公开(公告)号：US4774760A

公开(公告)日：1988-10-04

申请号：US110070

申请日：1987-10-09

Applicant: Ronald J. Seaman ,  Keith A. Vanderlee

Inventor： Ronald J. Seaman ,  Keith A. Vanderlee

IPC: H05K3/34

CPC classification number: H05K3/3421 ,  H05K3/3447 ,  H05K3/3478 ,  H05K2201/0305 ,  H05K2201/10424 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2203/0405 ,  Y02P70/613 ,  Y10T29/49144

Abstract: A solder preform and technique for making same is disclosed for use in a one time flux process for attaching electronic modules to printed circuit substrates via plated through holes or surface mount pads.

Abstract translation: 公开了一种焊料预制件及其制造技术，用于通过电镀通孔或表面安装焊盘将电子模块附着到印刷电路基板的一次焊剂工艺中。

公开(公告)号：US4736277A

公开(公告)日：1988-04-05

申请号：US99627

申请日：1987-09-22

Applicant: Vernon L. Brown

Inventor： Vernon L. Brown

IPC: H01M2/10 ,  H04B1/38 ,  H05K1/02 ,  H05K1/05 ,  H05K3/00 ,  H05K3/34 ,  H05K3/40 ,  H05K3/44 ,  H05K9/00

CPC classification number: H05K3/341 ,  H01M2/1022 ,  H04B1/3883 ,  H05K1/0215 ,  H05K3/4084 ,  H05K1/0237 ,  H05K1/05 ,  H05K2201/0305 ,  H05K2201/10969 ,  H05K3/0058 ,  H05K3/4038 ,  H05K3/44 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49155

Abstract: A unique housing (104) or a portable radio transceiver (100) is described that includes unique metal printed circuit panels providing for grounding and heat sinking of electrical components and circuitry thereon, and a battery as a structural element thereof. In one illustrated housing (104), three printed circuit panels (212, 213 and 214) and a stick battery (210) are held together by interlocking side rails (206,207). The unique printed circuit panels (212, 213, and 214) include mesas (422) that protrude through corresponding holes in the dielectric and circuitry layers (404 and 406) laminated on the panel. The mesas (422) are preferably soldered to the circuitry layer or electrical components thereon. The shape and size of the mesas (422) can be varied to provide the desired grounding and/or heat sinking. The unique metal printed circuit panel of the present invention may be advantageously utilized in a variety of applications including battery-operated radio transceivers, such as, for example, cellular radiotelephone systems and trunked radio systems.

Abstract translation: 描述了独特的外壳（104）或便携式无线电收发器（100），其包括提供用于其上的电气部件和电路的接地和散热的独特的金属印刷电路板，以及作为其结构元件的电池。 在一个所示的壳体（104）中，三个印刷电路板（212,213和214）和棒状电池（210）通过互锁的侧轨（206,207）保持在一起。 唯一的印刷电路板（212,213和214）包括突出通过层压在面板上的电介质层和电路层（404和406）中的相应孔的台面（422）。 台面（422）优选地焊接到其上的电路层或电气部件。 可以改变台面（422）的形状和尺寸以提供所需的接地和/或散热。 本发明的独特的金属印刷电路板可有利地用于各种应用，包括电池供电的无线电收发器，例如蜂窝无线电话系统和集群无线电系统。

公开(公告)号：US4487654A

公开(公告)日：1984-12-11

申请号：US546230

申请日：1983-10-27

Applicant: James A. Coppin

Inventor： James A. Coppin

IPC: B23K35/00 ,  H05K3/06 ,  H05K3/10 ,  H05K3/24 ,  H05K3/28 ,  H05K3/34 ,  H05K3/38 ,  H05K3/42 ,  C23F1/02 ,  B44C1/22 ,  C25D5/02 ,  C25D5/34

CPC classification number: B23K35/001 ,  H05K3/062 ,  H05K3/243 ,  H05K3/3473 ,  H05K3/384 ,  H05K2201/0305 ,  H05K2203/025 ,  H05K2203/0361 ,  H05K2203/043 ,  H05K2203/0574 ,  H05K3/108 ,  H05K3/28 ,  H05K3/426 ,  H05K3/427 ,  Y10T29/49165

Abstract: An improved method of manufacturing a printed wiring board having the characteristics of one with a solder mask over bare copper for circuit traces and ground planes. The method includes the step of electroplating a very thin coating of tin-lead over the circuit traces, ground planes, holes and circuit pads prior to selectively coating only the pads and holes with a relatively thick coating of tin-lead solder plate. After removing the plating resist which defines the areas for selective solder coating, the board is chemically etched and then mechanically scrubbed to roughen the surface of and reduce the thickness of the thin solder plate. A solder mask may be applied over circuit traces and ground planes prior to reflowing the thick coating of solder plate. Assembled printed wiring boards may then be wave soldered without wrinkling of the solder mask.

