公开(公告)号：US20170308133A1

公开(公告)日：2017-10-26

申请号：US15637718

申请日：2017-06-29

Applicant: BEYOND BLADES LTD.

Inventor： AVIV SOFFER

IPC: G06F1/18 ,  G06F1/20 ,  H05K1/18 ,  H05K1/02 ,  F28D15/02 ,  H05K7/20

CPC classification number: G06F1/18 ,  F28D15/0266 ,  F28D15/0275 ,  G06F1/20 ,  G06F2200/1635 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/19105 ,  H05K1/0284 ,  H05K1/185 ,  H05K7/205 ,  H05K2201/041 ,  H01L2924/00

Abstract: A stackable layer is provided for 3-Dimensional multi-layered modular computers. The stackable layer comprises at least one encapsulated chip die. Sets of electrical contacts are provided on each one of the large surfaces of the layer. The encapsulated chip die and the two large opposite surfaces of the layer are substantially parallel.

公开(公告)号：US09699885B2

公开(公告)日：2017-07-04

申请号：US14870741

申请日：2015-09-30

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Tae Hong Min ,  Myung Sam Kang ,  Young Gwan Ko ,  Min Jae Seong

IPC: H05K1/00 ,  H05K1/02 ,  H05K3/46 ,  H05K1/18 ,  H05K1/14

CPC classification number: H05K1/0206 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/2518 ,  H01L2924/15311 ,  H05K1/0207 ,  H05K1/023 ,  H05K1/141 ,  H05K1/185 ,  H05K3/4608 ,  H05K2201/041

Abstract: Disclosed herein is a circuit board. According to an exemplary embodiment of the present disclosure, a circuit board has a structure in which at least a portion of a first heat transfer structure in which a metal layer and an insulating layer are alternately stacked is inserted into an insulating part.

公开(公告)号：US09622391B2

公开(公告)日：2017-04-11

申请号：US14882168

申请日：2015-10-13

Applicant: LG ELECTRONICS INC.

Inventor： Joseph Lee ,  Byungsoo Kim

IPC: H05K7/20 ,  H05K5/00 ,  H05K1/14 ,  G02F1/1345 ,  H04B1/3888

CPC classification number: H05K7/20963 ,  G02F1/13452 ,  G06F1/203 ,  H04B1/3888 ,  H05K1/148 ,  H05K5/0017 ,  H05K2201/041 ,  H05K2201/05 ,  H05K2201/10128

Abstract: There is disclosed a mobile terminal including a display unit comprising a drive IC provided in a predetermined portion, a frame provided in a rear surface of the display unit, a flexible printed circuit board having one portion connected to the drive IC of the display unit and the other portion bent toward the rear surface of the display unit, a main board coupled to the frame and configured to control the drive IC via the flexible printed circuit board, and a heat transfer sheet configured to cover a front surface of the display unit and a predetermined portion of the first surface of the flexible printed circuit board, wherein at least predetermined portion of the heat transfer sheet is in contact with the frame, so that the heat generated in the drive IC and the light source of the display unit may be transferred to the frame and that the performance deterioration of the mobile terminal caused by the local overheat may be reduced and the difficulty in the user's holding the mobile terminal may be also reduced.

公开(公告)号：US09596769B2

公开(公告)日：2017-03-14

申请号：US14620015

申请日：2015-02-11

Applicant: MPI CORPORATION

Inventor： Wei-Cheng Ku ,  Jun-Liang Lai ,  Chih-Hao Ho

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/42 ,  H05K1/03

CPC classification number: H05K1/0216 ,  H05K1/0298 ,  H05K1/0393 ,  H05K1/111 ,  H05K1/113 ,  H05K1/114 ,  H05K1/18 ,  H05K3/421 ,  H05K3/426 ,  H05K3/429 ,  H05K2201/041 ,  H05K2201/09545 ,  H05K2203/0369 ,  H05K2203/1461

Abstract: A multilayer circuit board includes a first substrate and a second substrate in stack. The first substrate is provided with a first pad, a second pad, and a first sub-circuit. The first pad and the second pad are electrically connected to the first sub-circuit. The second substrate has a top surface, a bottom surface, and an opening. The bottom surface of the second substrate is attached to the top surface of the first substrate. The opening extends from the top surface to the bottom surface of the second substrate. The first pad of the first substrate is in the opening of the second substrate; the second pad of the first substrate is not covered by the second substrate. The second substrate further provided with a pad on the top surface and a second sub-circuit electrically connected to the pad of the second substrate.

