公开(公告)号：US20100143681A1

公开(公告)日：2010-06-10

申请号：US12531845

申请日：2008-03-27

Applicant: Hiroyuki Yano ,  Masaya Nogi ,  Kentarou Abe ,  Shinsuke Ifuku ,  Takashi Kurihara

Inventor： Hiroyuki Yano ,  Masaya Nogi ,  Kentarou Abe ,  Shinsuke Ifuku ,  Takashi Kurihara

IPC: B32B17/06

CPC classification number: B32B27/38 ,  B32B17/067 ,  B32B27/06 ,  B32B27/20 ,  B32B27/308 ,  B32B2262/062 ,  B32B2307/54 ,  B32B2307/702 ,  B32B2307/7242 ,  B32B2457/00 ,  H05K1/0393 ,  H05K2201/0175 ,  H05K2201/0284 ,  Y10T428/24975

Abstract: A flexible substrate 1 of the present invention is formed of a thin glass sheet 10 having a thickness of 50 μm or less and a composite material sheet 20 having a thickness of 100 μm or less which are laminated together, the composite material sheet 20 being formed of a composite material of an aggregation of cellulose nanofiber and amorphous synthetic resin.

Abstract translation: 本发明的柔性基板1由厚度为50μm以下的薄玻璃板10和层叠在一起的厚度为100μm以下的复合材料片20形成，复合材料片20形成 的纤维素纳米纤维和无定形合成树脂的聚集体的复合材料。

公开(公告)号：US20090063755A1

公开(公告)日：2009-03-05

申请号：US12138880

申请日：2008-06-13

Applicant: Nei-chiung Perng ,  Chih-jung Lin

Inventor： Nei-chiung Perng ,  Chih-jung Lin

IPC: G06F12/00

CPC classification number: H05K3/284 ,  H05K1/189 ,  H05K2201/0284 ,  H05K2201/10159 ,  H05K2203/1311

Abstract: A paper-shaped non-volatile storage device includes a top paper layer, a bottom paper layer and a flexible printed circuit board packaged between the top paper layer and the bottom paper layer. The flexible printed circuit board comprises a data-transmitting interface, a non-volatile memory controller and at least one non-volatile memory disposed thereon. Therefore, the paper-shaped non-volatile storage device features as both of traditional paper and traditional non-volatile storage devices, such as instantly writing, manually binding, and outwardly visible content as provided by the traditional paper sheets, and digital information storage, repeatable editing and rapid search capability as provided by the traditional non-volatile storage devices.

Abstract translation: 纸状非易失性存储装置包括顶层纸层，底纸层和封装在顶纸层和底纸层之间的柔性印刷电路板。 柔性印刷电路板包括数据传输接口，非易失性存储器控制器和布置在其上的至少一个非易失性存储器。 因此，纸状非易失性存储装置既具有传统纸张和传统非易失性存储装置的特征，如传统纸张提供的即时写入，手动装订和向外可见的内容以及数字信息存储， 可重复编辑和快速搜索功能，由传统的非易失性存储设备提供。

公开(公告)号：US20080302562A1

公开(公告)日：2008-12-11

申请号：US12133550

申请日：2008-06-05

Applicant: Nobuo Kasagi

Inventor： Nobuo Kasagi

IPC: H05K1/03

CPC classification number: H05K1/0366 ,  H05K1/095 ,  H05K3/386 ,  H05K2201/0284

Abstract: A circuit is printed on a circuit board material, which does not have a copper foil layer and does have a paper base material is impregnated with a resin, using an electroconductive coating material. The board material preferably is a paper phenol board material, wherein the paper base material is impregnated with phenol resin, on which a resist layer is formed and a circuit is printed on the resist layer using an electroconductive coating material.

Abstract translation: 使用导电涂层材料将电路印刷在不具有铜箔层的电路板材料上，并且用基材浸渍树脂。 基板材料优选为纸酚醛树脂材料，其中纸基材料用酚醛树脂浸渍，在其上形成抗蚀剂层，并且使用导电涂料将电路印刷在抗蚀剂层上。

公开(公告)号：US06964749B2

公开(公告)日：2005-11-15

申请号：US10162027

申请日：2002-06-04

Applicant: Jerry Zucker ,  Nick Mark Carter

Inventor： Jerry Zucker ,  Nick Mark Carter

IPC: C08J5/04 ,  B29B15/12 ,  B29C70/12 ,  B29C70/16 ,  B29C70/36 ,  B29C70/50 ,  B32B5/24 ,  D04H1/46 ,  D04H1/48 ,  D04H3/10 ,  D04H5/02 ,  D04H13/00 ,  H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H05K3/00 ,  H05K3/10 ,  B32B27/04

CPC classification number: H05K1/0366 ,  B29C70/12 ,  B29C70/16 ,  B29C70/50 ,  B29L2031/3425 ,  D04H1/48 ,  D04H1/49 ,  D04H1/495 ,  D04H3/11 ,  D04H5/02 ,  D04H5/03 ,  H05K1/0254 ,  H05K1/0271 ,  H05K1/0272 ,  H05K1/0393 ,  H05K3/0052 ,  H05K3/107 ,  H05K2201/0129 ,  H05K2201/0278 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2201/09045 ,  H05K2201/09127 ,  H05K2201/2009 ,  H05K2201/2036 ,  H05K2203/065 ,  Y10T442/259 ,  Y10T442/689

Abstract: The present invention relates to a nonwoven substrate, and specifically to a nonwoven substrate imparted with a three-dimensional image, wherein the three-dimensional nonwoven substrate is particularly suited as a support substrate for a PCB (Printed Circuit Board) and similar application.By the utilization of a hydroentangled, three-dimensionally imaged support substrate impregnated with a durable resinous matrix, PCB's, and similar applications, can be imparted with unique and useful performance properties, to improve structural performance.