Abstract translation: 一种改进的制造印刷电路板的方法，其具有在裸铜上具有用于电路迹线和接地平面的焊料掩模的特性的印刷电路板。 该方法包括在用相对厚的锡铅焊料涂层选择性地仅涂覆焊盘和孔之前，在电路迹线，接地平面，孔和电路板上电镀非常薄的锡铅的涂层的步骤。 在去除限定了用于选择性焊料涂覆的区域的电镀抗蚀剂之后，对板进行化学蚀刻，然后机械地洗涤以粗糙化表面并减小薄焊料板的厚度。 在回流焊锡板的厚涂层之前，可以在电路迹线和接地平面上施加焊接掩模。 然后组装的印刷线路板可以波纹焊接而不会使焊料掩模起皱。

公开(公告)号：US4435611A

公开(公告)日：1984-03-06

申请号：US452611

申请日：1982-12-23

Applicant: Kenji Ohsawa ,  Takao Ito ,  Shimetomo Fueki ,  Masayuki Osawa ,  Keiji Kurata

Inventor： Kenji Ohsawa ,  Takao Ito ,  Shimetomo Fueki ,  Masayuki Osawa ,  Keiji Kurata

IPC: H05K1/09 ,  B23K35/26 ,  C22C28/00 ,  H01B1/02 ,  H05K3/34 ,  H05K3/40

CPC classification number: H05K3/3484 ,  B23K35/26 ,  C22C28/00 ,  H05K3/4038 ,  H05K2201/0215 ,  H05K2201/0305

Abstract: A novel conductive paste is disclosed which is suitable for use to connect circuit patterns of a printed circuit board.The conductive paste comprises a melt of gallium and a metal element which forms an eutectic mixture with gallium, and metal powder which alloys with gallium uniformly dispersed in the melt. The content of the metal element and the metal powder are selected to control a solid content in the paste at a predetermined working temperature.

Abstract translation: 公开了一种适用于连接印刷电路板的电路图案的新型导电浆料。 导电浆料包括镓的熔体和与镓形成共晶混合物的金属元素，以及与镓的合金均匀分散在熔体中的金属粉末。 选择金属元素和金属粉末的含量以在预定的工作温度下控制糊料中的固体含量。

公开(公告)号：US4327247A

公开(公告)日：1982-04-27

申请号：US95323

申请日：1979-11-19

Applicant: Kazuyuki Mituhashi ,  Kunio Matumoto ,  Haruo Shirai ,  Yoshikatu Tanaka

Inventor： Kazuyuki Mituhashi ,  Kunio Matumoto ,  Haruo Shirai ,  Yoshikatu Tanaka

IPC: H05K1/00 ,  H05K3/00 ,  H05K3/28 ,  H05K3/40 ,  H05K3/42 ,  H05K1/14

CPC classification number: H05K3/0064 ,  H05K3/0094 ,  H05K3/281 ,  H05K1/0393 ,  H05K2201/0305 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2203/068 ,  H05K3/4038 ,  H05K3/428

Abstract: This invention relates to a printed wiring board having two electrically conductive circuit layers on an insulating laminate. The insulating laminate includes a first insulating layer having a thickness of 0.01 to 0.5 mm, and metal foils are provided on both sides of the first insulating layer. Metal foil circuit layers of predetermined patterns are formed by printing and etching the metal foils. Thereafter, through holes are formed in the first insulating layer across the facing metal foil circuit layers, and then electrically conductive members are applied over the through holes and the metal foil circuit layers at their ends. After that, a second insulating layer is attached onto one of the sides of the first insulating layer on which the connected metal foil circuit layers are provided.