Abstract translation: 多层电路板包括第一衬底和堆叠中的第二衬底。 第一基板设置有第一焊盘，第二焊盘和第一子电路。 第一焊盘和第二焊盘电连接到第一子电路。 第二基板具有顶表面，底表面和开口。 第二基板的底表面附接到第一基板的顶表面。 开口从第二基板的顶表面延伸到底表面。 第一基板的第一焊盘在第二基板的开口中; 第一衬底的第二衬垫不被第二衬底覆盖。 第二基板还在顶表面上设置有焊盘，并且电连接到第二基板的焊盘的第二子电路。

公开(公告)号：US20170064829A1

公开(公告)日：2017-03-02

申请号：US15207721

申请日：2016-07-12

Applicant: FUJI XEROX CO., LTD.

Inventor： Shigemi OHTSU

IPC: H05K1/14 ,  H05K1/11 ,  H05K1/09 ,  H05K1/02 ,  H01R4/02 ,  H01R12/52

CPC classification number: H05K1/144 ,  H01R4/04 ,  H01R12/62 ,  H05K1/0298 ,  H05K1/092 ,  H05K1/117 ,  H05K1/118 ,  H05K1/147 ,  H05K3/323 ,  H05K3/363 ,  H05K3/368 ,  H05K2201/0215 ,  H05K2201/041 ,  H05K2201/05

Abstract: A conductor connecting structure includes a mounting board, a target board, and an anisotropic conductive material. The mounting board includes a base material including a first surface, a second surface, and an end surface. The mounting board also includes a first conductor layer and a second conductor layer. The target board includes a mounting surface and a third conductor layer formed on the mounting surface. The anisotropic conductive material includes a polymeric material and electrically conductive particles dispersed in the polymeric material. The electrically conductive particles, when heated, aggregate to connect an end portion of the first or second conductor layer to the third conductor layer. One of the end portions not subjected to connection established with the anisotropic conductive material is separated further from the end surface of the base material than another end portion which is connected to the third conductor layer.

Abstract translation: 导体连接结构包括安装板，目标板和各向异性导电材料。 安装板包括基材，其包括第一表面，第二表面和端表面。 安装板还包括第一导体层和第二导体层。 目标板包括安装表面和形成在安装表面上的第三导体层。 各向异性导电材料包括分散在聚合材料中的聚合材料和导电颗粒。 导电颗粒在加热时被聚集以将第一或第二导体层的端部连接到第三导体层。 与各向异性导电材料建立连接的端部中的一个端部与连接到第三导体层的另一个端部相比，从基材的端面进一步分离。

公开(公告)号：US20170064828A1

公开(公告)日：2017-03-02

申请号：US15207676

申请日：2016-07-12

Applicant: FUJI XEROX CO., LTD.

Inventor： Shigemi OHTSU

IPC: H05K1/14 ,  H05K1/11 ,  H05K1/09

CPC classification number: H05K1/144 ,  H05K1/095 ,  H05K1/117 ,  H05K1/118 ,  H05K3/323 ,  H05K3/363 ,  H05K2201/041 ,  H05K2201/05 ,  H05K2201/058 ,  H05K2201/0715 ,  H05K2201/09781 ,  H05K2203/0425

Abstract: A conductor connecting structure includes a mounting board, a target board, and an anisotropic conductive material. The mounting board includes a base material that includes first and second surfaces. The mounting board also includes a conductor layer formed on the first or second surface and a first dummy conductor layer formed at a corner of the second surface. The target board includes a mounting surface, a conductor layer, and a second dummy conductor layer. The anisotropic conductive material includes a polymeric material and electrically conductive particles dispersed in the polymeric material. The electrically conductive particles, when heated, aggregate so as to connect an end portion of the conductor layer of the mounting board and the conductor layer of the target board to each other and connect the first and second dummy conductor layers to each other.

Abstract translation: 导体连接结构包括安装板，目标板和各向异性导电材料。 安装板包括包括第一和第二表面的基材。 安装板还包括形成在第一或第二表面上的导体层和形成在第二表面的角部的第一虚设导体层。 目标板包括安装表面，导体层和第二虚设导体层。 各向异性导电材料包括分散在聚合材料中的聚合材料和导电颗粒。 导电粒子加热时聚集，将安装基板的导体层的端部与目标板的导体层相互连接，将第一和第二虚设导体层相互连接。

公开(公告)号：US20170018540A1

公开(公告)日：2017-01-19

申请号：US15075824

申请日：2016-03-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Hyun LIM ,  Jong In RYU ,  Sung Ho KIM ,  Jin Su KIM

IPC: H01L25/16 ,  H01L23/31 ,  H01L25/00 ,  H01L21/78 ,  H01L23/00 ,  H01L23/498 ,  H01L21/56

CPC classification number: H01L25/16 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01R23/68 ,  H01R23/6886 ,  H05K1/14 ,  H05K1/141 ,  H05K1/144 ,  H05K1/145 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/043 ,  H05K2201/049 ,  H01L2924/014 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/45099

Abstract: In one general aspect, an electronic device module includes a first board, a first device mounted on a first surface of the first board, a second board disposed below the first board, and a plurality of second devices disposed between the first board and the second board, wherein a surface of each second device the plurality of second devices is bonded to a second surface of the first board and another surface of each of the second devices is bonded to the second board.

