in properties such as low warpage, flame resistance, low thermal expansion properties, drill processability and desmear resistance. A first resin composition comprises an epoxy resin, an irregular-shaped first inorganic filler and a second inorganic filler having an average particle diameter of 10 to 100 nm which is different from that of the first inorganic filler. A second resin composition comprises an epoxy resin, silicone rubber particles having an average particle diameter of 1 μm to 10 μm, boehmite particles having an average particle diameter of 0.2 μm to 5 μm, and silica nanoparticles having an average particle diameter of 10 nm to 100 nm.

Abstract translation: 本发明的目的在于提供一种在基材中具有优异的浸渍性能并且能够制备性能如低翘曲，阻燃性，低热膨胀性等优异的预浸料，覆金属层压板和印刷线路板的树脂组合物 ，钻孔加工性和耐去污性。 第一树脂组合物包含环氧树脂，不规则形状的第一无机填料和平均粒径为10〜100nm的与第一无机填料不同的第二无机填料。 第二树脂组合物包含环氧树脂，平均粒径为1μm〜10μm的硅橡胶粒子，平均粒径为0.2μm〜5μm的勃姆石粒子，平均粒径为10nm〜 100nm。

公开(公告)号：US08115322B2

公开(公告)日：2012-02-14

申请号：US12874945

申请日：2010-09-02

Applicant: Motohiro Arifuku ,  Itsuo Watanabe ,  Kouji Motomura ,  Kouji Kobayashi ,  Yasushi Gotoh ,  Tohru Fujinawa

Inventor： Motohiro Arifuku ,  Itsuo Watanabe ,  Kouji Motomura ,  Kouji Kobayashi ,  Yasushi Gotoh ,  Tohru Fujinawa

IPC: C09J9/02 ,  C09J4/06 ,  H01B1/20 ,  H05K3/36 ,  H05K3/32 ,  H01L21/60

CPC classification number: H01L24/83 ,  C09J4/06 ,  H01L24/29 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0162 ,  H05K2201/0212 ,  Y10T428/2826 ,  Y10T428/2852 ,  H01L2924/00

Abstract: This invention provides a wiring-terminal-connecting adhesive comprising a curing agent capable of generating a free radical upon heating, a radically polymerizable substance and silicone particles, and a wiring-terminal-connecting method and a wiring structure which make use of such an adhesive.

Abstract translation: 本发明提供了一种接线端子连接粘合剂，其包括在加热时能够产生自由基的固化剂，可自由基聚合的物质和硅氧烷颗粒，以及使用这种粘合剂的接线端子连接方法和布线结构 。

公开(公告)号：US08114500B2

公开(公告)日：2012-02-14

申请号：US12609702

申请日：2009-10-30

Applicant: Naofumi Yasuda ,  Hiroki Ishikawa ,  Hirokazu Yokoyama

Inventor： Naofumi Yasuda ,  Hiroki Ishikawa ,  Hirokazu Yokoyama

IPC: B32B15/088 ,  B29C55/14 ,  C08J5/18

CPC classification number: H05K1/0346 ,  C08J5/18 ,  C08J2379/08 ,  C08L79/08 ,  H05K1/0393 ,  H05K2201/0154 ,  H05K2201/0212 ,  Y10S977/773 ,  Y10S977/775 ,  Y10T428/24405

Abstract: The purpose of the present invention is to provide a polyimide film with excellent passage characteristic, especially in an automatic optical inspection system (AOI), not to mention running characteristic (easy slip characteristic) and adhesion.

Abstract translation: 本发明的目的是提供一种具有优异的通过特性的聚酰亚胺膜，特别是在自动光学检测系统（AOI）中，更不用说运行特性（易滑动特性）和粘附性。

公开(公告)号：US07993984B2

公开(公告)日：2011-08-09

申请号：US12106459

申请日：2008-04-21

Applicant: Yasuo Yokota ,  Hisahiko Yoshida

Inventor： Yasuo Yokota ,  Hisahiko Yoshida

IPC: H01L21/00

CPC classification number: B23K1/018 ,  H01L21/56 ,  H01L21/67126 ,  H01L23/3185 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/81052 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/831 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/19041 ,  H01L2924/3511 ,  H05K3/284 ,  H05K3/305 ,  H05K2201/0212 ,  H05K2201/10689 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2203/176 ,  H05K2203/304 ,  Y02P70/613 ,  H01L2924/00012

Abstract: An electronic device including a semiconductor device with a plurality of bump electrodes, a mounting board connected to the semiconductor device, thermally expandable particles, and adhesive. The thermally expandable particles are provided on the sides of the semiconductor device and the surface of the mounting board around a projected area of the semiconductor device. The adhesive is provided on the sides of the semiconductor device and the surface of the mounting board such that it covers the area of thermally expandable particles. This improves the impact resistance of the semiconductor device soldered onto the mounting board, and also facilitates removal of the semiconductor device from the mounting board when the semiconductor device needs repair.

Abstract translation: 一种电子设备，包括具有多个凸起电极的半导体器件，连接到半导体器件的安装板，可热膨胀的颗粒和粘合剂。 热可膨胀颗粒设置在半导体器件的侧面和安装板的表面周围的半导体器件的投影区域。 粘合剂设置在半导体器件的侧面和安装板的表面上，使得其覆盖可热膨胀的颗粒的区域。 这提高了焊接到安装板上的半导体器件的耐冲击性，并且还有助于在半导体器件需要修理时从安装板移除半导体器件。

公开(公告)号：US07969028B2

公开(公告)日：2011-06-28

申请号：US12102359

申请日：2008-04-14

Applicant: Hisahiko Yoshida

Inventor： Hisahiko Yoshida

IPC: H01L23/29

CPC classification number: H05K3/305 ,  H01L21/563 ,  H01L23/295 ,  H01L24/28 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29111 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/81052 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83104 ,  H01L2224/83194 ,  H01L2224/83851 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/0133 ,  H01L2924/15311 ,  H01L2924/1579 ,  H05K3/3494 ,  H05K2201/0212 ,  H05K2201/10734 ,  H05K2203/1476 ,  H05K2203/306 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A semiconductor device mounting structure includes a semiconductor device whose electrodes are aligned on its one main face; a circuit board having board electrodes electrically connected to the electrodes of the semiconductor device by solder bumps; and curable resin applied between at least the side face of the semiconductor device and the circuit board. Multiple types of thermally expandable particles with different expansion temperatures are mixed in this curable resin. This structure offers the semiconductor device mounting structure that is highly resistant to impact and suited for mass production, its manufacturing method, and a removal method of the semiconductor device. In addition, this structure facilitates repair and reworking, leaving almost no adhesive residue on the circuit board after repair. Stress applied to the circuit board during repair can also be minimized.

Abstract translation: 半导体器件安装结构包括其电极在其一个主面上对准的半导体器件; 电路板，其具有通过焊料凸块与半导体器件的电极电连接的板电极; 并且至少施加在半导体器件的侧面和电路板之间的可固化树脂。 在该可固化树脂中混合具有不同膨胀温度的多种类型的可热膨胀颗粒。 这种结构提供了耐冲击并且适合于批量生产的半导体器件安装结构，其制造方法和半导体器件的去除方法。 此外，这种结构有助于修复和修复，修复后几乎不会在电路板上留下残留粘合剂。 维修期间施加在电路板上的应力也可以最小化。