Abstract translation: 本发明涉及一种在绝缘层压板上具有两个导电电路层的印刷线路板。 绝缘层叠体包括厚度为0.01〜0.5mm的第一绝缘层，在第一绝缘层的两侧设置有金属箔。 通过印刷和蚀刻金属箔形成预定图案的金属箔电路层。 此后，在面对的金属箔电路层之间的第一绝缘层中形成通孔，然后将导电构件施加在通孔和金属箔电路层的端部。 之后，将第二绝缘层附着在设置有连接的金属箔电路层的第一绝缘层的一侧上。

公开(公告)号：US4234373A

公开(公告)日：1980-11-18

申请号：US965976

申请日：1978-12-04

Applicant: Joseph A. Reavill ,  John M. Arachi

Inventor： Joseph A. Reavill ,  John M. Arachi

IPC: B23K1/08 ,  B30B1/00 ,  H02K3/26 ,  H05K1/00 ,  H05K3/02 ,  H05K3/06 ,  H05K3/46 ,  E06B7/16 ,  B29B5/04 ,  B30B5/02 ,  B32B31/00

CPC classification number: B29C43/3607 ,  B23K1/08 ,  B29C43/203 ,  B30B1/00 ,  B32B37/1018 ,  H02K3/26 ,  H05K3/02 ,  H05K3/4611 ,  H05K3/4635 ,  B29C2043/3644 ,  B29C2791/006 ,  B29C33/20 ,  B29L2009/00 ,  H05K1/0393 ,  H05K2201/0305 ,  H05K2203/0113 ,  H05K2203/068 ,  H05K3/067

Abstract: A vacuum laminating fixture includes a pair of opposed plates having opposed plane faces with a peripheral groove formed in each plate surrounding the face with the grooves matched for receiving a unitary band seal extending between the grooves for sealing the space between the faces of the plates, a vacuum port is formed in the lower plate communicating with the area of the face inside the peripheral groove. The method includes setting up a laminate of plural flexible sheets of circuit, placing the laminate within and between the faces of the plates, drawing a vacuum of 28 inches of mercury for a period of two minutes to completely evacuate the space between the laminate sheets, and thereafter applying a predetermined curing pressure and temperature to the plates within a press.

Abstract translation: 真空层压固定装置包括一对相对的板，其具有相对的平面，每个板围绕所述面形成有周边槽，所述槽围绕所述表面，所述槽匹配用于接收在所述槽之间延伸的一体带密封，用于密封所述板的表面之间的空间， 在与所述周边槽内的面的区域连通的下板形成有真空口。 该方法包括设置多个柔性电路板的层叠体，将层压板放置在板的表面之间，并在其表面之间，在28英寸汞柱的真空中浸泡两分钟，以完全排空层压片之间的空间， 然后在压机内向板上施加预定的固化压力和温度。

公开(公告)号：US4088545A

公开(公告)日：1978-05-09

申请号：US763873

申请日：1977-01-31

Applicant: Fred L. Supnet

Inventor： Fred L. Supnet

IPC: C25D5/02 ,  H05K3/06 ,  H05K3/10 ,  H05K3/24 ,  H05K3/28 ,  H05K3/42 ,  C25D5/54

CPC classification number: C25D5/02 ,  H05K3/242 ,  H05K3/243 ,  H05K3/427 ,  H05K2201/0305 ,  H05K2201/0352 ,  H05K2203/0571 ,  H05K2203/0723 ,  H05K2203/1572 ,  H05K2203/1581 ,  H05K3/061 ,  H05K3/062 ,  H05K3/108 ,  H05K3/28 ,  H05K3/428

Abstract: A method of fabricating mask-over-copper printed circuit boards from a laminated insulated board material having conductive metallic coatings on both sides thereof includes piercing a plurality of holes completely through the laminate, forming a desired circuit connection pattern of copper extending between selected holes on the laminate first side and electrically connecting the laminate first side connection pattern to the second side copper coating by depositing copper material through the holes. A solder mask is applied to the areas of the first side connection pattern which are to be protected from solder during subsequent fabrication steps and then a protective metallic material is electroplated to portions of the first side connection pattern not covered by the solder mask and to desired portions of a circuit connection pattern on the second side conductive metallic coating, and the portions of the laminate second side conductive metallic coating outside the second side connection pattern are then removed.