Abstract translation: 在一个一般方面，电子设备模块包括第一板，安装在第一板的第一表面上的第一装置，设置在第一板下方的第二板，以及设置在第一板和第二板之间的多个第二装置 其中，所述多个第二装置的表面结合到所述第一板的第二表面，并且所述第二装置中的每一个的另一表面结合到所述第二板。

公开(公告)号：US20160351506A1

公开(公告)日：2016-12-01

申请号：US15117373

申请日：2015-01-28

Applicant: LG INNOTEK CO., LTD.

Inventor： Dong Sun KIM ,  Sung Wuk RYU ,  Ji Haeng LEE

IPC: H01L23/538 ,  H01L25/00 ,  H01L21/48 ,  H01L25/10

CPC classification number: H01L23/5389 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/16237 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H05K3/3463 ,  H05K3/4007 ,  H05K2201/0338 ,  H05K2201/041 ,  H01L2224/32225 ,  H01L2924/00012 ,  H01L2224/45099

Abstract: The printed circuit board, according to one embodiment, comprises: an insulation substrate; a pad formed on at least one side of the insulation substrate; a protection layer which is formed on the insulation substrate and exposes an upper surface of the pad; and a bump formed on the pad exposed by the protection layer, wherein the bump comprises a plurality of solder layers having melting points different from each other.

Abstract translation: 根据一个实施例的印刷电路板包括：绝缘基板; 衬垫，形成在所述绝缘衬底的至少一侧上; 保护层，其形成在所述绝缘基板上并暴露所述焊盘的上表面; 以及形成在由保护层暴露的焊盘上的凸块，其中所述凸块包括具有彼此不同的熔点的多个焊料层。

公开(公告)号：US20160317115A1

公开(公告)日：2016-11-03

申请号：US14699488

申请日：2015-04-29

Applicant: Analogic Corporation

Inventor： Peter Daniel Shippen

IPC: A61B6/00 ,  A61B6/03 ,  H05K1/14

CPC classification number: A61B6/56 ,  A61B6/035 ,  H05K1/142 ,  H05K3/368 ,  H05K2201/041 ,  H05K2201/09018

Abstract: A computed tomography (CT) imaging modality includes a stator and a rotor that rotates relative to the stator. The CT imaging modality includes a radiation source and a detector array for detecting at least some of the radiation. A first data communication component is coupled to the stator or the rotor for transmitting data between the stator and the rotor. The first data communication component includes a first circuit board assembly including a first conductive layer and a first dielectric layer and a second circuit board assembly including a second conductive layer and a second dielectric layer. The second conductive layer of the second circuit board assembly faces the first conductive layer of the first circuit board assembly. An insulating layer is disposed between the first conductive layer of the first circuit board assembly and the second conductive layer of the second circuit board assembly.

Abstract translation: 计算机断层摄影（CT）成像模式包括定子和相对于定子旋转的转子。 CT成像模式包括用于检测至少一些辐射的辐射源和检测器阵列。 第一数据通信部件耦合到定子或转子，用于在定子和转子之间传输数据。 第一数据通信部件包括包括第一导电层和第一介电层的第一电路板组件和包括第二导电层和第二介电层的第二电路板组件。 第二电路板组件的第二导电层面对第一电路板组件的第一导电层。 绝缘层设置在第一电路板组件的第一导电层和第二电路板组件的第二导电层之间。

公开(公告)号：US09485865B2

公开(公告)日：2016-11-01

申请号：US14220683

申请日：2014-03-20

Applicant: KABUSHIKI KAISHA TOYOTA JIDOSHOKKI

Inventor： Naoki Higashikawa ,  Kazuyoshi Kontani

IPC: H05K1/14 ,  H05K1/02 ,  H05K7/14

CPC classification number: H05K1/144 ,  H05K1/0203 ,  H05K7/142 ,  H05K2201/041

Abstract: A substrate spacing member includes a spacer portion which is disposed between the two substrates in contact with both edge portions thereof to keep a distance between the two substrates constant, spacer member holding portions which hold the spacer members, a frame body portion that connects the spacer member holding portions to each other, a branch portion which extends toward a predetermined position between the two substrates from the frame body portion or the spacer member holding portions, and electrode holding portions which are provided at the branch portions, and hold electrodes at the predetermined positions.

Abstract translation: 基板间隔部件包括间隔部分，该间隔部分设置在与其两个边缘部分接触的两个基板之间以保持两个基板之间的距离恒定，间隔部件保持部分保持间隔部件;框架主体部分，其连接间隔件 构件保持部分，从框架主体部分或间隔件保持部分朝向两个基板之间的预定位置延伸的分支部分，以及设置在分支部分处的电极保持部分，以及预定的保持电极 职位