Abstract translation: 本发明涉及非织造基材，特别涉及赋予三维图像的非织造基材，其中三维非织造基材特别适用于PCB（印刷电路板）的支撑基板和类似应用。 通过利用浸渍有耐用的树脂基质，PCB和类似应用的水刺，三维成像的支撑基底，可以赋予独特且有用的性能特性，以改善结构性能。

公开(公告)号：US20050230486A1

公开(公告)日：2005-10-20

申请号：US11126314

申请日：2005-05-11

Applicant: Christophe Halope

Inventor： Christophe Halope

IPC: B42D15/10 ,  G06K19/07 ,  G06K19/077 ,  H05K1/03 ,  H05K1/16 ,  H05K1/18 ,  H05K3/20 ,  G06K19/06 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H05K3/207 ,  G06K19/07749 ,  H05K1/0313 ,  H05K1/165 ,  H05K1/185 ,  H05K1/187 ,  H05K2201/0129 ,  H05K2201/0284 ,  H05K2201/0376

Abstract: The invention thus concerns a method for manufacturing a radiofrequency identification device which includes the following steps: a manufacturing process for an antenna consisting in screen-printing turns of an electrically conductive polymer ink onto a transfer paper sheet, and then subjecting said support to heat treatment in order to bake and polymerize said conductive ink, connection of a chip 14, provided with contacts, to the antenna 12, lamination consisting in making the transfer paper sheet integral with a layer of plastic material 16 which constitutes the support for the antenna, by hot press molding, in such a way that the screen-printed antenna and the chip are both embedded within the layer of plastic material, and removal of the transfer paper sheet.

Abstract translation: 因此，本发明涉及一种制造射频识别装置的方法，其包括以下步骤：将导电聚合物油墨的丝网印刷匝组合到转印纸上的天线的制造过程，然后对所述载体进行热处理 为了烘烤和聚合所述导电油墨，将具有触点的芯片14与天线12的连接，包括将转印纸与构成天线支撑的塑料材料层16成一体的叠层，通过 热压成型，使得丝网印刷天线和芯片都嵌入在塑料材料层内，并且移除转印纸。

公开(公告)号：US06841225B2

公开(公告)日：2005-01-11

申请号：US10435183

申请日：2003-05-09

Applicant: Frank J. Bottari

Inventor： Frank J. Bottari

IPC: G06F3/033 ,  G06F3/045 ,  H05K3/20 ,  H05K3/28 ,  G09G5/00

CPC classification number: G06F3/045 ,  H05K3/207 ,  H05K3/28 ,  H05K2201/0284 ,  H05K2201/09436 ,  H05K2203/0531 ,  Y10S428/914 ,  Y10T29/49117 ,  Y10T428/24777 ,  Y10T428/24917

Abstract: A method of applying an edge electrode pattern to a touch screen panel including printing an edge electrode pattern on decal paper; applying a cover coat over the electrode pattern; removing the decal paper; and transferring the edge electrode pattern to a touch screen panel. A decal to be used in accordance with this method.

Abstract translation: 一种将边缘电极图案应用于触摸屏面板的方法，包括在贴纸上印刷边缘电极图案; 在电极图案上涂覆覆盖层; 去除贴纸; 并将边缘电极图案转移到触摸屏面板。 按照这种方法使用的贴花。

公开(公告)号：US20040040645A1

公开(公告)日：2004-03-04

申请号：US10435183

申请日：2003-05-09

Applicant: 3M Innovative Properties Company

Inventor： Frank J. Bottari

IPC: B44C001/165 ,  B32B003/00 ,  B32B031/00 ,  B32B015/00

CPC classification number: G06F3/045 ,  H05K3/207 ,  H05K3/28 ,  H05K2201/0284 ,  H05K2201/09436 ,  H05K2203/0531 ,  Y10S428/914 ,  Y10T29/49117 ,  Y10T428/24777 ,  Y10T428/24917

Abstract: A method of applying an edge electrode pattern to a touch screen panel including printing an edge electrode pattern on decal paper; applying a cover coat over the electrode pattern; removing the decal paper; and transferring the edge electrode pattern to a touch screen panel. A decal to be used in accordance with this method.