Abstract translation: 从其两侧具有导电金属涂层的层压绝缘板材料制造铜屏蔽铜印刷电路板的方法包括：穿过层叠体完全穿透多个孔，形成在所选择的孔之间延伸的期望的电路连接图案， 层压体第一侧，并通过沉积铜材料通过孔将层压体第一侧连接图案电连接到第二侧铜涂层。 在随后的制造步骤期间，将焊接掩模施加到待保护焊料的第一侧连接图案的区域，然后将保护金属材料电镀到未被焊接掩模覆盖的第一侧连接图案的部分，并且期望 然后去除第二侧导电金属涂层上的电路连接图案的部分，以及第二侧连接图案外部的层叠第二侧导电金属涂层的部分。

公开(公告)号：US4015328A

公开(公告)日：1977-04-05

申请号：US582735

申请日：1975-06-02

Applicant: Cletus G. McDonough

Inventor： Cletus G. McDonough

IPC: H05K1/11 ,  H01R4/06 ,  H01R12/58 ,  H01R12/61 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K3/46 ,  H05K1/04

CPC classification number: H05K3/363 ,  H01R12/523 ,  H01R4/06 ,  H05K3/4046 ,  H05K2201/0305 ,  H05K2201/041 ,  H05K2201/096 ,  H05K2201/10295 ,  H05K2201/10401 ,  H05K3/3447 ,  H05K3/3457 ,  H05K3/4038 ,  H05K3/4611 ,  Y10T29/49126 ,  Y10T29/49142

Abstract: A method of making a multilayered circuit assembly from a plurality of flat, flexible circuit elements, wherein each circuit element includes a substrate having conductive means to define an electrical path of travel which is formed between a base layer made of insulation material and a cover layer made of insulation material. Each circuit element has a connecting station associated with the conductive means. The method generally includes the steps of forming the conductive means on the base layer of each circuit element, punching a first opening through the conductive means and base layer at a connecting station of each circuit element, soldering the connecting station of each circuit element so that a solid solder pad fills the first opening whereby the solder electrically contacts the conductive means, punching a second opening through the cover layer of each circuit element, securing the cover layer of each circuit element over the base layer and conductive means so that the first opening is generally concentric with the second opening, punching a third opening in each circuit element through the solder pad, stacking a plurality of punched and soldered circuit elements on top of one another so that the third openings are generally concentric, inserting a terminal into the third openings of the stacked circuit elements so that a portion thereof contacts the solder, and staking the terminal so that the other surface thereof forms a cold weld interference fit against the solder.

Abstract translation: 一种从多个平面柔性电路元件制造多层电路组件的方法，其中每个电路元件包括具有导电装置的基板，该基板具有限定形成在由绝缘材料制成的基底层和覆盖层之间的行进电路径 由绝缘材料制成。 每个电路元件具有与导电装置相关联的连接站。 该方法通常包括以下步骤：在每个电路元件的基底层上形成导电装置，在每个电路元件的连接站处冲压通过导电装置和基底层的第一开口，焊接每个电路元件的连接站，使得 固体焊盘填充第一开口，由此焊料与导电装置电接触，冲穿通过每个电路元件的覆盖层的第二开口，将每个电路元件的覆盖层固定在基底层和导电装置上，使得第一开口 通常与第二开口同心，通过焊盘冲压每个电路元件中的第三开口，将多个冲压和焊接的电路元件堆叠在一起，使得第三开口大致同心，将端子插入第三开口 堆叠电路元件的开口，使得其一部分接触焊料，并铆接端子 使得其另一个表面形成与焊料的冷焊缝干涉配合。

公开(公告)号：US3991347A

公开(公告)日：1976-11-09

申请号：US545939

申请日：1975-01-31

Applicant: Robert David Hollyday

Inventor： Robert David Hollyday

IPC: H05K1/02 ,  H05K3/34 ,  H05K3/40 ,  H05K1/04

CPC classification number: H05K3/341 ,  H05K1/0243 ,  H05K3/3415 ,  H05K2201/0305 ,  H05K2201/0715 ,  H05K2201/09336 ,  H05K2201/09572 ,  H05K2201/1006 ,  H05K2201/10659 ,  H05K2201/10969 ,  H05K2203/0455 ,  H05K3/3447 ,  H05K3/3468 ,  H05K3/4038 ,  Y02P70/613

Abstract: A method of one step soldering of the outer diameter of a filter sleeve to a printed circuit board while soldering the leads thereto simultaneously as well as the completed filter assembly. The method comprises provided a printed circuit board having an electrically conductive coating on at least the upper surface with a portion of the conductor removed in the regions where leads from the filter to be positioned on the top surface of the printed circuit board are to extend through the printed circuit board for soldering. The printed circuit board includes apertures extending entirely therethrough, not only for the leads from the components positioned on the surface thereof, but also beneath filter sleeves positioned on the printed circuit board. The apertures in the printed circuit board are preferably coated with an electrically conductive material to provide better adherence for the solder during the soldering operation. In the event a conductive ground plane is to be utilized on the upper and lower surfaces of the printed circuit board, it is essential that the apertures beneath the filter sleeves be plated through.

Abstract translation: 将过滤器套筒的外径一步焊接到印刷电路板，同时将引线同时焊接到完整的过滤器组件上的方法。 该方法包括提供一种印刷电路板，其至少在上表面上具有导电涂层，其中一部分导体在位于印刷电路板的顶表面上的来自过滤器的引线延伸穿过的区域中被去除 用于焊接的印刷电路板。 印刷电路板包括完全贯穿其中的孔，不仅用于来自定位在其表面上的部件的引线，而且位于布置在印刷电路板上的过滤器套筒下方。 印刷电路板中的孔优选地涂覆有导电材料，以在焊接操作期间为焊料提供更好的附着性。 在印刷电路板的上表面和下表面上要使用导电接地平面的情况下，过滤器套筒下方的孔口必须通过电镀。

公开(公告)号：US3977075A

公开(公告)日：1976-08-31

申请号：US587767

申请日：1975-06-17

Applicant: James Edward Lynch ,  Kenneth Ronald Parmer ,  Robert Franklin Cobaugh

Inventor： James Edward Lynch ,  Kenneth Ronald Parmer ,  Robert Franklin Cobaugh

IPC: H01R4/02 ,  H05K3/40 ,  H05K3/46 ,  H05K1/04 ,  H05K1/14 ,  H05K3/36

CPC classification number: H01R12/585 ,  H01R4/028 ,  H05K3/4623 ,  H05K2201/0305 ,  H05K2201/09118 ,  H05K3/4038 ,  Y10T29/49126 ,  Y10T29/49151 ,  Y10T29/49165

Abstract: According to one aspect of the disclosure, a planar substrate receives a plurality of conductive posts therein, which posts include an offset medial portion having a laterally projecting notch portion. Certain posts are arranged with their notch portions in coplanar relationship and in latching registration with an interior sidewall portion of a housing received over the posts. Accordingly, the housing provides an insulating receptacle shroud for the posts and is latchingly retained in place without a need for attachment to the substrate. The shroud is also provided with card guides connected thereto by integral hinge portions enabling alignment of, and reducing twisting and warping of, the card guides. The card guides are additionally coupled together with rails further reducing twisting and warping of the guides. The terminals are advantageously mounted in strip form for ease in manufacture and assembly to the substrate.According to another aspect of the disclosure, a plurality of discrete electrically conductive posts are initially connected on selected center spacings to a common carrier strip without interconnecting portions between adjacent posts. A portion of the carrier strip is severed to separate a selected number of posts, which are inserted in a substrate. The carrier strip maintains the posts in alignment and in their desired center spacings. After the posts are secured to the substrate by reflow of a solder band provided on each post, the carrier strip is removed, allowing a connector housing to be slipped over the posts. The posts will interlock with the connector housing and positively anchor it to the substrate. In another embodiment, the connector housing is placed in registration on the substrate and the selected posts are then inserted simultaneously in the connector housing and in the substrate. When the solder bands of the posts are reflowed, the posts thus become secured to the substrate and simultaneously anchor the connector housing in positive location on the substrate. As in all the embodiments, the carrier strip connected to the posts is removed after solder reflowing.The disclosure further relates to a printed circuit board having mounted thereon a plurality of electrically conducting post-type contacts, enclosed by a removable electrically insulating housing latchably secured to a selected contact, and to a multi-layer printed circuit board and a method of fabrication thereof.

Abstract translation: 根据本公开的一个方面，平面基板在其中容纳多个导电柱，所述支柱包括具有横向突出的切口部分的偏移中间部分。 一些柱被布置成具有共同关系的切口部分并且与容纳在柱上的壳体的内侧壁部分锁定配准。 因此，壳体为柱提供绝缘的容器护罩，并且闩锁地保持在适当的位置，而不需要附接到衬底。 护罩还设置有通过整体铰链部分连接到其上的卡导向件，从而能够对准卡导向件的扭转和翘曲。 卡引导件另外用轨道连接在一起，进一步减少了引导件的扭曲和翘曲。 端子有利地以条形形式安装，以便于制造和组装到基板。