Abstract translation: 一种将边缘电极图案应用于触摸屏面板的方法，包括在贴纸上印刷边缘电极图案; 在电极图案上涂覆覆盖层; 去除贴纸; 并将边缘电极图案转移到触摸屏面板。 按照这种方法使用的贴花。

公开(公告)号：US20030153120A1

公开(公告)日：2003-08-14

申请号：US10333022

申请日：2003-01-15

Inventor： Christophe Halope

IPC: H01L021/44 ,  H01L021/48

CPC classification number: H05K3/207 ,  G06K19/07749 ,  H05K1/0313 ,  H05K1/165 ,  H05K1/185 ,  H05K1/187 ,  H05K2201/0129 ,  H05K2201/0284 ,  H05K2201/0376

Abstract: The invention concerns a manufacturing process for a contactless smart card (or ticket) which includes the following steps: a manufacturing process for an antenna consisting in screen-printing turns of an electrically conductive polymer ink onto a transfer paper sheet, and then subjecting said support to heat treatment in order to bake and polymerize said conductive ink, connection of a chip 14, provided with contacts, to the antenna 12, lamination consisting in making the transfer paper sheet integral with a layer of plastic material 16 which constitutes the support for the antenna, by hot press molding, in such a way that the screen-printed antenna and the chip are both embedded within the layer of plastic material, removal of the transfer paper sheet, and lamination of the card body onto the antenna support by welding at least one layer of plastic material (18, 20) by hot press molding on each side of the support.

Abstract translation: 本发明涉及一种用于非接触式智能卡（或机票）的制造过程，其包括以下步骤：用于将导电聚合物油墨的丝网印刷匝组合到转印纸上的天线的制造过程，然后对所述支撑体 为了烘烤和聚合所述导电油墨，将设置有触点的芯片14连接到天线12上，层叠包括将转印纸与一层塑料材料16成一体，该塑料材料层构成用于 天线，通过热压成型，使得丝网印刷天线和芯片都嵌入在塑料材料层内，去除转印纸，以及通过焊接将卡体贴合到天线支架上 至少一层塑料材料（18,20）通过热压成型在支撑体的每一侧上。

公开(公告)号：US20030008590A1

公开(公告)日：2003-01-09

申请号：US10162027

申请日：2002-06-04

Applicant: Polymer Group, Inc.

Inventor： Jerry Zucker ,  Nick Mark Carter

IPC: B32B005/02 ,  B32B027/04 ,  B32B027/12 ,  D04H001/46 ,  D04H003/10 ,  D04H005/02

CPC classification number: H05K1/0366 ,  B29C70/12 ,  B29C70/16 ,  B29C70/50 ,  B29L2031/3425 ,  D04H1/48 ,  D04H1/49 ,  D04H1/495 ,  D04H3/11 ,  D04H5/02 ,  D04H5/03 ,  H05K1/0254 ,  H05K1/0271 ,  H05K1/0272 ,  H05K1/0393 ,  H05K3/0052 ,  H05K3/107 ,  H05K2201/0129 ,  H05K2201/0278 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2201/09045 ,  H05K2201/09127 ,  H05K2201/2009 ,  H05K2201/2036 ,  H05K2203/065 ,  Y10T442/259 ,  Y10T442/689

Abstract: The present invention relates to a nonwoven substrate, and specifically to a nonwoven substrate imparted with a three-dimensional image, wherein the three-dimensional nonwoven substrate is particularly suited as a support substrate for a PCB (Printed Circuit Board) and similar application. By the utilization of a hydroentangled, three-dimensionally imaged support substrate impregnated with a durable resinous matrix, PCB's, and similar applications, can be imparted with unique and useful performance properties, to improve structural performance.

Abstract translation: 本发明涉及非织造基材，特别涉及赋予三维图像的非织造基材，其中三维非织造基材特别适用于PCB（印刷电路板）的支撑基板和类似应用。 通过利用浸渍有耐用的树脂基质，PCB和类似应用的水刺，三维成像的支撑基底，可以赋予独特且有用的性能特性，以改善结构性能。

公开(公告)号：US20020182398A1

公开(公告)日：2002-12-05

申请号：US10157489

申请日：2002-05-28

Applicant: SONY CORPORATION

Inventor： Yoshinari Matsuda ,  Tomohide Koguchi

IPC: B32B003/26

CPC classification number: H05K3/4069 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K1/0366 ,  H05K1/116 ,  H05K2201/0284 ,  H05K2201/09063 ,  H05K2201/09381 ,  H05K2201/0969 ,  H05K2203/1178 ,  H05K2203/1453 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/249953 ,  H01L2924/00

Abstract: The present invention is for providing a rigid-printed wiring board capable of preventing the burst or void phenomenon of a copper paste, and a production method of the rigid-printed wiring board. A rigid-printed wiring board comprising copper clad laminates with a paper phenol or a paper epoxy used as a base, wherein a through hole is provided in the vicinity of a via hole for filling the copper paste, is provided.

Abstract translation: 本发明提供一种能够防止铜膏的爆裂或空隙现象​​的刚性印刷线路板以及刚性印刷线路板的制造方法。 一种刚性印刷电路板，其特征在于，包括具有纸酚醛树脂或纸环氧树脂作为基材的覆铜层压板，其中在用于填充铜浆料的通路孔附近设置通孔。